摘要:
An integrated circuit structure includes an image sensor cell, which further includes a photo transistor configured to sense light and to generate a current from the light.
摘要:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer.
摘要:
An inductor-capacitor phase locked loop (LCPLL) includes an inductor-capacitor voltage controlled oscillator (LCVCO) that provides an output frequency. A calibration circuit includes two comparators and provides a coarse tune signal to the LCVCO. The two comparators respectively compare the loop filter signal with a first reference voltage and a second reference voltage that is higher than the first reference voltage to supply a first and second comparator output, respectively. The calibration circuit is capable of adjusting the coarse tune signal continuously in voltage values and adjusts the coarse tune signal based on the two comparator outputs. A loop filter provides a loop filter signal to the calibration circuit and a fine tune signal to the LCVCO. A coarse tune frequency range is greater than a fine tune frequency range.
摘要:
A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.
摘要:
A radio frequency amplifier circuit includes a substrate that is capable of receiving a substrate bias voltage. The source of a transistor is capable of receiving a source bias voltage. The drain of the transistor is capable of receiving a drain bias voltage. The gate of the transistor is located between the source and the drain. A radio frequency input signal is coupled to the gate. A substrate bias circuit provides the substrate bias voltage. The substrate bias voltage and the source bias voltage forward bias the first diode formed by the source and the substrate. The substrate bias voltage and the drain bias voltage reverse bias the second diode formed by the drain and the substrate.
摘要:
An ESD protection circuit includes a signal pad, a short circuited shunt stub on-chip with and coupled to the signal pad, an open circuited shunt stub on-chip and coupled to the signal pad.
摘要:
A method of forming a semiconductor device is provided. The method includes forming a first fin above a substrate, forming a first emitter region in a first portion of the first fin, forming a first collector region in a second portion of the first fin, and forming a first base region in a third portion of the first fin. The third portion of the first fin is disposed underneath a first gate electrode. The method further includes forming a second fin adjacent to the first fin and above the substrate. The second fin is composed of a semiconductor material. The method also includes forming a first base contact over the second fin. The first base contact is coupled to the first base region through the second fin, the substrate, and the first fin.
摘要:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. The at least one transistor includes a first gate dielectric structure disposed over a substrate. A work-function metallic layer is disposed over the first gate dielectric structure. A conductive layer is disposed over the work-function metallic layer. A source/drain (S/D) region is disposed adjacent to each sidewall of the first gate dielectric structure. At least one resistor structure is formed over the substrate. The at least one resistor structure includes a first doped semiconductor layer disposed over the substrate. The at least one resistor structure does not include any work-function metallic layer between the first doped semiconductor layer and the substrate.
摘要:
A representative level-shifter comprises a dynamically biased current source circuit that receives a first voltage, a first and a second unidirectional current-conducting devices, a first and a second pull-down devices, and a pull-up device. The first and second unidirectional current-conducting devices are coupled to the dynamically biased current source circuit. A voltage output of the level-shifter is located at a first node that is located between the current-constant circuit and the second unidirectional current-conducting device. The first and second pull-down devices are coupled to the first and second unidirectional current-conducting devices, respectively. The pull-up device receives a second voltage and is coupled to the dynamically biased current source circuit and the first unidirectional current-conducting device. The pull-up device is configured to dynamically bias the dynamically biased current source circuit such that a voltage drop of the second unidirectional current-conducting device is output at the voltage output responsive to the pull-up device outputting the second voltage to the dynamically biased current source circuit, the first pull-down device being non-conducting and the second pull-down device being conducting.
摘要:
Methods and apparatuses for time to digital conversion (TDC) are disclosed. A timing circuit comprises a TDC circuit, a calibration module, and a correction module. The TDC circuit is configured to provide a timing signal indicative of a timing difference between edges of a periodic reference clock signal and a variable feedback signal. The TDC circuit is also configured to provide a delay signal that is variably delayed relative to the reference clock signal. The calibration module is configured to provide a calibration signal to increase and decrease a total delay of the TDC circuit based on a time delay of the calibration signal plus a time delay of a correction signal. The correction module, which is configured to receive the timing signal and provide the correction signal, minimizes harmonic spurs in a frequency response of the timing signal by operating at a frequency of the reference clock signal.