公开(公告)号：US07919357B2

公开(公告)日：2011-04-05

申请号：US12489895

申请日：2009-06-23

申请人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

发明人： Susumu Sawada ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06515 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/11015 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/14515 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/8314 ,  H01L2224/83855 ,  H01L2224/83886 ,  H01L2224/83951 ,  H01L2224/9201 ,  H01L2224/9212 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/323 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1147 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

摘要： A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent.

摘要翻译： 在第一基板和第二基板之间提供含有导电粒子和气泡生成剂的树脂，然后将树脂加热，从树脂中包含的气泡生成剂产生气泡，使树脂自组装 电极之间。 然后，进一步加热树脂以熔化包含在树脂中的导电颗粒，从而在电极之间形成连接器。 在树脂的周边部附近设置密封基板之间的间隔的分隔部件，树脂中的气泡通过不存在分隔部件的树脂的周边部排出到外部。

公开(公告)号：US07905011B2

公开(公告)日：2011-03-15

申请号：US12280907

申请日：2007-02-22

申请人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

发明人： Yasushi Taniguchi ,  Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Matsuoka ,  Masayoshi Koyama

IPC分类号： H01R9/00 ,  B23P19/00

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0776 ,  H05K2203/087 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T29/53204 ,  H01L2924/00

摘要： In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线基板31的电极32上形成凸块19的方法中，将含有导电粒子16和气泡生成剂的流体14供给到布线基板31上的包含电极32的第一区域17上。然后， 40具有与第一区域17具有相同面积并形成在具有比第一区域17的面积大的面积的基板40的主表面18上的突出表面13，使得突出表面13面向 然后，流体14被加热，从包含在流体14中的气泡发生剂产生气泡30。

公开(公告)号：US07638883B2

公开(公告)日：2009-12-29

申请号：US12149317

申请日：2008-04-30

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

摘要翻译： 提供一种适用于下一代LSI的倒装芯片安装以及高生产率和可靠性以及凸块形成方法的倒装芯片安装方法。 在包含焊料粉末16和气泡生成剂的树脂14被供给到具有多个连接端子11的电路板21和具有多个电极端子12的半导体芯片20之间的空间的情况下，加热树脂14 从包含在树脂14中的气泡发生剂产生气泡30.树脂14通过其生长被推向产生的气泡30的外部，并且在连接端子11和电极端子12之间自组装。 通过进一步加热树脂14并熔化包含在树脂14中的自组装在端子之间的焊料粉末16，在端子之间形成连接器22以完成倒装芯片安装体。

公开(公告)号：US20090133901A1

公开(公告)日：2009-05-28

申请号：US12064131

申请日：2005-08-11

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H05K1/00 ,  B05D5/12 ,  B05D3/06

CPC分类号： H01L21/4846 ,  H01L2224/11 ,  H05K3/04 ,  H05K3/101 ,  H05K3/102 ,  H05K3/3484 ,  H05K2203/0108 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  Y10T29/49155 ,  Y10T156/1744

摘要： [Summary][Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for solving problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.

摘要翻译： 发明内容提供一种能够以简单的方式以低成本形成精细图案的导电图案形成方法。 解决问题的方案在其表面上具有凸形图案的平板被设置为与基板相对，包括导电颗粒和气泡发生剂的流体被供应到基板和平板之间的间隙中， 此后，流体体被加热，从包含在流体中的气泡发生剂产生气泡。 当气泡发生剂产生的气泡生长时，液体被迫离开气泡，从而由于界面力而在平板上形成的凸形图案与基板之间自组装， 包含在具有自组装的流体中的导电颗粒被制成形成在基板上的导电图案。

公开(公告)号：US20080284046A1

公开(公告)日：2008-11-20

申请号：US12149317

申请日：2008-04-30

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L23/488 ,  B23K13/08

CPC分类号： H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

摘要翻译： 提供一种适用于下一代LSI的倒装芯片安装以及高生产率和可靠性以及凸块形成方法的倒装芯片安装方法。 在包含焊料粉末16和气泡生成剂的树脂14被供给到具有多个连接端子11的电路板21和具有多个电极端子12的半导体芯片20之间的空间的情况下，加热树脂14 从包含在树脂14中的气泡发生剂产生气泡30.树脂14通过其生长被推向产生的气泡30的外部，并且在连接端子11和电极端子12之间自组装。 通过进一步加热树脂14并熔化包含在树脂14中的自组装在端子之间的焊料粉末16，在端子之间形成连接器22以完成倒装芯片安装体。

公开(公告)号：US20060091524A1

公开(公告)日：2006-05-04

申请号：US11262758

申请日：2005-11-01

申请人： Seiji Karashima ,  Yoshihisa Yamashita ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Satoru Tomekawa

发明人： Seiji Karashima ,  Yoshihisa Yamashita ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Satoru Tomekawa

IPC分类号： H01L23/12

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/03438 ,  H01L2224/0344 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module, comprising: a semiconductor element having a principal face on which an element electrode is formed; and a film member comprising an insulating resin layer having a front face and a rear face which is opposite to said front face, and a wiring pattern formed on the rear face of said layer, wherein said semiconductor element is superposed on said film member so that the principal face of said semiconductor element is in contact with the front face of the insulating resin layer of said film member; and a part of the wiring pattern of said film member extends through said insulating resin layer, so that said part is in contact with the element electrode of said semiconductor element.

摘要翻译： 一种半导体模块，包括：具有形成元件电极的主面的半导体元件; 以及膜构件，其包括具有与所述正面相对的正面和背面的绝缘树脂层和形成在所述层的背面上的布线图案，其中所述半导体元件叠置在所述膜构件上，使得 所述半导体元件的主面与所述膜构件的绝缘树脂层的前表面接触; 并且所述膜部件的布线图形的一部分延伸穿过所述绝缘树脂层，使得所述部分与所述半导体元件的元件电极接触。

公开(公告)号：US20070262470A1

公开(公告)日：2007-11-15

申请号：US11577346

申请日：2005-09-20

申请人： Takashi Ichiryu ,  Yoshihisa Yamashita ,  Seiichi Nakatani

发明人： Takashi Ichiryu ,  Yoshihisa Yamashita ,  Seiichi Nakatani

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L25/00

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/181 ,  H05K1/186 ,  H05K3/4614 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： The present invention provides a module with a built-in semiconductor that can suppress a reduction in yield caused by a crack or failure of a semiconductor device in the process of mounting a thin semiconductor device on a wiring board and a method for manufacturing the module. In the module with a built-in semiconductor, a semiconductor device (107) is contained in an interlayer connection member (105) located between a first wiring board (101) and a second wiring board (103). The back side of the semiconductor device (107) is die-bonded to the first wiring board (101) via an adhesive (108), and the semiconductor device (107) is connected electrically to the second wiring pattern (104) via a protruding electrode (109).

摘要翻译： 本发明提供了一种具有内置半导体的模块，其能够抑制在将薄半导体器件安装在布线板上的过程中半导体器件的裂纹或故障引起的产量降低以及用于制造模块的方法。 在具有内置半导体的模块中，半导体器件（107）包含在位于第一布线板（101）和第二布线板（103）之间的层间连接部件（105）中。 半导体器件（107）的背面通过粘合剂（108）与第一布线板（101）进行裸片接合，半导体器件（107）经由突出部 电极（109）。

公开(公告)号：US20080210458A1

公开(公告)日：2008-09-04

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/03

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate comprises: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US07773386B2

公开(公告)日：2010-08-10

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/00

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US08343822B2

公开(公告)日：2013-01-01

申请号：US12681445

申请日：2009-07-30

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

IPC分类号： H01L21/84 ,  H01L21/00

CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

摘要翻译： 一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层 绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作 （v）中的电极的构成材料。 金属箔不需要剥离，可以使用高温工艺。