公开(公告)号：US20120079314A1

公开(公告)日：2012-03-29

申请号：US12891309

申请日：2010-09-27

申请人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

发明人： Vinod Kamath ,  Jason A. Matteson ,  Gregory J. McKnight ,  Mark E. Steinke

IPC分类号： G06F11/07

CPC分类号： G06F11/0793 ,  G06F11/073

摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.

摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。

公开(公告)号：US20110232889A1

公开(公告)日：2011-09-29

申请号：US12729859

申请日：2010-03-23

申请人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

发明人： Eric A. Eckberg ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  William M. Megarity ,  Mark E. Steinke

IPC分类号： F28F27/00 ,  F28D15/00

CPC分类号： F28D1/0435 ,  F28D1/0477 ,  H05K7/2079

摘要： Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

摘要翻译： 本发明的实施例包括冷却系统和方法，用于通过在独立控制的流量和温度条件下将液体冷却剂循环通过架式热交换器的不同部分来冷却计算机机架。 在根据一个实施例的方法中，第一液体冷却剂被供应到空气对液体热交换器的第一部分。 第二液体冷却剂以与第一液体冷却剂不同的温度供应到空气至液体热交换器的第二部分。 气流通过机架安装的计算机部件产生到空气 - 液体热交换器的第一和第二部分。 独立地控制第一和第二液体冷却剂的流量，以实施目标冷却参数。 第一和第二翅片管部分的独立操作允许增加使用未冷却的水而不牺牲散热目的。

公开(公告)号：US07961475B2

公开(公告)日：2011-06-14

申请号：US12256618

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Robert E. Simons

IPC分类号： H05K1/00 ,  H05K7/20 ,  H05K5/00 ,  H01R13/40 ,  H02B1/01 ,  F28F7/00 ,  F25D23/12

CPC分类号： H05K7/20772 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.

摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。

公开(公告)号：US20110134606A1

公开(公告)日：2011-06-09

申请号：US12632843

申请日：2009-12-08

申请人： Pat Gallarelli ,  David J. Jensen ,  Vinod Kamath ,  Brian M. Kerrigan

发明人： Pat Gallarelli ,  David J. Jensen ,  Vinod Kamath ,  Brian M. Kerrigan

IPC分类号： G06F1/20

CPC分类号： H05K7/1007 ,  H01L23/32 ,  H01L23/4006 ,  H01L23/48 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01079 ,  H01L2924/14

摘要： A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

摘要翻译： 一种低调的计算机处理器保持装置，该计算机处理器包括处理器基板和安装在处理器基板上的散热器。 保持装置包括保持壳体。 保持壳体成形为适合于插座周围。 保持装置还包括负载框架。 负载框架可操作地联接到保持壳体并且被配置为将计算机处理器保持在主板的插座中，该负载框架与处理器基板之间具有直接接触。 加载框架有一个切口。 保持装置还包括耦合到保持壳体并被配置为将散热器紧固到保持壳体并被构造成通过负载框架的切口将散热器耦合到散热器的散热器紧固构件。

公开(公告)号：US07957148B1

公开(公告)日：2011-06-07

申请号：US12632843

申请日：2009-12-08

申请人： Pat Gallarelli ,  David J. Jensen ,  Vinod Kamath ,  Brian M. Kerrigan

发明人： Pat Gallarelli ,  David J. Jensen ,  Vinod Kamath ,  Brian M. Kerrigan

IPC分类号： H05K7/20

CPC分类号： H05K7/1007 ,  H01L23/32 ,  H01L23/4006 ,  H01L23/48 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01079 ,  H01L2924/14

摘要： A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

摘要翻译： 一种低调的计算机处理器保持装置，该计算机处理器包括处理器基板和安装在处理器基板上的散热器。 保持装置包括保持壳体。 保持壳体成形为适合于插座周围。 保持装置还包括负载框架。 负载框架可操作地联接到保持壳体并且被配置为将计算机处理器保持在主板的插座中，该负载框架与处理器基板之间具有直接接触。 加载框架有一个切口。 保持装置还包括耦合到保持壳体并被配置为将散热器紧固到保持壳体并被构造成通过负载框架的切口将散热器耦合到散热器的散热器紧固构件。

公开(公告)号：US20110108237A1

公开(公告)日：2011-05-12

申请号：US12613938

申请日：2009-11-06

申请人： Vinod Kamath ,  Jason A. Matteson ,  Aparna Vallury

发明人： Vinod Kamath ,  Jason A. Matteson ,  Aparna Vallury

IPC分类号： F28F13/00 ,  B21D53/02

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F3/02 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.

摘要翻译： 一个实施例提供具有柔性基座和高度调节的散热片的散热器。 柔性基座包括单个基板，其中冷却翅片和热管直接固定在单个基板的上表面上。 使用单个底板允许冷却翅片的长度增加。 使用单个基板还允许基座在使用紧固件安装在基板的外部区域时弯曲到电路板。 基座的弯曲使散热器偏压发热部件。 该挠曲件还使外部冷却翅片移位，并且进一步增加外部冷却翅片的长度以补偿预期的位移。

公开(公告)号：US07836314B2

公开(公告)日：2010-11-16

申请号：US11506876

申请日：2006-08-21

申请人： Trieu C. Chieu ,  Hoi Y. Chan ,  Vinod Kamath ,  Lawrence S. Mok

发明人： Trieu C. Chieu ,  Hoi Y. Chan ,  Vinod Kamath ,  Lawrence S. Mok

IPC分类号： G06F1/00

CPC分类号： G06F1/206 ,  H05K7/20836

摘要： A method, system and computer readable medium for maximizing the performance of a computer system that includes at least one computing unit. Temperature and location data for each computing unit is received by a server unit and the location of each computing unit within a given environment is reevaluated and revised to maximize the overall performance of the computer system.

摘要翻译： 一种用于使包括至少一个计算单元的计算机系统的性能最大化的方法，系统和计算机可读介质。 每个计算单元的温度和位置数据由服务器单元接收，并且重新评估和修改给定环境内的每个计算单元的位置以使计算机系统的整体性能最大化。

公开(公告)号：US20090116190A1

公开(公告)日：2009-05-07

申请号：US11936104

申请日：2007-11-07

申请人： Troy W. Glover ,  Michael S. June ,  Vinod Kamath ,  Whitcomb R. Scott, III

发明人： Troy W. Glover ,  Michael S. June ,  Vinod Kamath ,  Whitcomb R. Scott, III

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/20

摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

摘要翻译： 配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

公开(公告)号：US07342797B2

公开(公告)日：2008-03-11

申请号：US11746322

申请日：2007-05-09

申请人： Vinod Kamath ,  Beth F. Loebach

发明人： Vinod Kamath ,  Beth F. Loebach

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

公开(公告)号：US07289331B2

公开(公告)日：2007-10-30

申请号：US11093445

申请日：2005-03-30

申请人： Jimmy Grant Foster, Sr. ,  Michael Sean June ,  Vinod Kamath ,  Beth Frayne Loebach ,  Albert Vincent Makley ,  Jason Aaron Matteson

发明人： Jimmy Grant Foster, Sr. ,  Michael Sean June ,  Vinod Kamath ,  Beth Frayne Loebach ,  Albert Vincent Makley ,  Jason Aaron Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

摘要翻译： 用于常规存储器模块（例如DIMM）的h9接收器设备，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。