公开(公告)号：US08324979B2

公开(公告)日：2012-12-04

申请号：US12617482

申请日：2009-11-12

申请人： Shu-Ying Cho

发明人： Shu-Ying Cho

IPC分类号： H01P3/08

CPC分类号： H01P3/08 ,  H01L23/5225 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01P5/185 ,  Y10T29/49155 ,  H01L2924/00

摘要： A coupled microstrip line structure having tunable characteristic impedance and wavelength are provided. In accordance with one aspect of the invention, a coupled microstrip line structure comprises a first ground plane having a plurality of first conductive strips separated by a dielectric material, and a first dielectric layer over the first ground plane. The coupled microstrip line further comprises a first signal line over the first dielectric layer, wherein the first signal line is directly above the plurality of first conductive strips, and wherein the first signal line and the plurality of first conductive strips are non-parallel, and a second signal line over the first dielectric layer, wherein the second signal line is directly above the plurality of first conductive strips, and wherein the second signal line and the plurality of first conductive strips are non-parallel, and wherein the second signal line is substantially parallel to the first signal line.

摘要翻译： 提供具有可调谐特性阻抗和波长的耦合微带线结构。 根据本发明的一个方面，耦合的微带线结构包括具有由电介质材料隔开的多个第一导电条的第一接地平面以及在第一接地平面上的第一介电层。 耦合的微带线还包括在第一介电层上的第一信号线，其中第一信号线直接在多个第一导电条之上，并且其中第一信号线和多个第一导电条是不平行的，以及 在所述第一介电层上方的第二信号线，其中所述第二信号线直接在所述多个第一导电条上方，并且其中所述第二信号线和所述多个第一导电条不是平行的，并且其中所述第二信号线是 基本上平行于第一信号线。

公开(公告)号：US20120261799A1

公开(公告)日：2012-10-18

申请号：US13538121

申请日：2012-06-29

申请人： Satoshi SASAKI ,  Yasunari UMEMOTO ,  Yasuo OSONE ,  Tsutomu KOBORI ,  Chushiro KUSANO ,  Isao OHBU ,  Kenji SASAKI

发明人： Satoshi SASAKI ,  Yasunari UMEMOTO ,  Yasuo OSONE ,  Tsutomu KOBORI ,  Chushiro KUSANO ,  Isao OHBU ,  Kenji SASAKI

IPC分类号： H01L27/04

CPC分类号： H01L29/7304 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/042 ,  H01L27/0605 ,  H01L27/067 ,  H01L28/40 ,  H01L29/0808 ,  H01L29/7371 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099

摘要： A technology which allows a reduction in the thermal resistance of a semiconductor device used in a radio communication device, and the miniaturization thereof is provided. For example, the semiconductor device can include a plurality of unit transistors Q, transistor formation regions 3a, 3b, and 3e each having a first number (e.g., seven) of the unit transistors Q, and transistor formation regions 3c and 3d each having a second number (e.g., four) of the unit transistors Q. The transistor formation regions 3c and 3d are located between the transistor formation regions 3a, 3b, 3e, and 3f, and the first number is larger than the second number.

摘要翻译： 提供了允许降低无线电通信装置中使用的半导体装置的热阻的技术及其小型化。 例如，半导体器件可以包括多个单位晶体管Q，具有单位晶体管Q的第一数量（例如7个）的晶体管形成区域3a，3b和3e以及每个具有单位晶体管Q的晶体管形成区域3c和3d 晶体管形成区域3c和3d位于晶体管形成区域3a，3b，3e和3f之间，第一数量大于第二数量。

公开(公告)号：US08130513B2

公开(公告)日：2012-03-06

申请号：US12519861

申请日：2008-02-26

申请人： Kousuke Yasooka

发明人： Kousuke Yasooka

IPC分类号： H05K1/11

CPC分类号： H01L23/043 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01P1/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device.

摘要翻译： 射频封装包括射频器件，多层电介质基片和电磁屏蔽元件。 所述多层介质基板包括内部导体焊盘，连接到所述内部导体焊盘的第一信号通孔，外部导体焊盘，连接到所述外部导体焊盘的第二信号通孔以及连接到所述外部导体焊盘的内层信号线 在第一信号通孔和第二信号通孔之间。 内部导体焊盘包括前端开口线，其具有在射频设备中使用的射频信号的波长的基本上四分之一的长度。

公开(公告)号：US08049319B2

公开(公告)日：2011-11-01

申请号：US12604354

申请日：2009-10-22

申请人： In-Kwon Ju ,  In-Bok Yom ,  Ho-Jin Lee

发明人： In-Kwon Ju ,  In-Bok Yom ,  Ho-Jin Lee

IPC分类号： H01L23/02 ,  H01L23/053 ,  H01L23/12 ,  H01L23/34

CPC分类号： H01L23/66 ,  H01L23/552 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

摘要翻译： 该研究公开了一种超宽带系统级封装（SoP）。 SoP包括一个包装体; 安装在封装主体上的第一集成电路; 连接到第一集成电路的第一信号传输单元; 连接到第一信号传输单元并包括板条线和槽线的信号通路; 以及连接到信号通道的第二信号传输单元。 本研究的技术可以通过最小化在向外部电路传输信号的过程中发生的垂直转换期间出现的信号的不连续性来传输超宽带信号及其制造方法。

公开(公告)号：US07947908B2

公开(公告)日：2011-05-24

申请号：US11874930

申请日：2007-10-19

申请人： Shoichi Mizuno ,  Hiroaki Takeuchi ,  Shuji Nojima

发明人： Shoichi Mizuno ,  Hiroaki Takeuchi ,  Shuji Nojima

IPC分类号： H05K1/16

CPC分类号： H05K1/183 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19032 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/09727 ,  H05K2201/10969 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic device is provided. The electronic device includes: a circuit board having a surface on which a hollow is formed; an electronic component placed into the hollow; a pattern wiring which is formed on a bottom surface of the hollow and whose tip is provided at a position corresponding to a signal electrode of the electronic component; a signal wire connecting a tip of the pattern wiring and the signal electrode of the electronic component; two in-hollow ground patterns formed so as to sandwich the tip of the pattern wiring therebetween on the bottom surface of the hollow; and two or more ground wires that connect two ground electrodes provided on the electronic component so as to sandwich the signal electrode therebetween to the corresponding in-hollow ground patterns, respectively.

摘要翻译： 提供电子设备。 电子设备包括：具有形成有中空部的表面的电路板; 电子元件放置在空心中; 图案布线，其形成在所述中空部的底面上，其末端设置在与所述电子部件的信号电极对应的位置; 连接图案布线的尖端和电子部件的信号电极的信号线; 两个中空的接地图案形成为将中间的图案布线的末端夹在其间的中空部分的底面上; 以及两个或更多个接地线，其连接设置在电子部件上的两个接地电极，以将信号电极夹在其间，分别对应于中空接地图案。

公开(公告)号：US07855685B2

公开(公告)日：2010-12-21

申请号：US11904986

申请日：2007-09-28

申请人： Matthew R. Walsh ,  Deepukumar M. Nair ,  David W. Zimmerman ,  Benjamen E. Haffke ,  Scott D. Brandenburg ,  Charles I. Delheimer ,  Michael E. Miller ,  Bruce Wayne Butler

发明人： Matthew R. Walsh ,  Deepukumar M. Nair ,  David W. Zimmerman ,  Benjamen E. Haffke ,  Scott D. Brandenburg ,  Charles I. Delheimer ,  Michael E. Miller ,  Bruce Wayne Butler

IPC分类号： H01Q1/38

CPC分类号： H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

摘要： A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

摘要翻译： 微波通信封装构造在具有限定基板空腔的第一侧的导电基板上，天线装置安装在相对的第二侧上。 基板的第一侧的电介质基板覆盖基板空腔; 并且密封装置使绝缘基板和基板完全围绕底板腔体密封，从而密封空腔。 安装在基板腔内的基板表面上的电路包括一个或多个微带线，其将部件传送到一个或多个包括穿过基板的开口的波导; 并且波导在其相对端耦合到天线装置。

公开(公告)号：US20100237967A1

公开(公告)日：2010-09-23

申请号：US12681284

申请日：2008-07-29

申请人： Hiroaki Ueno ,  Hiroyuki Sakai ,  Tsuyoshi Tanaka ,  Daisuke Ueda

发明人： Hiroaki Ueno ,  Hiroyuki Sakai ,  Tsuyoshi Tanaka ,  Daisuke Ueda

IPC分类号： H01P3/08

CPC分类号： H01L21/02118 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/02186 ,  H01L21/312 ,  H01L23/5222 ,  H01L23/5223 ,  H01L23/66 ,  H01L28/40 ,  H01L2223/6627 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/003 ,  H01P3/081 ,  H01L2924/00

摘要： A circuit device includes a substrate 11, and a transmission line 10. The transmission line 10 includes a dielectric film 13 formed on the substrate 11, and a signal line formed on the dielectric film 13. The dielectric film 13 includes a nano-composite film in which particles of a first material are dispersed in a second material.

摘要翻译： 电路装置包括基板11和传输线10.传输线10包括形成在基板11上的电介质膜13和形成在电介质膜13上的信号线。电介质膜13包括纳米复合膜 其中第一材料的颗粒分散在第二材料中。

公开(公告)号：US20100231320A1

公开(公告)日：2010-09-16

申请号：US12720237

申请日：2010-03-09

申请人： Hirofumi Kawamura

发明人： Hirofumi Kawamura

IPC分类号： H03H7/38 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01Q21/0075 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01P1/047 ,  H01P5/08 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/09727 ,  H05K2201/10166 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

摘要翻译： 本文公开了一种半导体器件，包括：半导体电路元件，被配置为处理具有预定频率的电信号; 以及传输线，其被配置为经由导线连接到所述半导体电路元件并传输所述电信号。 在传输线中设置有相对于传输线方向具有对称形状的阻抗匹配图案。

公开(公告)号：US20100175979A1

公开(公告)日：2010-07-15

申请号：US12651470

申请日：2010-01-03

申请人： Grigory Simin ,  Michael Shur ,  Remigijus Gaska

发明人： Grigory Simin ,  Michael Shur ,  Remigijus Gaska

IPC分类号： H01G4/005

CPC分类号： H01L29/772 ,  H01H59/0009 ,  H01H2001/0078 ,  H01L23/66 ,  H01L27/0605 ,  H01L29/0692 ,  H01L29/2003 ,  H01L29/8605 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01P1/15 ,  H01L2924/00

摘要： A switch includes an input contact and an output contact to a conducting channel. At least one of the input and output contacts is capacitively coupled to the conducting channel. A control contact is located outside of a region between the input and output contacts, and can be used to adjust the switch between on and off operating states. The switch can be implemented as a radio frequency switch in a circuit.

摘要翻译： 开关包括输入触点和与导电通道的输出触点。 输入和输出触点中的至少一个电容耦合到导电沟道。 控制触点位于输入和输出触点之间的区域之外，可用于在开关状态之间调整开关。 该开关可以实现为电路中的射频开关。

公开(公告)号：US20100140758A1

公开(公告)日：2010-06-10

申请号：US12628324

申请日：2009-12-01

申请人： Mark Doherty ,  Michael McPartlin ,  Chun-Wen Paul Huang

发明人： Mark Doherty ,  Michael McPartlin ,  Chun-Wen Paul Huang

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/481 ,  H01L23/5225 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit is disclosed having through silicon vias spaced apart one from another and conductors, each coupled to one or more of the through silicon vias, the conductors in aggregate in use forming a segmented conductive plane maintained at a same potential and forming an electromagnetic shield.

摘要翻译： 公开了一种集成电路，其具有通过彼此间隔开的硅通孔和各自连接到一个或多个通孔硅导体的导体，在使用中的聚集体中的导体形成保持在相同电位的分段导电平面并形成电磁屏蔽 。