Chip thermistors
    71.
    发明授权
    Chip thermistors 失效
    片式热敏电阻

    公开(公告)号:US06184772B2

    公开(公告)日:2001-02-06

    申请号:US09124194

    申请日:1998-07-28

    IPC分类号: H01C710

    摘要: A chip thermistor has a pair of outer electrodes opposite each other with a specified distance in between on one of the surfaces of a thermistor element and an inner electrode extending inside the thermistor element so as to overlap these outer electrodes in the direction perpendicular to the surface on which the outer electrodes are formed. An electrically insulating layer is preferably formed on the same surface as and between the pair of outer electrodes. Each of the outer electrodes may be formed with two or more layers, the outermost of the layers being of gold.

    摘要翻译: 片式热敏电阻在热敏电阻元件的一个表面和在热敏电阻元件内部延伸的内电极之间具有一定距离相对的一对外电极,以便在垂直于表面的方向上与这些外电极重叠 其上形成有外部电极。 电绝缘层优选形成在与一对外电极之间的相同表面上。 每个外部电极可以形成有两层或更多层,层的最外层是金。

    Trimmed surge resistors
    72.
    发明授权

    公开(公告)号:US5874887A

    公开(公告)日:1999-02-23

    申请号:US917972

    申请日:1997-08-27

    申请人: John P. Kosinski

    发明人: John P. Kosinski

    摘要: An electrical resistor having a resistance value and capable of withstanding high power surges, utilizing a thick film deposited on a substrate and trimmed with one or more cuts configured to maintain a level of current crowding while increasing the resistance value of the resistor. A surge resistor can be modified in a similar fashion.

    Abrading apparatus
    73.
    发明授权
    Abrading apparatus 失效
    装饰设备

    公开(公告)号:US3702042A

    公开(公告)日:1972-11-07

    申请号:US3702042D

    申请日:1970-11-25

    申请人: IBM

    IPC分类号: H01C17/245 B24C3/04

    CPC分类号: H01C17/245

    摘要: This patent discloses apparatus for altering the electrical characteristics of electrical and electronic components by trimming or abrading, the rate of abrading being variable and is responsive to changes in the electrical characteristics of the components during the abrading operation. Electrical components that have electrical characteristics that may be altered by the abrading apparatus include resistors, capacitors, inductors, semiconductive devices, and photocells. The apparatus includes electrical circuitry for both accurate control of the rate of abrasion and enabling production of electrical and electronic components to predetermined characteristics with unusually close manufacturing tolerances. The circuitry includes a highly sensitive Kelvin bridge at each abrading station, the circuitry being programmable for trim pretesting, control of the rate of abrading, and post-testing. The circuitry may also be programmed to abrade a discrete component to predetermined tolerances, and/or abrade one of a pair of components to a predetermined ratio of the electrical characteristic of one component to the electrical characteristic of the other of the pair. Additionally, the circuitry may be programmed to abrade one component in a connected closed loop of components to predetermined tolerances, for example ''''in circuit'''' abrading. The mechanical arrangement of the apparatus provides for sequentially abrading multiple electrical and electronic components which may be positioned on both the upper and lower surfaces of single insulating members such as ceramic substrates. The apparatus is fully mechanized for rapid processing of a high production product through sequential abrading stations and includes stations for rejecting out-of-tolerance components.

    摘要翻译: 该专利公开了通过修整或研磨来改变电气和电子部件的电气特性的装置,其研磨速率是可变的并且响应于在研磨操作期间部件的电特性的变化。 具有可由研磨装置改变的电特性的电气部件包括电阻器,电容器,电感器,半导体器件和光电池。