-
公开(公告)号：US20230092003A1
公开(公告)日：2023-03-23
申请号：US17908934
申请日：2021-03-03
发明人： Udo HOFMANN
摘要： This invention is related to a process for purification of metallic objects comprising an oil-adsorbing step in the presence of a liquid and a layer silicate component.
-
公开(公告)号：US20220304164A1
公开(公告)日：2022-09-22
申请号：US17636500
申请日：2020-08-19
发明人： Akif ÖZKÖK , Bert REENTS , Mustafa ÖZKÖK , Marko MIRKOVIC , Markus YOUKHANIS , Horst BRÜGGMANN , Sven LAMPRECHT , Kai-Jens MATEJAT
摘要： The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of: a1) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a cover layer, and (iii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b1) depositing a conductive layer; or a2) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b2) depositing a conductive layer; and c) electrodepositing a copper filling in the microvia and a first copper layer on the conductive layer which form together a planar surface and the thickness of the first copper layer is from 0.1 to 3 μm.
-
公开(公告)号：US20220279662A1
公开(公告)日：2022-09-01
申请号：US17636502
申请日：2020-08-19
发明人： Bert REENTS , Akif ÖZKÖK , Soungsoo KIM , Horst BRÜGGMANN , Herwig Josef BERTHOLD , Marcin KLOBUS , Thomas SCHIWON , Marko MIRKOVIC
摘要： The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of: a) providing a multi-layer substrate; b) forming a non-copper conductive layer or a copper layer on the cover layer and on an inner surface of the through-hole, respectively on an inner surface of the grate structure; c) forming a patterned masking film; d) electrodepositing copper; e) removing the masking film; and f) electrodepositing a copper filling.
-
4.发明申请公开(公告)号：US20220220617A1
公开(公告)日：2022-07-14
申请号：US17614252
申请日：2020-05-28
发明人： Kadir TUNA
摘要： The present invention concerns a tin plating bath comprising tin ions; titanium ions as reducing agent suitable to reduce tin ions to metallic tin; and at least one compound selected from the group consisting sulfites, dithionites, thiosulfates, tetrathionates, polythionates, disulfites, sulfides, disulfide, polysulfide, elemental sulfur or mixtures thereof. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.
-
公开(公告)号：US20220074063A1
公开(公告)日：2022-03-10
申请号：US17312968
申请日：2019-12-11
发明人： Michael MUIGG , Anke WALTER , Matthias ROST , Sebastian KÜHNE
摘要： A method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath with a pH in the range from 4.1 to 6.9, the bath comprising trivalent chromium ions, formate ions, and optionally sulfate ions, (b) providing the at least one substrate and at least one anode, (c) immersing the at least one substrate in the aqueous deposition bath and applying an electrical current such that the chromium or chromium alloy layer is deposited on the substrate, the substrate being the cathode, wherein, if during or after step (c) the trivalent chromium ions have a concentration below a target concentration of trivalent chromium ions, then (d) adding dissolved trivalent chromium formate to the aqueous deposition bath such that trivalent chromium ions are present in a higher concentration than before step (d), with the proviso that solid trivalent chromium formate is dissolved in a separated partial volume taken from the aqueous deposition bath to obtain said dissolved trivalent chromium formate for step (d).
-
公开(公告)号：US20220033972A1
公开(公告)日：2022-02-03
申请号：US17297483
申请日：2019-10-07
IPC分类号： C23C18/18
摘要： The invention relates to an aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer on a substrate in manufacturing an article with an integrated circuit and a method and use thereof, wherein the solution comprises: at least one hydroxycarboxylic acid or salt thereof according to the general formula (I) [RCH2—(RCH)n—COO−]m Mm+ (I) wherein n is integer from 2 to 4 and m is 1 or 2, R is independently H or OH with proviso that at least one R is OH, and wherein Mm+ with m: 1 is hydrogen, ammonium or alkali metal; or Mm+ with m: 2 is earth alkali metal, at least one polyoxyethylene sorbitan fatty acid ester, at least one sulphonated fatty acid or a salt thereof.
-
公开(公告)号：US20210262105A1
公开(公告)日：2021-08-26
申请号：US17315810
申请日：2021-05-10
发明人： Kun SI , Ralf SCHMIDT , Onas BOLTON , Josef GAIDA , Frank VON HORSTEN , Dirk ROHDE , Himendra JHA , Jens PALM , Olivier MANN , Angela LLAVONA-SERRANO
IPC分类号： C25D3/38
摘要： The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.
-
公开(公告)号：US20210251085A1
公开(公告)日：2021-08-12
申请号：US17052545
申请日：2019-05-06
发明人： Norbert LÜTZOW , Wonjin CHO , Toshio HONDA , Dirk TEWS , Markku LAGER , Felix TANG , Mirko KLOPPISCH , Aaron HAHN , Gabriela SCHMIDT , Martin THOMS
摘要： The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.
-
公开(公告)号：US20210246565A1
公开(公告)日：2021-08-12
申请号：US15734257
申请日：2019-06-03
摘要： The present invention is related to an acidic zinc or zinc-nickel alloy electroplating bath for depositing a zinc or zinc-nickel alloy layer and a method for zinc or zinc-nickel alloy electroplating making use of such an electroplating bath.
-
公开(公告)号：US11035051B2
公开(公告)日：2021-06-15
申请号：US16323582
申请日：2017-08-10
发明人： Kun Si , Ralf Schmidt , Onas Bolton , Josef Gaida , Frank Von Horsten , Dirk Rohde , Himendra Jha , Jens Palm , Olivier Mann , Angela Llavona-Serrano
摘要： The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of Formula (Ia) (iii) one, two, three or more than three further compounds, which are different from the compound of Formula (Ia), with the definitions given below, the use of the acidic aqueous composition according to the invention for electrolytic copper plating, the use of the compound of Formula (Ia) in an acidic aqueous composition for electrolytic metal plating, a method of electrolytic copper plating using the acidic aqueous composition according to the invention, and specific compounds derived from Formula (Ia) for an acidic aqueous composition for electrolytic metal plating.
-
-
-
-
-
-
-
-
-
搜索结果
375 条记录 (耗时 0.029 秒)