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146 条记录 (耗时 0.022 秒)

    Method and device for molding skin-covered foamed plastic article
    81.
    发明授权
    Method and device for molding skin-covered foamed plastic article 失效
    用于模塑皮肤覆盖的泡沫塑料制品的方法和装置

    公开(公告)号：US5061419A

    公开(公告)日：1991-10-29

    申请号：US49556

    申请日：1987-05-14

    申请人： Hiroshi Kouda ,  Takayuki Saito

    发明人： Hiroshi Kouda ,  Takayuki Saito

    IPC分类号： B29C39/10 ,  B29C33/00 ,  B29C33/48 ,  B29C39/34 ,  B29C39/36 ,  B29C44/58 ,  B29K105/04 ,  B29L31/58 ,  B60R21/055

    CPC分类号： B29C44/583 ,  B29C33/48 ,  B29C33/0033 ,  B29L2031/3023

    摘要： Disclosed herein is a method and device for molding a skin-covered foamed plastic article with a bore formed therein. A split mold is used which comprises a lower mold part with a recess and an upper mold part with a through bore. The upper mold part is placeable on the lower mold part to form a combined cavity by the through bore and the recess. In order to provide the foamed product with a desirable bore, first and second shaping dies are employed which are combinable with each other to form a combined shaping body which is, upon molding, projected into the combined cavity of the split mold. Upon hardening of the product, the second and first shaping dies are dismantled from the split mold in this order.

    摘要翻译： 本文公开了一种用于模制其中形成有孔的皮肤覆盖的发泡塑料制品的方法和装置。 使用分开模具，其包括具有凹部的下模具部分和具有通孔的上模具部件。 上模具部件可放置在下模具部件上，以通过通孔和凹槽形成组合腔体。 为了提供具有期望的孔的发泡产品，采用第一和第二成形模，它们可彼此组合以形成组合的成型体，其在模制时投影到分模的组合腔中。 在产品硬化时，第二成形模具和第一成形模具按顺序从分模中拆下。

    Camera finder employing holographic view field frames
    82.
    发明授权
    Camera finder employing holographic view field frames 失效
    摄像机采用全息影像帧

    公开(公告)号：US4576458A

    公开(公告)日：1986-03-18

    申请号：US596196

    申请日：1984-04-02

    申请人： Michio Cho ,  Masane Suzuki ,  Takayuki Saito

    发明人： Michio Cho ,  Masane Suzuki ,  Takayuki Saito

    IPC分类号： G03B13/14 ,  G03B13/12

    CPC分类号： G03B13/14

    摘要： A camera finder capable of indicating a view field frame for determining the range of photographing and a target mark for showing a desired focus adjusting portion. Interposed between an objective lens and an eye lens in this finder are holograms having recorded thereon view field frames and a target mark. The hologram is irradiated by a reference beam or beams, whereby the view field frame and the target mark are regenerated. In the hologram, there are recorded a first view field frame in which a parallax is corrected in the long-medium distance and a second view field frame in which a parallex is corrected in the short distance. A beam source for regenerating each view field frame is selected in accordance with an object distance, whereby a view field frame corresponding to the object distance is regenerated. The parallax can be corrected as described above.

    摘要翻译： 能够指示用于确定拍摄范围的视野帧的摄像机和用于显示所需焦点调整部分的目标标记。 在该取景器中的物镜和眼睛透镜之间插入有在其上记录有视野框架和目标标记的全息图。 全息图被参考光束或光束照射，从而再现视场框架和目标标记。 在全息图中，记录了其中在长介质距离中校正视差的第一视野场帧和在短距离中校正并行校正的第二视场帧。 根据对象距离来选择用于再现每个视野帧的光束源，从而再现与对象距离相对应的视野帧。 可以如上所述校正视差。

    Thermally conductive adhesive
    84.
    发明授权
    Thermally conductive adhesive 有权
    导热胶

    公开(公告)号：US09084373B2

    公开(公告)日：2015-07-14

    申请号：US13978600

    申请日：2011-12-15

    申请人： Taichi Koyama ,  Takayuki Saito

    发明人： Taichi Koyama ,  Takayuki Saito

    IPC分类号： H05K7/20 ,  C09J9/00 ,  H01L23/373 ,  C09J11/04 ,  H01L23/00 ,  C08K3/08

    CPC分类号： H05K7/2039 ,  C08G59/42 ,  C08K3/08 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/29298 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

    摘要翻译： 一种导热粘合剂，其具有：含有可固化组分的热固性粘合剂和用于可固化组分的固化剂，以及分散在热固性粘合剂中的金属填料使用银粉和焊料粉末作为金属填料。 使用的焊料粉末的熔融温度低于导热性粘合剂的热固化温度，并且当焊料粉末反应时产生熔点高于焊料粉末的熔融温度的高熔点焊料合金 在导热粘合剂的热固化条件下，银粉末。 使用对金属填充剂具有助熔活性的固化剂作为固化剂。

    Semiconductor device and method for manufacturing semiconductor device having oxide semiconductor layer
    85.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device having oxide semiconductor layer 有权
    具有氧化物半导体层的半导体器件和半导体器件的制造方法

    公开(公告)号：US08829586B2

    公开(公告)日：2014-09-09

    申请号：US13014075

    申请日：2011-01-26

    申请人： Yuta Endo ,  Takayuki Saito ,  Shunpei Yamazaki

    发明人： Yuta Endo ,  Takayuki Saito ,  Shunpei Yamazaki

    IPC分类号： H01L29/76 ,  H01L21/36 ,  H01L27/12 ,  H01L21/02 ,  H01L29/49 ,  H01L29/786

    CPC分类号： H01L29/7869 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02631 ,  H01L27/1225 ,  H01L29/4908 ,  H01L29/495 ,  H01L29/513 ,  H01L29/517

    摘要： In a miniaturized transistor, a gate insulating layer is required to reduce its thickness; however, in the case where the gate insulating layer is a single layer of a silicon oxide film, a physical limit on thinning of the gate insulating layer might occur due to an increase in tunneling current, i.e. gate leakage current. With the use of a high-k film whose relative permittivity is higher than or equal to 10 is used for the gate insulating layer, gate leakage current of the miniaturized transistor is reduced. With the use of the high-k film as a first insulating layer whose relative permittivity is higher than that of a second insulating layer in contact with an oxide semiconductor layer, the thickness of the gate insulating layer can be thinner than a thickness of a gate insulating layer considered in terms of a silicon oxide film.

    摘要翻译： 在小型化晶体管中，需要栅极绝缘层来减小其厚度; 然而，在栅绝缘层是单层氧化硅膜的情况下，由于隧穿电流（即栅极漏电流）的增加，可能会发生栅极绝缘层变薄的物理极限。 通过使用栅极绝缘层使用相对介电常数高于或等于10的高k膜，减小了小型化晶体管的栅极漏电流。 通过使用高k膜作为相对介电常数高于与氧化物半导体层接触的第二绝缘层的第一绝缘层的第一绝缘层，栅绝缘层的厚度可以比栅的厚度薄 根据氧化硅膜考虑的绝缘层。

    Sensor structure
    86.
    发明授权
    Sensor structure 有权
    传感器结构

    公开(公告)号：US08549914B2

    公开(公告)日：2013-10-08

    申请号：US13218770

    申请日：2011-08-26

    申请人： Takayuki Saito ,  Chihiro Kobayashi

    发明人： Takayuki Saito ,  Chihiro Kobayashi

    IPC分类号： G01D11/24 ,  G01L19/14 ,  G01P1/02

    CPC分类号： G01L23/24 ,  G01F1/68 ,  G01F1/684

    摘要： Provided is a sensor structure capable of improving the reliability of connecting parts of electronic components and achieving excellent productivity and reduction in size and weight, for example, when electronic components are externally mounted on input/output terminals of a sensor. A relationship between a linear expansion coefficient for a housing serving as a base of a structure and a linear expansion coefficient of a resin material for a sensor casing of a sensor to be mounted is set to satisfy “sensor casing

    摘要翻译： 提供了一种传感器结构，其能够提高电子部件的连接部件的可靠性，并且例如当将电子部件外部安装在传感器的输入/输出端子上时，实现优异的生产率和尺寸和重量的减小。 设置作为基底的壳体的线膨胀系数与待安装传感器的传感器壳体的树脂材料的线膨胀系数之间的关系被设定为满足“传感器外壳<线膨胀系数α<外壳 “。 当电子部件被外部安装时，电气部件安装在整体形成在具有小的线性膨胀系数的部件侧，即传感器外壳一侧上的输入/输出端子上。

    Pattern forming method, semiconductor device manufacturing method and exposure mask set
    89.
    发明授权
    Pattern forming method, semiconductor device manufacturing method and exposure mask set 有权
    图案形成方法，半导体器件制造方法和曝光掩模组

    公开(公告)号：US08017305B2

    公开(公告)日：2011-09-13

    申请号：US12652470

    申请日：2010-01-05

    申请人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

    发明人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

    IPC分类号： G03F7/26

    CPC分类号： G03F7/70466 ,  G03F1/00

    摘要： First, a first exposure process is performed using dipole illumination with only a grating-pattern forming region as a substantial object to be exposed. Next, a second exposure process is performed with only a standard-pattern forming region as a substantial object to be exposed. A development process is then performed to obtain a resist pattern. A mask for the first exposure process is such that a light blocking pattern is formed on the whole surface of a standard-pattern mask part corresponding to the standard-pattern forming region. A mask for the second exposure is such that a light blocking pattern is formed on the whole surface of a grating-pattern mask part corresponding to the grating-pattern forming region.

    摘要翻译： 首先，使用仅具有光栅图案形成区域的偶极照明作为要暴露的实质对象来执行第一曝光处理。 接下来，仅以标准图案形成区域作为要曝光的实质物体进行第二曝光处理。 然后进行显影处理以获得抗蚀剂图案。 用于第一曝光处理的掩模使得在对应于标准图案形成区域的标准图案掩模部件的整个表面上形成遮光图案。 用于第二曝光的掩模使得在对应于光栅图案形成区域的光栅图案掩模部分的整个表面上形成遮光图案。