摘要:
In one example embodiment, a speed circuit path includes inverter chains that are controllable to operate in a slower, low sub-threshold leakage current mode or a faster, higher sub-threshold leakage current mode depending on an operating mode of the semiconductor device. A non-speed circuit path includes inverter chains that operate to reduce sub-threshold leakage current regardless of an operating mode of the semiconductor device.
摘要:
A temperature detecting circuit is provided. The temperature detecting circuit includes a reference and detection voltage generator for generating a reference voltage corresponding to a first and a second reference current, and changing first to M-th (M being a natural number) detection currents based on first to M-th temperature detection codes to generate first to M-th detection voltages corresponding to the changed first to M-th detection currents and the second reference current; a temperature detection signal generator for comparing each of the first to M-th detection voltages with the reference voltage to generate first to M-th temperature detection signals; and a temperature detection controller for detecting an operation temperature of a semiconductor device while changing the first to M-th temperature detection codes in response to the first to M-th temperature detection signals from the temperature detection signal generator.
摘要:
Disclosed are a method for forming a silicon thin-film on a substrate, and more particularly a method for forming a polycrystalline silicon thin-film of good quality on a flexible metal substrate. A metal substrate (110) is prepared and a surface of the metal substrate (110) is flattened. An insulation film (120) formed on the metal substrate (110). An amorphous silicon layer (130) is formed on the insulation film (120). A metal layer (140) is formed on the amorphous silicon layer (130). A sample on the metal substrate (110) is heated and crystallized.
摘要:
In one example embodiment, a speed circuit path includes inverter chains that are controllable to operate in a slower, low sub-threshold leakage current mode or a faster, higher sub-threshold leakage current mode depending on an operating mode of the semiconductor device. A non-speed circuit path includes inverter chains that operate to reduce sub-threshold leakage current regardless of an operating mode of the semiconductor device.
摘要:
A wafer burn-in test circuit of a semiconductor memory device having a plurality of memory cells arranged in a row/column matrix, is provided, including: a sub word line driver connected to first and second word line groups each connected to true cells and complement cells forming the memory cells, and responding to a predecoded low address; and first and second power lines respectively supplying power to the corresponding first and second power line groups by a switching operation of the sub word line driver, wherein a ground power source is applied to the first and second power lines during a normal operation, and the ground power source and a step-up power source are alternately applied to the first and second power lines during a wafer burn-in test operation.
摘要:
A sense amplifier control circuit for controlling the voltage applied to a sense amplifier and a memory cell by setting the voltage as a given level (in this case, 4 V) is provided. The sense amplifier control circuit being inputted by the voltage applied to the sense amplifier and the memory cell thereto and generating the output voltage to the gate of the sense amplifier driver includes a comparator for operating whenever the voltage applied to the sense amplifier and memory cell is varied, a level shift circuit for converting an internal power voltage into an external power voltage, a trigger circuit, a driver control circuit and a bias circuit for constantly maintaining the current flowing into the driving element of the driver control circuit. Therefore, the voltage applied to the sense amplifier and memory cell come to have an appropriate rising slope, and after reached to the given level, the control circuit controls the level to be continuously maintained. Consequently, the wrong operation of a chip and the power noise is reduced, to thus improve the reliability of a semiconductor memory device.
摘要:
A stacked memory chip includes a chip input-output pad unit, a first semiconductor die and a second semiconductor die. The chip input-output pad unit includes a chip command-address pad unit, a lower chip data pad unit and an upper chip data pad unit that are to be connected to an external device. The first semiconductor die electrically is connected to the chip command-address pad unit and the lower chip data pad unit and electrically disconnected from the upper chip data pad unit. The second semiconductor die electrically is connected to the chip command-address pad unit and the upper chip data pad unit and electrically disconnected from the lower chip data pad unit. The input-output load may be reduced by selectively connecting each of the stacked semiconductor dies to one of the lower chip data pad unit and the upper chip data pad unit.
摘要:
An organic light-emitting display apparatus includes a thin film transistor on a display region of a substrate, the thin film transistor facing an encapsulation member, an organic light-emitting device on the display region that includes an intermediate layer having an organic emission layer, a sealing member that is between the substrate and the encapsulation member and that surrounds the display region, an internal circuit unit between the display region and the sealing member, a passivation layer that extends to cover the internal circuit unit, a pixel defining layer on the passivation layer, and a getter between the substrate and the encapsulation member, and the getter at least partially overlapping the internal circuit unit.
摘要:
An organic light emitting diode display comprises: a substrate; an active layer formed with a semiconductor material on the substrate; a first insulation layer formed on the semiconductor layer; a pixel electrode formed on the first insulation layer and generated by alternately stacking a plurality of pixel metal layers and a plurality of pixel transparent conductive layers; a gate electrode formed on the first insulation layer and formed in a configuration different from that of the pixel electrode; a second insulation layer formed on the first insulation layer so as to cover the gate electrode with an insulation layer opening for revealing the pixel electrode; a source electrode and a drain electrode respectively formed on the second insulation layer and electrically connected to the active layer; an organic emission layer formed on the pixel electrode; and a common electrode formed on the organic emission layer.
摘要:
Provided are an organic light emitting display device and a method of manufacturing the same. The organic light emitting display device includes a thin-film transistor (TFT), which includes an active layer, a gate electrode, and source/drain electrodes; an organic electroluminescent device electrically connected to the TFT and includes a pixel electrode formed on the same layer as the gate electrode, an intermediate layer including an organic light emitting layer, and a counter electrode that are stacked in the order stated; and a capacitor, which includes a bottom electrode, which is formed on the same layer and of the same material as the active layer and is doped with an impurity; a top electrode formed on the same layer as the gate electrode; and a metal diffusion medium layer formed on the same layer as the source/drain electrodes and is connected to the bottom electrode.