FEATURE-QUANTITY EXTRACTING METHOD, DESIGNED-CIRCUIT-PATTERN VERIFYING METHOD, AND COMPUTER PROGRAM PRODUCT
    81.
    发明申请
    FEATURE-QUANTITY EXTRACTING METHOD, DESIGNED-CIRCUIT-PATTERN VERIFYING METHOD, AND COMPUTER PROGRAM PRODUCT 审中-公开
    特征提取方法,设计电路图形验证方法和计算机程序产品

    公开(公告)号:US20100166289A1

    公开(公告)日:2010-07-01

    申请号:US12646677

    申请日:2009-12-23

    IPC分类号: G06K9/46 G06T7/00

    CPC分类号: G03F1/44 G03F7/705

    摘要: Feature-quantity extraction parameters used by feature-quantity extraction functions for calculating feature quantities used as explanatory variables of a resist model for predicting a resist image are set. The feature-quantity extraction functions, for which the feature-quantity extraction parameters are set, are caused to act on optical images of a pattern of a photomask to calculate feature quantities from the optical images.

    摘要翻译: 设置用于计算用作预测抗蚀剂图像的抗蚀剂模型的解释变量的特征量的特征量提取函数所使用的特征量提取参数。 使特征量提取参数被设置的特征量提取功能作用于光掩模图案的光学图像,以计算来自光学图像的特征量。

    PROCESS MODEL EVALUATION METHOD, PROCESS MODEL GENERATION METHOD AND PROCESS MODEL EVALUATION PROGRAM
    82.
    发明申请
    PROCESS MODEL EVALUATION METHOD, PROCESS MODEL GENERATION METHOD AND PROCESS MODEL EVALUATION PROGRAM 审中-公开
    过程模型评估方法,过程模型生成方法和过程模型评估程序

    公开(公告)号:US20100081295A1

    公开(公告)日:2010-04-01

    申请号:US12548955

    申请日:2009-08-27

    IPC分类号: H01L21/027 G03F7/20 G06F17/50

    CPC分类号: G03F1/36

    摘要: According to an aspect of the present invention, there is provided a method for evaluating a process model, the method including: acquiring, for each of given patterns, a dimensional difference amount between: a first pattern that is formed by actually applying a process onto a corresponding one of the given patterns; and a second pattern that is calculated by applying a process model modeling the process to the corresponding one of the given patterns; and evaluating the process model based on an evaluation index, the evaluation index being based on the number of the patterns at which the dimensional difference amount is equal to or less than a threshold value.

    摘要翻译: 根据本发明的一个方面,提供了一种用于评估过程模型的方法,所述方法包括:针对每个给定模式,获取以下之间的尺寸差异量:通过实际应用过程形成的第一图案到 给定模式中的相应一个; 以及通过将过程模型建模到给定模式中的相应一个模型来计算的第二模式; 以及基于评价指标来评价所述过程模型,所述评价指标基于所述维度差量等于或小于阈值的模式的数量。

    Lithography simulation method, program and semiconductor device manufacturing method
    83.
    发明申请
    Lithography simulation method, program and semiconductor device manufacturing method 失效
    平版印刷模拟方法,程序和半导体器件制造方法

    公开(公告)号:US20070277146A1

    公开(公告)日:2007-11-29

    申请号:US11802615

    申请日:2007-05-24

    IPC分类号: G06F17/50

    摘要: A lithography simulation method which predicts the result that a pattern formed on a mask is transferred onto a sample by use of a simulation based on pattern data of the mask includes subjecting a mask layout containing a pattern whose periodicity is disturbed to the simulation. At this time, a calculation area of pattern data used for the simulation is set to an integral multiple of minimum periodic length of the mask layout.

    摘要翻译: 通过使用基于掩模的图案数据的模拟将掩模上形成的图案转移到样本上的结果的光刻仿真方法包括对包含周期性被扰乱的图案的掩模布局进行模拟。 此时,将用于模拟的图案数据的计算区域设置为掩模布局的最小周期长度的整数倍。

    Lithography simulation method, photomask manufacturing method, semiconductor device manufacturing method, and recording medium
    84.
    发明授权
    Lithography simulation method, photomask manufacturing method, semiconductor device manufacturing method, and recording medium 失效
    光刻模拟法,光掩模制造方法,半导体器件制造方法和记录介质

    公开(公告)号:US07784017B2

    公开(公告)日:2010-08-24

    申请号:US11783935

    申请日:2007-04-13

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70666 G03F7/705

    摘要: A lithography simulation method includes obtaining a mask transmission function from a mask layout, obtaining an optical image of the mask layout by using the mask transmission function, obtaining a function which is filtered by applying a predetermined function filter to the mask transmission function, and correcting the optical image by using the filtered function.

    摘要翻译: 平版印刷模拟方法包括从掩模布局获得掩模传输功能,通过使用掩模传输功能获得掩模布局的光学图像,获得通过对掩模传输功能应用预定功能滤波器而被滤波的功能,以及校正 通过使用滤波功能的光学图像。

    Lithography simulation method, photomask manufacturing method, semiconductor device manufacturing method, and recording medium
    85.
    发明申请
    Lithography simulation method, photomask manufacturing method, semiconductor device manufacturing method, and recording medium 失效
    光刻模拟法,光掩模制造方法,半导体器件制造方法和记录介质

    公开(公告)号:US20070245292A1

    公开(公告)日:2007-10-18

    申请号:US11783935

    申请日:2007-04-13

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70666 G03F7/705

    摘要: A lithography simulation method includes obtaining a mask transmission function from a mask layout, obtaining an optical image of the mask layout by using the mask transmission function, obtaining a function which is filtered by applying a predetermined function filter to the mask transmission function, and correcting the optical image by using the filtered function.

    摘要翻译: 平版印刷模拟方法包括从掩模布局获得掩模传输功能,通过使用掩模传输功能获得掩模布局的光学图像,获得通过对掩模传输功能应用预定功能滤波器而被滤波的功能,以及校正 通过使用滤波功能的光学图像。

    Pattern prediction method, pattern correction method, semiconductor device, and recording medium
    86.
    发明授权
    Pattern prediction method, pattern correction method, semiconductor device, and recording medium 有权
    图案预测方法,图案校正方法,半导体器件和记录介质

    公开(公告)号:US07901853B2

    公开(公告)日:2011-03-08

    申请号:US12395398

    申请日:2009-02-27

    IPC分类号: G03F9/00 G06F17/50

    CPC分类号: G03F1/36 G03F1/80

    摘要: A pattern prediction method according to an embodiment includes: predicting a second pattern shape from a first pattern shape by using a conversion function and a conversion difference residual error amount function, wherein; the conversion function makes the connection between the first pattern formed by a first step and the second pattern formed by a second step following the first step based on contour shapes of the first pattern and the second pattern, and the conversion difference residual error amount function makes the connection between a residual error amount between a predicted shape of the second pattern obtained from the conversion function and the second pattern shape obtained by actually using the second step, and factors other than the contour shapes of the first pattern and the second pattern.

    摘要翻译: 根据实施例的图案预测方法包括:通过使用转换函数和转换差残差误差量函数从第一图案形状预测第二图案形状,其中: 转换功能使得基于第一步骤形成的第一图案与第一步骤之后的第二步骤形成的第二图案之间的连接基于第一图案和第二图案的轮廓形状,以及转换差残差误差量函数 从转换功能获得的第二图案的预测形状与通过实际使用第二步骤获得的第二图案形状之间的残留误差量与除了第一图案和第二图案的轮廓形状之外的因素之间的连接。

    Lithography simulation method, program and semiconductor device manufacturing method
    87.
    发明授权
    Lithography simulation method, program and semiconductor device manufacturing method 失效
    平版印刷模拟方法,程序和半导体器件制造方法

    公开(公告)号:US07831953B2

    公开(公告)日:2010-11-09

    申请号:US11802615

    申请日:2007-05-24

    IPC分类号: G06F17/50

    摘要: A lithography simulation method which predicts the result that a pattern formed on a mask is transferred onto a sample by use of a simulation based on pattern data of the mask includes subjecting a mask layout containing a pattern whose periodicity is disturbed to the simulation. At this time, a calculation area of pattern data used for the simulation is set to an integral multiple of minimum periodic length of the mask layout.

    摘要翻译: 通过使用基于掩模的图案数据的模拟将掩模上形成的图案转移到样本上的结果的光刻仿真方法包括对包含周期性被扰乱的图案的掩模布局进行模拟。 此时,将用于模拟的图案数据的计算区域设置为掩模布局的最小周期长度的整数倍。

    Light intensity distribution simulation method and computer program product
    88.
    发明授权
    Light intensity distribution simulation method and computer program product 失效
    光强分布模拟方法和计算机程序产品

    公开(公告)号:US07596776B2

    公开(公告)日:2009-09-29

    申请号:US11730102

    申请日:2007-03-29

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5009

    摘要: A light intensity distribution simulation method for predicting an intensity distribution of light on a substrate when photomask including a pattern is irradiated with light in which a shape distribution of an effective light source is defined includes extracting plural point light sources from a shape distribution of the effective light source, entering the light emitted from each of the plural point light sources onto the pattern of the photomask, calculating an effective shape for each of the plural point light sources, the effective shape being a pattern obtained by excluding a part which is not irradiated with the light directly due to a sidewall of a pattern film including the pattern from a design shape of an aperture of the pattern, and calculating a distribution of diffraction light generated in the pattern for each of the plural point light sources by using the effective shape.

    摘要翻译: 一种光强度分布模拟方法,用于当定义包含图案的光掩模在基板上的光的强度分布时,其中所述光被定义为其中限定有效光源的形状分布的光包括从有效光源的形状分布中提取多个点光源 光源,将从多个点光源中的每一个发射的光输入到光掩模的图案上,计算多个点光源中的每一个的有效形状,有效形状是通过排除未照射的部分获得的图案 直接由于来自图案的孔的设计形状的图案的图案膜的侧壁而直接导光,并且通过使用有效形状来计算针对每个多个点光源的图案中产生的衍射光的分布 。

    Lithography simulation method, mask pattern correction method, and substrate topography correction method
    89.
    发明授权
    Lithography simulation method, mask pattern correction method, and substrate topography correction method 失效
    平版印刷模拟方法,掩模图案校正方法以及基板形貌校正方法

    公开(公告)号:US07002665B2

    公开(公告)日:2006-02-21

    申请号:US10781652

    申请日:2004-02-20

    IPC分类号: G03B27/42

    CPC分类号: G03B27/72 G03F7/705

    摘要: An aspect of the present invention provides simulation that includes dividing a surface of a substrate onto which light that is focused at an aperture angle by a projection lens is shone into a first region onto which all of the light strikes and a second region onto which a portion of the light strikes, calculating an intensity of the light shone onto the first region, and calculating an intensity of the light shone onto the second region.

    摘要翻译: 本发明的一个方面提供了一种模拟,其包括将基板的表面划分成以投影透镜在孔径角聚焦的光照射到所有光照射到的第一区域和第二区域上, 计算光照射到第一区域上的光的强度,并计算第二区域上的光的强度。

    Exposing method and method of manufacturing semiconductor device
    90.
    发明授权
    Exposing method and method of manufacturing semiconductor device 失效
    揭示半导体器件制造方法和方法

    公开(公告)号:US08654313B2

    公开(公告)日:2014-02-18

    申请号:US12952835

    申请日:2010-11-23

    摘要: According to one embodiment, on a substrate, a resist layer is laminated on an upper side of a pattern formation layer on which a desired pattern is formed. A diffraction pattern that diffracts exposure light irradiated on the substrate is formed further on the upper side than the resist layer. Overall exposure is performed from above the diffraction pattern using a deformed light having illumination light source shape determined according to the desired pattern. Diffracted light diffracted on the diffraction pattern by the exposure is irradiated on the resist layer.

    摘要翻译: 根据一个实施例,在基板上,在其上形成有所需图案的图案形成层的上侧层压抗蚀剂层。 衍射照射在基板上的曝光光的衍射图案进一步形成在抗蚀剂层的上侧。 使用具有根据期望图案确定的照明光源形状的变形光从衍射图案上方进行总体曝光。 通过曝光在衍射图案上衍射的衍射光被照射在抗蚀剂层上。