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公开(公告)号：US5181526A
公开(公告)日：1993-01-26
申请号：US688032
申请日：1991-04-19
申请人： Haruki Yamasaki
发明人： Haruki Yamasaki
IPC分类号： A61N1/05
CPC分类号： A61N1/05
摘要： Disclosed herein is an electrode for human heart pacemaker comprising an electrode substrate prepared by Pt or a Pt alloy, Ti or a Ti alloy and a mixture of platinum and a platinum group metal oxide coated thereon, the upper portion of the electrode being comprised of mesh or porous.Since the physical dimensions of the electrodes can be made smaller, the substantial surface area can be made larger and the catalytic performance can be elevated because of the coating on the electrode of the present invention. The electrode has remarkably low polarizability, a high response characteristic from a human heart, low electric consumption, smaller input impedanco and extremely high reliability.Also disclosed is an implantable mesh electrode comprising a Pt/Ti composite prepared by coating Ti with Pt.
摘要翻译： 本文公开了一种人心脏起搏器的电极，其包括由Pt或Pt合金，Ti或Ti合金制备的电极基底，以及涂覆在其上的铂和铂族金属氧化物的混合物，电极的上部由网状物 或多孔。 由于可以使电极的物理尺寸更小，所以由于本发明的电极上的涂层，可以使实质的表面积更大，并且可以提高催化性能。 电极具有非常低的极化率，来自人心脏的高响应特性，低电耗，较小的输入阻抗和极高的可靠性。 还公开了包括通过用Pt涂覆Ti制备的Pt / Ti复合材料的可植入网状电极。
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公开(公告)号：US20230113633A1
公开(公告)日：2023-04-13
申请号：US18081322
申请日：2022-12-14
发明人： Michimasa OKUBO , Kenji GOTO , Kunihiro TANAKA , Kojiro SHIRAISHI , Kunihiro SHIMA , Yuya KATO , Kenichi HAMADA , Eiichi HONDA , Emi TAKEGAWA
摘要： The present invention relates to a medical Au-Pt-Pd alloy including Au, Pt,Pd, and inevitable impurities. The Au-Pt-Pd alloy has an alloy compositioninside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at pointA1 (Au: 53 atom%, Pt: 4 atom%, and Pd: 43 atom%), point A2 (Au: 70 atom%,Pt: 4 atom%, and Pd: 26 atom%), point A3 (Au: 69.9 atom%, Pt: 30 atom%, and Pd: 0.1 atom%), and point A4 (Au: 49.9 atom%, Pt: 50 atom%, and Pd: 0.1 atom%) in a Au-Pt-Pd ternary state diagram. In a metal structure of the alloy, at least one of a Au-rich phase and a Pt-rich phase is distributed, and the total of the area ratio of the Au-rich phase and the area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less.
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公开(公告)号：US20220356557A1
公开(公告)日：2022-11-10
申请号：US17623511
申请日：2020-04-07
发明人： Takamichi Yamamoto , Masahiro Nishiura , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita , Tomoko Matsuda
摘要： Provided is an Fe—Pt—BN-based sputtering target that has a high relative density and that suppresses particle generation.
The Fe—Pt—BN-based sputtering target has, as a residue after dissolution in aqua regia measured by a procedure below, the particle size distribution in which D90 is 5.5 μm or less and a proportion of fine particles smaller than 1 μm is 35% or less. The procedure includes: (1) cutting out an about 4 mm-square sample piece from the sputtering target, followed by pulverizing to prepare a pulverized product; (2) classifying the pulverized product using sieves of 106 μm and 300 μm in opening size and collecting a powder that has passed through the 300 μm sieve and remained on the 106 μm sieve; (3) immersing the powder in aqua regia heated to 200° C. to prepare a residue-containing solution in which the powder has been dissolved; (4) filtering the residue-containing solution through a 5A filter paper specified in JIS P 3801 and drying a residue on the filter paper at 80° C. to prepare a residue powder; (5) dispersing the residue powder in water containing a surfactant to prepare a sample solution; and (6) setting the sample solution in a particle size analyzer and measuring the particle size distribution.-
公开(公告)号：US20220267892A1
公开(公告)日：2022-08-25
申请号：US17626394
申请日：2020-05-22
发明人： Masahiro Nishiura , Takamichi Yamamoto , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita
摘要： A problem of particle generation in an Fe-Pt-BN-based sputtering target having a high relative density is resolved by an approach different from conventional methods.
An Fe-Pt-BN-based sputtering target having a relative density of 90% or more and a Vickers hardness of 150 or less can reduce the number of particles generated during magnetron sputtering.-
公开(公告)号：US20220195611A1
公开(公告)日：2022-06-23
申请号：US17684972
申请日：2022-03-02
发明人： Yuhei YAMAUCHI , Daiji AMENOMORI , Kenji FUKUTA , Kiyotaka YOSHIE , Isao MATSUOKA , Tasuku ARIMOTO , Tetsuya UEDA , Junichi IMAI , Tomokazu SATOH
摘要： A problem of the present invention is to provide a solid polymer membrane electrode capable of obtaining electrolyzed hydrogen water in which an increase of the pH is suppressed and which has a sufficient dissolved-hydrogen amount. The present invention is concerned with a solid polymer membrane electrode for generating electrolyzed water, wherein the solid polymer membrane electrode includes a solid polymer membrane and catalyst layers containing a platinum group metal and provided on the back and front of the solid polymer membrane; and the solid polymer membrane is a hydrocarbon-based cation exchange membrane and has an ion exchange capacity per unit area of 0.002 mmol/cm2 or more and 0.030 mmol/cm2 or less.
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公开(公告)号：US11329405B2
公开(公告)日：2022-05-10
申请号：US16346820
申请日：2017-12-18
发明人： Hiroshi Matsuo , Ryoe Wada
摘要： Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 μm or more and 10 μm or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.
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公开(公告)号：US11268168B2
公开(公告)日：2022-03-08
申请号：US16641146
申请日：2018-08-09
发明人： Hideki Hosoda , Akira Umise , Kenji Goto
摘要： The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of −24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.
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公开(公告)号：US11168382B2
公开(公告)日：2021-11-09
申请号：US16067755
申请日：2017-01-17
摘要： A sliding contact material that is used for a constituent material, particularly a brush, of a motor. The sliding contact material includes: Pd in an amount of 20.0% by mass or more and 50.0% by mass or less; Ni and/or Co in an amount of 0.6% by mass or more and 3.0% by mass or less in terms of a total concentration; and Ag and inevitable impurities as a balance. Preferably, the sliding contact material further contains an additive element M including at least one of Sn and In, and the total concentration of the additive element M is 0.1% by mass or more and 3.0% by mass or less. When containing the additive element M, the sliding contact material has material structures in which composite dispersed particles containing an intermetallic compound of Pd and the additive element M are dispersed in an Ag alloy matrix, and the ratio (KPd/KM) of the content (% by mass) of Pd and the content (% by mass) of the additive element M in the composite dispersed particles is within a range of 2.4 or more and 3.6 or less.
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公开(公告)号：US11084837B2
公开(公告)日：2021-08-10
申请号：US16478417
申请日：2018-03-05
摘要： The present invention relates to a chemical deposition raw material for manufacturing an iridium thin film or an iridium compound thin film by a chemical deposition method, including an iridium complex in which cyclopropenyl or a derivative thereof and a carbonyl ligand are coordinated to iridium. The iridium complex that is applied in the present invention enables an iridium thin film to be manufactured even when a reducing gas such as hydrogen is applied. in which R1 to R3, which are substituents of the cyclopropenyl ligand, are each independently hydrogen, or a linear or branched alkyl group with a carbon number of 1 or more and 4 or less.
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公开(公告)号：US11053570B2
公开(公告)日：2021-07-06
申请号：US16469083
申请日：2017-12-04
发明人： Kiyohito Ishida , Toshihiro Omori , Yutaka Sato , Koichi Sakairi , Kunihiro Tanaka , Tatsuya Nakazawa
IPC分类号： C22C19/05
摘要： The present invention relates to a Ni-based heat-resistant alloy including Ir: 5.0 mass % or more and 50.0 mass % or less, Al: 1.0 mass % or more and 8.0 mass % or less, W: 5.0 mass % or more and 25.0 mass % or less, and balance Ni, having an L12-structured γ′ phase present in the matrix, and including at least one of Ru: 0.8 mass % or more and 5.0 mass % or less and Re: 0.8 mass % or more and 5.0 mass % or less. This Ni-based heat-resistant alloy has improved toughness over a conventional Ni-based heat-resistant alloy based on a Ni—Ir—Al—W-based alloy, and is also excellent in ambient-temperature strength.
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