Composite free layer for CIP GMR device
    82.
    发明申请
    Composite free layer for CIP GMR device 失效
    CIP GMR器件的复合自由层

    公开(公告)号:US20060126231A1

    公开(公告)日:2006-06-15

    申请号:US11010105

    申请日:2004-12-10

    IPC分类号: G11B5/33 G11B5/127

    CPC分类号: G11B5/3903 H01L43/10

    摘要: In this invention, we replace low resistivity NiFe with high-resistivity FeNi for the FL2 portion of a composite free layer in a CIP GMR sensor in order to minimize current shunting effects while still retaining both magnetic softness and low magnetostriction. A process for manufacturing the device is also described.

    摘要翻译: 在本发明中,为了最小化电流分流效应同时保持磁性柔软性和低磁致伸缩性,我们用CIP GMR传感器中的复合自由层的FL2部分代替具有高电阻率FeNi的低电阻率NiFe。 还描述了用于制造该装置的方法。

    Composite free layer for CIP GMR device
    84.
    发明授权
    Composite free layer for CIP GMR device 失效
    CIP GMR器件的复合自由层

    公开(公告)号:US07431961B2

    公开(公告)日:2008-10-07

    申请号:US11010105

    申请日:2004-12-10

    IPC分类号: B05D5/12

    CPC分类号: G11B5/3903 H01L43/10

    摘要: In this invention, we replace low resistivity NiFe with high-resistivity FeNi for the FL2 portion of a composite free layer in a CIP GMR sensor in order to minimize current shunting effects while still retaining both magnetic softness and low magnetostriction. A process for manufacturing the device is also described.

    摘要翻译: 在本发明中,为了最小化电流分流效应,同时保持磁性柔软性和低磁致伸缩性,我们用CIP GMR传感器中的复合自由层的FL 2部分代替具有高电阻率FeNi的低电阻率NiFe。 还描述了用于制造该装置的方法。

    Self-pinned GMR structure by annealing
    90.
    发明申请
    Self-pinned GMR structure by annealing 失效
    通过退火自固定GMR结构

    公开(公告)号:US20050252576A1

    公开(公告)日:2005-11-17

    申请号:US10846406

    申请日:2004-05-14

    IPC分类号: H01F10/12 H01F10/32 H01F41/30

    摘要: In a conventional spin valve the shunt resistance of the pinning layer reduces the overall efficiency of the device. This problem has been overcome by using IrMn for the pinning layer at a thickness of about 20 Angstroms or less. For the IrMn to be fully effective it must be subjected to a two-step anneal, first in the presence of a high field (about 10 kOe) for several hours and then in a low field (about 500 Oe) while it cools. The result, in addition to improved pinning, is the ability to do testing at the full film and full wafer levels.

    摘要翻译: 在传统的自旋阀中,钉扎层的分流电阻降低了器件的整体效率。 通过使用IrMn作为钉扎层的约20埃或更小的厚度已经克服了这个问题。 为了使IrMn完全有效,必须先进行两步退火,首先在高场(约10kOe)存在数小时,然后在低场(约500Oe)的温度下冷却。 结果,除了改进钉扎之外,还可以在整个薄膜和全晶圆级别进行测试。