专利检索 aee:"AIROHA TECHNOLOGY GROUP" 第 1 页

1.

发明授权
Electronic component 有权

公开(公告)号：US10600769B2

公开(公告)日：2020-03-24

申请号：US15949212

申请日：2018-04-10

申请人： Airoha Technology Corp.

发明人： Heng-Chih Lin , Chien-Kuang Lee

IPC分类号： H01L23/00 , H01L25/18 , H01L25/065 , H01L23/498

摘要： An electronic component is provided. The electronic component includes a substrate, an III-V die and a silicon die. The III-V die is disposed on the substrate. The silicon die is stacked to the III-V and electrically connected to the III-V die.