Abstract:
A fingerprint identification apparatus includes a fingerprint identification IC chip having a contact face and a plurality of metal bumps arranged on the contact face, a thin substrate having a first face, a second face opposite to the first face and a plurality of metal pads arranged on the first face, wherein at least part of the metal pads electrically connect with the metal bumps, a protection layer having a mounting face adjacent to the second face of the thin substrate, and a plurality of conductive electrodes arranged between the thin substrate and the protection layer. The metal bumps are not directly pressed or press-soldered to the protection layer, thus preventing the transparent conductive traces of the protection layer from damaging and enhancing the package yield.
Abstract:
A fingerprint recognition apparatus includes an electrode-and-wiring substrate having two main surfaces opposite to each other, where one main surface is in proximity to user finger and the electrode-and-wiring substrate has a plurality of sensing electrodes on the other main surface. The fingerprint recognition apparatus further includes an integrated circuit (IC) chip having a fingerprint sensing circuit and a plurality of metal bumps. At least part of the metal bumps are electrically connected to the fingerprint sensing circuit and corresponding sensing electrodes on the electrode-and-wiring substrate, whereby the fingerprint sensing circuit is electrically connected to the sensing electrodes.
Abstract:
A two-substrate fingerprint recognition device includes a first substrate and a second substrate. A plurality of electrodes, a plurality of connection pads and a plurality of connection traces are deployed on one surface of the first substrate. A plurality of conductive connection pads, a plurality of connection pads, a plurality of connection traces and a plurality of switch circuits are deployed on one surface of the second substrate that faces the first substrate. At least one electrode connection pad of the second substrate is electrically connected to a corresponding electrode of the first substrate.
Abstract:
A high-sensitivity in-cell touch display device has a common voltage and sensing electrode layer including a plurality of common voltage and sensing electrodes, each corresponding to at least one pixel electrode. A touch circuit is provided with a touch-dedicated power supply circuit, and a common voltage and sensing electrode is used as a common node of the touch circuit and a display circuit, so that there is no current loop between the touch circuit and the display circuit. Reflection electrodes are further provided to reduce parasitic capacitance between the common voltage and sensing electrodes and to improve the sensing distance. The display operation and the touch sensing operation can be performed on different areas in parallel to increase respective efficiencies of the display and touch sensing operations.
Abstract:
A combinational sensing type fingerprint identification device includes plural sensing electrodes; plural sensing electrode switches; plural first sensed signal connection lines, and a controller. Each sensing electrode switch corresponds to one sensing electrode and has a first terminal, a second terminal connected to a common signal, a third terminal connected to a corresponding sensing electrode, and a control terminal Each first sensed signal connection line is connected to the first terminals of the sensing electrode switches in one column. The controller is connected to the control terminal of each sensing electrode switch for controlling whether the sensing electrode switches are electrically connected to the common signal or corresponding first sensed signal connection lines. The controller configures the control terminals of the sensing electrode switches for allowing a part of the sensing electrodes to be electrically connected to the corresponding first sensed signal connection lines.