公开(公告)号：US20100118105A1

公开(公告)日：2010-05-13

申请号：US12589593

申请日：2009-10-26

申请人： Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

发明人： Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC分类号： B41J2/335 ,  B23P17/00

CPC分类号： B41J2/33585 ,  B41J2/3359 ,  Y10T29/49401

摘要： To provide a thermal head and a printer which realize improved heating efficiency and improved strength, and to manufacture the thermal head stably, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one surface of a supporting substrate; a bonding step of bonding a thin plate glass shaped like a substantially flat board, to the one surface of the supporting substrate where the concave portion has been formed in the concave portion forming step, in a manner that hermetically seals the concave portion and forms a hollow portion; a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step, to thereby soften the thin plate glass and expand gas trapped inside the hollow portion; and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion, wherein the heating step concavely curves a surface of the thin plate glass that is on the hollow portion side.

摘要翻译： 为了提供一种能够实现提高加热效率和提高强度的热敏头和打印机，并且为了稳定地制造热敏头，提供了一种热敏头制造方法，包括：凹部形成步骤，在支撑体的一个表面上形成凹部 基质; 将形成为大致平板状的薄板状玻璃的接合工序，以凹状部形成工序形成凹部的支撑基板的一个面粘接，形成凹部 中空部分 在接合步骤中加热已经结合在一起的支撑基板和薄板玻璃的加热步骤，从而软化薄板玻璃并膨胀被困在中空部分内的气体; 以及加热电阻体的形成步骤，在所述薄板玻璃上形成与所述中空部相对的加热电阻体，所述加热工序使所述中空部侧的所述薄板玻璃的表面凹凸地弯曲。

公开(公告)号：US06606109B1

公开(公告)日：2003-08-12

申请号：US09762556

申请日：2001-04-06

申请人： Osamu Takizawa ,  Norimitsu Sambongi ,  Noriyoshi Shoji ,  Yuji Nakamura ,  Taro Ito ,  Yumiko Yamaguchi

发明人： Osamu Takizawa ,  Norimitsu Sambongi ,  Noriyoshi Shoji ,  Yuji Nakamura ,  Taro Ito ,  Yumiko Yamaguchi

IPC分类号： B41J2335

CPC分类号： B41J2/345

摘要： A thermal head and a thermal head unit are provided, which can prevent density variation while suppressing the size of the thermal head to be small. In a thermal head (10) having a head chip (20) having one surface on which heat generating elements and segment and common electrodes connected to the heat generating elements are provided, and an IC chip (32) connected to the segment electrodes, the common electrode (27) provided to the head chip (20) is elongated in an array direction of the heat generating elements, and connections between the common electrode (27) and common electrode wirings (41) are provided at plural locations along the array direction.

摘要翻译： 提供了热头和热敏头单元，其可以在抑制热敏头的尺寸小的同时防止密度变化。 在具有头部芯片（20）的热敏头（10）中，具有一个表面，在该表面上设有连接到发热元件的发热元件和部分和公共电极，以及连接到分段电极的IC芯片（32） 提供给头芯片（20）的公共电极（27）在发热元件的排列方向上是细长的，公共电极（27）和公共电极布线（41）之间的连接沿阵列方向 。