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公开(公告)号：US20130073096A1
公开(公告)日：2013-03-21
申请号：US13234563
申请日：2011-09-16
申请人： Thomas M. Brey , Vinod Kamath , Jason A. Matteson
发明人： Thomas M. Brey , Vinod Kamath , Jason A. Matteson
CPC分类号： G05B13/02 , G05D23/1917 , G06F1/206 , G06F2200/201 , H05K7/20836 , Y02D10/16
摘要： A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.
摘要翻译： 流体冷却的计算机系统包括多个发热部件和冷却系统，该冷却系统构造成以受控的冷却流体流速供应冷却流体以冷却发热部件。 基于温度的冷却控制电路包括温度传感器，其被配置为感测发热部件的温度和控制逻辑，用于响应于超过温度阈值的温度来增加冷却流体流量。 基于功率的冷却控制电路被配置为识别和量化目标时间间隔上的增加的功耗趋势，并且在电子设备的温度不超过温度阈值的时段期间，将冷却流体流量增加到 响应于超过功率阈值的增加的功率消耗趋势的幅度。 在一个选择中，流体冷却的计算机系统是服务器，并且发热组件包括处理器。
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公开(公告)号：US08102651B2
公开(公告)日：2012-01-24
申请号：US12572301
申请日：2009-10-02
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater. The result is an overall savings of power, since cooling requirements no longer dictate the installation of additional memory modules per channel in order to share and distribute the thermal load.
摘要翻译： 提供通过包括存储器模块的上游列和存储器模块的下游列的底盘的气流的方法和装置。 气流被分为从上游塔的上游端延伸到下游塔的下游端的第一和第二分开的气流。 第一气流引导与可操作地安装在上游塔中的单个存储器模块接触，并且避免与下游塔中的任何存储器模块接触。 引导第二气流流以避免与上游塔中的任何存储器模块接触并与可操作地安装在下游塔中的单个存储器模块接触。 即使在这样的存储器模块上的热负载较大，改进的冷却也能够每通道扩展使用单个存储器模块。 结果是总体上节省了电力，因为冷却要求不再要求每个通道安装额外的内存模块，以便共享和分配热负载。
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73.发明授权Apparatus and method for facilitating immersion-cooling of an electronic subsystem 有权用于促进电子子系统的浸入冷却的装置和方法公开(公告)号：US07961475B2
公开(公告)日：2011-06-14
申请号：US12256618
申请日：2008-10-23
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Robert E. Simons
CPC分类号： H05K7/20772 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.
摘要翻译： 提供了一种装置和方法，用于促进具有要浸没冷却的多种不同类型组件的电子子系统的浸入式冷却。 该装置包括一个容纳电子子系统的容器，以及一个设置在容器壁上的气密密封电连接器。 电连接器的尺寸和构造被设计成当电子子系统可操作地插入容器中时接收电子子系统的电气和网络连接器，并且便于外部电气和网络耦合到子系统。 该装置还包括联接到容器的冷却剂入口和出口，用于促进冷却剂通过容器的进入和流出。 当电子子系统可操作地插入容器并且冷却剂流过容器时，电子子系统被冷却剂浸没冷却。
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公开(公告)号：US20110134606A1
公开(公告)日：2011-06-09
申请号：US12632843
申请日：2009-12-08
IPC分类号： G06F1/20
CPC分类号： H05K7/1007 , H01L23/32 , H01L23/4006 , H01L23/48 , H01L24/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01005 , H01L2924/01079 , H01L2924/14
摘要： A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.
摘要翻译： 一种低调的计算机处理器保持装置，该计算机处理器包括处理器基板和安装在处理器基板上的散热器。 保持装置包括保持壳体。 保持壳体成形为适合于插座周围。 保持装置还包括负载框架。 负载框架可操作地联接到保持壳体并且被配置为将计算机处理器保持在主板的插座中，该负载框架与处理器基板之间具有直接接触。 加载框架有一个切口。 保持装置还包括耦合到保持壳体并被配置为将散热器紧固到保持壳体并被构造成通过负载框架的切口将散热器耦合到散热器的散热器紧固构件。
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公开(公告)号：US07957148B1
公开(公告)日：2011-06-07
申请号：US12632843
申请日：2009-12-08
IPC分类号： H05K7/20
CPC分类号： H05K7/1007 , H01L23/32 , H01L23/4006 , H01L23/48 , H01L24/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01005 , H01L2924/01079 , H01L2924/14
摘要： A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.
摘要翻译： 一种低调的计算机处理器保持装置，该计算机处理器包括处理器基板和安装在处理器基板上的散热器。 保持装置包括保持壳体。 保持壳体成形为适合于插座周围。 保持装置还包括负载框架。 负载框架可操作地联接到保持壳体并且被配置为将计算机处理器保持在主板的插座中，该负载框架与处理器基板之间具有直接接触。 加载框架有一个切口。 保持装置还包括耦合到保持壳体并被配置为将散热器紧固到保持壳体并被构造成通过负载框架的切口将散热器耦合到散热器的散热器紧固构件。
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公开(公告)号：US20110108237A1
公开(公告)日：2011-05-12
申请号：US12613938
申请日：2009-11-06
申请人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
发明人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
CPC分类号： H01L23/427 , F28D15/0266 , F28F3/02 , H01L23/4006 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.
摘要翻译： 一个实施例提供具有柔性基座和高度调节的散热片的散热器。 柔性基座包括单个基板，其中冷却翅片和热管直接固定在单个基板的上表面上。 使用单个底板允许冷却翅片的长度增加。 使用单个基板还允许基座在使用紧固件安装在基板的外部区域时弯曲到电路板。 基座的弯曲使散热器偏压发热部件。 该挠曲件还使外部冷却翅片移位，并且进一步增加外部冷却翅片的长度以补偿预期的位移。
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公开(公告)号：US07836314B2
公开(公告)日：2010-11-16
申请号：US11506876
申请日：2006-08-21
申请人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
发明人： Trieu C. Chieu , Hoi Y. Chan , Vinod Kamath , Lawrence S. Mok
IPC分类号： G06F1/00
CPC分类号： G06F1/206 , H05K7/20836
摘要： A method, system and computer readable medium for maximizing the performance of a computer system that includes at least one computing unit. Temperature and location data for each computing unit is received by a server unit and the location of each computing unit within a given environment is reevaluated and revised to maximize the overall performance of the computer system.
摘要翻译： 一种用于使包括至少一个计算单元的计算机系统的性能最大化的方法，系统和计算机可读介质。 每个计算单元的温度和位置数据由服务器单元接收，并且重新评估和修改给定环境内的每个计算单元的位置以使计算机系统的整体性能最大化。
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公开(公告)号：US20090116190A1
公开(公告)日：2009-05-07
申请号：US11936104
申请日：2007-11-07
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/20
摘要： Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要翻译： 配置用于受控气流的计算机机箱，包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分，从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕，包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件，用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流，包括将组件板插入计算机机箱; 移位分段帘幕的一段，从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。
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公开(公告)号：US07342797B2
公开(公告)日：2008-03-11
申请号：US11746322
申请日：2007-05-09
申请人： Vinod Kamath , Beth F. Loebach
发明人： Vinod Kamath , Beth F. Loebach
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/184 , G06F1/185 , G06F1/186 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
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公开(公告)号：US07289331B2
公开(公告)日：2007-10-30
申请号：US11093445
申请日：2005-03-30
申请人： Jimmy Grant Foster, Sr. , Michael Sean June , Vinod Kamath , Beth Frayne Loebach , Albert Vincent Makley , Jason Aaron Matteson
发明人： Jimmy Grant Foster, Sr. , Michael Sean June , Vinod Kamath , Beth Frayne Loebach , Albert Vincent Makley , Jason Aaron Matteson
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , G06F1/184 , G06F1/185 , G06F1/186 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
摘要翻译： 用于常规存储器模块（例如DIMM）的h9接收器设备，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。
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