Replacement part validation systems and methods

    公开(公告)号:US12254620B2

    公开(公告)日:2025-03-18

    申请号:US17821482

    申请日:2022-08-23

    Abstract: A replacement part validation system is presented that includes a scanning system that scans a received part and provides the scan results of the received part. The system also includes a part recognition module that, based on the received scan results of the received part and provides a part identification and a part quality metric. The system also includes a job assignment module that assigns the received part to an outstanding repair job. The system also includes an output generator that outputs the outstanding repair job and the part quality metric. The system also includes a computing processor that, based on the received scanned results, causes the part recognition module to review a database of parts and retrieve a most-likely match. The part quality metric is based on a comparison of the received part to the most-likely match. The computing processor causes the output generator to output the outstanding repair job and part quality metric to a source.

    Wireless power transfer
    5.
    发明授权

    公开(公告)号:US12249847B2

    公开(公告)日:2025-03-11

    申请号:US17309781

    申请日:2019-12-13

    Abstract: A device is described having one or more conductive loops to produce an electromagnetic field, such as for wireless power transfer to an electronic device. In some examples, an antenna is used with at least one resonating capacitor ring that is relatively co-planar with the antenna, and that is magnetically coupled to the antenna but is not electrically powered by an external source. In addition, a device is described having two or more thin-film coils, each coil comprising a pair of terminals and at least one loop defining a plane and an interior region. In some examples, the planes of the two or more coils are disposed substantially parallel to one another, the interior regions of the two or more coils at least partially overlap one another, and the pairs of terminals of the antennae are electrically connected in parallel.

    CROSSLINKABLE COMPOSITIONS INCLUDING A LATENT UV-ABSORBER

    公开(公告)号:US20250059350A1

    公开(公告)日:2025-02-20

    申请号:US18722212

    申请日:2022-12-21

    Abstract: Provided are crosslinkable compositions comprising a (meth)acrylate polymer, where the polymer has a glass transition temperature no greater than 30° C.; a crosslinking agent, the crosslinking agent comprising a photo-active Type II photoinitiator and a polymerizable group selected from the group consisting of (meth)acrylate, allyl, and combinations thereof; and a UV absorbing material represented by the structure (I) where each of X1, X2, X3, and X4 is independently a hydrogen atom, a hydrocarbyl group including 1 to 15 carbon atoms, preferably 12 carbon atoms, or a heterohydrocarbyl group including 1 to 15 carbon atoms, preferably 12 carbon atoms.

    SELF-FOLDING 3D FILM ASSEMBLIES
    9.
    发明申请

    公开(公告)号:US20250059026A1

    公开(公告)日:2025-02-20

    申请号:US18941132

    申请日:2024-11-08

    Abstract: A substantially planar self-folding film assembly to generate a folded three-dimensional assembly. The assembly includes a flexible support substrate, adhesive elements, and folding members. The folding members include a base, a folding region, and a hinge adjacent each folding region attached at the base to the flexible support substrate by at least one of the adhesive elements. An array of polymer actuators is co-extensive, or shaped to be not co-extensive, with each of the flexible folding members. Upon activation by a patterned light to heat conversion layer, each polymer actuator is designed and configured to provide a displacement of the corresponding flexible folding member about each hinge.

    PAD CONDITIONING DISK WITH COMPRESSIBLE CIRCUMFERENTIAL LAYER

    公开(公告)号:US20250058429A1

    公开(公告)日:2025-02-20

    申请号:US18717610

    申请日:2022-12-19

    Inventor: Matthew C. Fritz

    Abstract: Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compressible layer is greater than the maximum height of the discrete abrasive elements, which may provide more even wafer removal rates for in-situ polishing processes.

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