公开(公告)号：US20100207056A1

公开(公告)日：2010-08-19

申请号：US12772774

申请日：2010-05-03

申请人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

发明人： Gareth Hougham ,  Paul A. Lauro ,  Brian R. Sundlof ,  Jeffrey D. Gelorme

IPC分类号： C09K5/00

CPC分类号： H01L23/3733 ,  B82Y30/00 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S977/788 ,  Y10T156/10 ,  Y10T428/24994 ,  H01L2224/0401

摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

摘要翻译： 本发明一般涉及用于集成电路的导热膏，特别是但不限于石墨的自取向微孔板。

公开(公告)号：US20100116871A1

公开(公告)日：2010-05-13

申请号：US12269240

申请日：2008-11-12

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： B23K3/0638 ,  B23K1/0016

摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔直接注入到具有可湿性垫片的体积中，使得通孔和具有可湿性垫片的体积用焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。