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    Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating
    84.
    发明授权
    Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating 有权
    耐侵蚀等离子体室部件包括具有上覆热氧化涂层的金属基底结构

    公开(公告)号：US08129029B2

    公开(公告)日：2012-03-06

    申请号：US12004907

    申请日：2007-12-21

    申请人： Jennifer Y. Sun ,  Li Xu ,  Kenneth S. Collins ,  Thomas Graves ,  Ren-Guan Duan ,  Senh Thach

    发明人： Jennifer Y. Sun ,  Li Xu ,  Kenneth S. Collins ,  Thomas Graves ,  Ren-Guan Duan ,  Senh Thach

    IPC分类号： B32B9/00

    CPC分类号： C23C16/4404 ,  H01J37/32467 ,  H01J37/32477

    摘要： An article which is resistant to corrosion or erosion by chemically active plasmas and a method of making the article are described. The article is comprised of a metal or metal alloy substrate having on its surface a coating which is an oxide of the metal or metal alloy. The structure of the oxide coating is columnar in nature. The grain size of the crystals which make up the oxide is larger at the surface of the oxide coating than at the interface between the oxide coating and the metal or metal alloy substrate, and wherein the oxide coating is in compression at the interface between the oxide coating and the metal or metal alloy substrate. Typically the metal is selected from the group consisting of yttrium, neodymium, samarium, terbium, dysprosium, erbium, ytterbium, scandium, hafnium, niobium or combinations thereof.

    摘要翻译： 描述了耐化学活性等离子体腐蚀或侵蚀的制品以及制造该制品的方法。 该制品由金属或金属合金基材组成，其表面上具有金属或金属合金的氧化物的涂层。 氧化物涂层的结构本质上是柱状的。 构成氧化物的晶体的晶粒尺寸在氧化物涂层的表面比在氧化物涂层和金属或金属合金基底之间的界面处的晶粒尺寸大，并且其中氧化物涂层在氧化物之间的界面处被压缩 涂层和金属或金属合金基材。 通常，金属选自钇，钕，钐，铽，镝，铒，镱，钪，铪，铌或其组合。

    Clean, dense yttrium oxide coating protecting semiconductor processing apparatus
    85.
    发明授权
    Clean, dense yttrium oxide coating protecting semiconductor processing apparatus 有权
    清洁，致密的氧化钇涂层保护半导体加工设备

    公开(公告)号：US08067067B2

    公开(公告)日：2011-11-29

    申请号：US10898113

    申请日：2004-07-22

    申请人： Jennifer Y. Sun ,  Senh Thach ,  Jim Dempster ,  Li Xu

    发明人： Jennifer Y. Sun ,  Senh Thach ,  Jim Dempster ,  Li Xu

    IPC分类号： C23C16/00 ,  C23C4/00 ,  C23C4/10 ,  C23C4/06 ,  C23C4/04 ,  C23C4/08 ,  C23C16/08 ,  C23F1/00 ,  H01L21/306 ,  B05D1/08 ,  B05D1/02 ,  B05D1/32 ,  B05D1/36 ,  H05H1/26 ,  H05H1/52

    CPC分类号： C30B35/00 ,  C23C4/11 ,  C23C4/18 ,  C23C14/00 ,  C23C16/4404 ,  C23C28/042 ,  Y10S134/902 ,  Y10T428/26

    摘要： Disclosed herein is a method for applying plasma-resistant coatings for use in semiconductor processing apparatus. The coatings are applied over a substrate which typically comprises an aluminum alloy of the 2000 series or the 5000 through 7000 series. The coating typically comprises an oxide or a fluoride of Y, Sc, La, Ce, Eu, Dy, or the like, or yttrium-aluminum-garnet (YAG). The coating may further comprise about 20 volume % or less of Al2O3. The coatings are typically applied to a surface of an aluminum alloy substrate or an anodized aluminum alloy substrate using a technique selected from the group consisting of thermal/flame spraying, plasma spraying, sputtering, and chemical vapor deposition (CVD). To provide the desired corrosion resistance, it is necessary to place the coating in compression. This is accomplished by controlling deposition conditions during application of the coating.

    摘要翻译： 本文公开了一种用于施加用于半导体处理装置的耐等离子体涂层的方法。 将涂层施加在通常包括2000系列或5000至7000系列的铝合金的基底上。 涂层通常包含Y，Sc，La，Ce，Eu，Dy等的氧化物或氟化物，或钇 - 铝 - 石榴石（YAG）。 涂层可以进一步包含约20体积％或更少的Al 2 O 3。 涂层通常使用选自热/火焰喷涂，等离子喷涂，溅射和化学气相沉积（CVD）的技术施加到铝合金基板或阳极氧化铝合金基板的表面上。 为了提供所需的耐腐蚀性，必须将涂层置于压缩状态。 这是通过在施加涂层期间控制沉积条件来实现的。

    Solid yttrium oxide-containing substrate which has been cleaned to remove impurities
    86.
    发明申请
    Solid yttrium oxide-containing substrate which has been cleaned to remove impurities 审中-公开
    固体含氧化钇基质已被清洗除去杂质

    公开(公告)号：US20110036874A1

    公开(公告)日：2011-02-17

    申请号：US12925271

    申请日：2010-10-18

    申请人： Xikun Wang ,  Li Xu ,  Jennifer Y. Sun

    发明人： Xikun Wang ,  Li Xu ,  Jennifer Y. Sun

    IPC分类号： B05B1/14

    CPC分类号： C23C16/45565 ,  C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  C23C16/4404 ,  C23C16/4407 ,  C30B35/00 ,  H01J37/3244 ,  H01J37/32467 ,  H01J37/32862 ,  Y10T428/24273 ,  Y10T428/24314 ,  C04B35/505

    摘要： Disclosed herein is a gas distribution plate for use in a gas distribution assembly for a processing chamber, where the gas distribution plate is fabricated from a solid yttrium oxide-comprising substrate, which may also include aluminum oxide. The gas distribution plate includes a plurality of through-holes, which are typically crescent-shaped. Through-holes which have been formed in the solid yttrium oxide-comprising substrate by ultrasonic drilling perform particularly well. The solid yttrium oxide-comprising substrate typically comprises at least 99.9% yttrium oxide, and has a density of at least 4.92 g/cm3, a water absorbency of about 0.02% or less, and an average grain size within the range of about 10 μm to about 25 μm. Also disclosed herein are methods for fabricating and cleaning the yttrium oxide-comprising gas distribution plate.

    摘要翻译： 本文公开了一种用于处理室的气体分配组件中的气体分配板，其中气体分配板由可能还包括氧化铝的固体含氧化钇衬底制成。 气体分配板包括通常为月牙形的多个通孔。 通过超声波钻孔在固体含氧化钇基质中形成的通孔特别好。 固体含氧化钇的基材通常包含至少99.9％的氧化钇，并且具有至少4.92g / cm 3的密度，约0.02％或更低的吸水率，以及在约10μm的范围内的平均晶粒尺寸 至约25μm。 本文还公开了用于制造和清洁含氧化钇气体分配板的方法。

    Electrostatic chuck having textured contact surface
    88.
    发明授权
    Electrostatic chuck having textured contact surface 有权
    具有纹理接触表面的静电吸盘

    公开(公告)号：US07672110B2

    公开(公告)日：2010-03-02

    申请号：US11214286

    申请日：2005-08-29

    申请人： Jennifer Y. Sun ,  James Dempster ,  Semyon L. Kats ,  Allen Fox

    发明人： Jennifer Y. Sun ,  James Dempster ,  Semyon L. Kats ,  Allen Fox

    IPC分类号： H01L21/683 ,  H01T23/00 ,  B23B31/28

    CPC分类号： H01L21/6833 ,  Y10T279/23

    摘要： An electrostatic chuck has an electrode embedded in a dielectric which is mounted on a pedestal. The dielectric has a contact surface with an average surface roughness of less than about 0.5 μm, a surface peak waviness of less than about 0.12 μm, and a surface peak waviness material ratio of greater than about 20%. The surface texture can be formed by lapping the dielectric surface with a slurry of abrasive particles.

    摘要翻译： 静电吸盘具有嵌入在基座上的电介质中的电极。 电介质具有平均表面粗糙度小于约0.5μm的接触表面，小于约0.12μm的表面波峰波纹，以及大于约20％的表面波峰厚度材料比。 可以通过用研磨颗粒的浆料研磨电介质表面来形成表面纹理。

    Ceramic coating comprising yttrium which is resistant to a reducing plasma
    89.
    发明申请
    Ceramic coating comprising yttrium which is resistant to a reducing plasma 审中-公开
    包含耐还原性等离子体的钇的陶瓷涂层

    公开(公告)号：US20090214825A1

    公开(公告)日：2009-08-27

    申请号：US12072530

    申请日：2008-02-26

    申请人： Jennifer Y. Sun ,  Xiaoming He ,  Kenneth S. Collins ,  Thomas Graves ,  Senh Thach ,  Jie Yuan ,  Li Xu ,  Ren-Guan Duan

    发明人： Jennifer Y. Sun ,  Xiaoming He ,  Kenneth S. Collins ,  Thomas Graves ,  Senh Thach ,  Jie Yuan ,  Li Xu ,  Ren-Guan Duan

    IPC分类号： B32B7/00 ,  C23C4/00

    CPC分类号： C23C4/11 ,  Y10T428/24355 ,  Y10T428/24997

    摘要： Particulate generation has been a problem in semiconductor device processing in highly corrosive plasma environments. The problem is exacerbated when the plasma is a reducing plasma. Empirically produced data has shown that the formation of a plasma spray coated yttrium-comprising ceramic such as yttrium oxide, Y2O3—ZrO2 solid solution, YAG, and YF3 provides a low porosity coating with smooth and compacted surfaces when such ceramics are spray coated from a powder feed having an average effective diameter ranging from about 22 μm to about 0.1 μm. These spray-coated materials reduce the generation of particulates in corrosive reducing plasma environments.

    摘要翻译： 在高度腐蚀性等离子体环境中的半导体器件加工中，微粒产生是一个问题。 当等离子体是还原等离子体时，问题更加严重。 经验生产的数据显示，等离子体喷涂的包含钇的陶瓷如氧化钇，Y2O3-ZrO2固溶体，YAG和YF3的形成提供了具有光滑和压实表面的低孔隙率涂层，当这种陶瓷从 粉末进料的平均有效直径为约22μm至约0.1μm。 这些喷涂材料减少了腐蚀性还原等离子体环境中的颗粒物的产生。

    Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
    90.
    发明授权
    Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate 有权
    由固体含氧化钇基底制成的气体分配板

    公开(公告)号：US07479304B2

    公开(公告)日：2009-01-20

    申请号：US10918232

    申请日：2004-08-13

    申请人： Jennifer Y. Sun ,  Senh Thach ,  James Dempster ,  Li Xu ,  Thanh N. Pham

    发明人： Jennifer Y. Sun ,  Senh Thach ,  James Dempster ,  Li Xu ,  Thanh N. Pham

    IPC分类号： C23C16/00 ,  B05D3/12

    CPC分类号： C23C16/45565 ,  C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  C23C16/4404 ,  C23C16/4407 ,  C30B35/00 ,  H01J37/3244 ,  H01J37/32467 ,  H01J37/32862 ,  Y10T428/24273 ,  Y10T428/24314 ,  C04B35/505

    摘要： Disclosed herein is a gas distribution plate for use in a gas distribution assembly for a processing chamber, where the gas distribution plate is fabricated from a solid yttrium oxide-comprising substrate, which may also include aluminum oxide. The gas distribution plate includes a plurality of through-holes, which are typically crescent-shaped. Through-holes which have been formed in the solid yttrium oxide-comprising substrate by ultrasonic drilling perform particularly well. The solid yttrium oxide-comprising substrate typically comprises at least 99.9% yttrium oxide, and has a density of at least 4.92 g/cm3, a water absorbency of about 0.02% or less, and an average grain size within the range of about 10 μm to about 25 μm. Also disclosed herein are methods for fabricating and cleaning the yttrium oxide-comprising gas distribution plate.

    摘要翻译： 本文公开了一种用于处理室的气体分配组件中的气体分配板，其中气体分配板由可能还包括氧化铝的固体含氧化钇衬底制成。 气体分配板包括通常为月牙形的多个通孔。 通过超声波钻孔在固体含氧化钇基质中形成的通孔特别好。 固体含氧化钇的衬底通常包含至少99.9％的氧化钇，并且具有至少4.92g / cm 3的密度，约0.02％或更低的吸水率，以及在约10μm的范围内的平均晶粒尺寸 到大约25个妈妈。 本文还公开了用于制造和清洁含氧化钇气体分配板的方法。