公开(公告)号：US20060215366A1

公开(公告)日：2006-09-28

申请号：US11088661

申请日：2005-03-24

申请人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

发明人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.

摘要翻译： 公开了用于从部件去除多余热量的装置，系统和方法。 包括散热器，位于具有过冷却能力的计算机的区域中。 包括热管并且连接到散热器并延伸到位于计算机中的热敏元件。 导热符合垫连接到热敏部件。 导热金属连接器连接到热管和柔性垫。

公开(公告)号：US20050141194A1

公开(公告)日：2005-06-30

申请号：US10747569

申请日：2003-12-29

申请人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

发明人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

IPC分类号： H01L23/427 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

摘要翻译： 声学和热能管理系统和方法包括微处理器和与微处理器一定距离的热质量传感器，微处理器和热质量以将热能从微处理器转移到热质量的方式热连接到微处理器。 声学和热能管理系统将热量从微处理器传递到热质量，以消除微处理器处的热量，从而限制风扇的运行或操作水平。

公开(公告)号：US06856921B2

公开(公告)日：2005-02-15

申请号：US10732157

申请日：2003-12-10

申请人： Mark E. Cohen ,  Joseph Anthony Ho-Lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

发明人： Mark E. Cohen ,  Joseph Anthony Ho-Lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

IPC分类号： G06F1/20 ,  H01L23/38 ,  G01R2/00 ,  G06F19/00

CPC分类号： H01L23/38 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.

摘要翻译： 公开了一种冷却装置，方法和制造工具，其提供选择性地向附接的散热装置提供电力，所述散热装置具有与冷却单元热接触的冷却探针，以将由计算机内的发热源产生的热量去除 计算机外部的外部环境。 可以节省电力，延长便携式电池寿命，利用更高速度的处理器，并且通过利用具有个人计算机的装置可以减轻和减少个人计算机的整体尺寸特性。 热能通过热连接界面从个人计算机的发热源传送到设备的收集面，此后收集的热能相对于电源的可用功率和/或计划的操作 处理器的速度。