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公开(公告)号：US12114547B2
公开(公告)日：2024-10-08
申请号：US17519585
申请日：2021-11-05
发明人： Kuo-Jui Chang , Wen-Tai Chen , Chi-Sheng Chiang , Yu-Chuan Liao , Chien-Sen Weng , Ming-Wei Sun
IPC分类号： H10K59/131 , H10K59/121
CPC分类号： H10K59/131 , H10K59/121
摘要： Provided is a display panel, including a substrate, multiple pixel circuits, an insulating layer, multiple first electrodes, a first isolation structure, and a second isolation structure. The pixel circuits are located on the substrate. The insulating layer is located on the pixel circuits and has multiple through holes. The first electrodes are located on the insulating layer and are respectively electrically connected to the pixel circuits through the through holes. The first isolation structure is located on the insulating layer and overlaps the through holes. The second isolation structure includes multiple separating parts and multiple cover parts. The separating parts and the first isolation structure at least partially overlap, and the cover parts respectively overlap the through holes and the first isolation structure.
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公开(公告)号：US12107202B2
公开(公告)日：2024-10-01
申请号：US17371069
申请日：2021-07-08
发明人： Hsin-Hung Sung , Yi-Wei Chen
CPC分类号： H01L33/62 , H01L33/005 , H01L2933/0066
摘要： An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.
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公开(公告)号：US12106598B2
公开(公告)日：2024-10-01
申请号：US17355202
申请日：2021-06-23
发明人： Shu-Wen Tzeng , Yan-Liang Chen , Jui-Chi Lo
IPC分类号： G06V40/13 , H10K59/124 , H10K59/131 , H10K59/40
CPC分类号： G06V40/1318 , H10K59/124 , H10K59/131 , H10K59/40
摘要： A fingerprint sensing device has a sensing area, an operation area, and a peripheral area, and the operation area is disposed between the sensing area and the peripheral area. The fingerprint sensing device includes a substrate, a sensing element located at the sensing area, an operation element located at the operation area, a first signal line located at the peripheral area, a first planarization layer, a first insulating layer, and a first shading layer. The first planarization layer is located on the substrate and has a first trench, and the first trench overlaps the first signal line. The first insulating layer is located on the first planarization layer and in the first trench, and the first insulating layer has a first opening located in the first trench. The first shading layer is located on the first insulating layer and connected to the first signal line through the first opening.
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公开(公告)号：US12095019B2
公开(公告)日：2024-09-17
申请号：US17509282
申请日：2021-10-25
发明人： Chia-Hui Pai , Wen-Hsien Tseng
CPC分类号： H01L33/62 , H01L33/005
摘要： A display device includes a light emitting element, an adhesive barrier wall and an array substrate. The light emitting element includes a first contact and a second contact disposed on a first surface of the light emitting element. The adhesive barrier wall is disposed on the first surface of the light emitting element and includes a first portion between the first contact and the second contact. The array substrate includes a first pad and a second pad disposed on a second surface of the array substrate. The first contact and the second contact of the light emitting element are respectively connected to the first pad and the second pad.
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公开(公告)号：US12094981B2
公开(公告)日：2024-09-17
申请号：US17511568
申请日：2021-10-27
发明人： Yang-Shun Fan , Chen-Shuo Huang
IPC分类号： H01L29/786 , H01L29/66
CPC分类号： H01L29/7869 , H01L29/6675 , H01L29/78672 , H01L29/78696
摘要： An active element and a manufacturing method thereof are provided. The active element includes a substrate, a switching bottom gate and a driving bottom gate disposed on the substrate, a first gate insulating layer disposed on the substrate and covering the switching bottom gate and the driving bottom gate, a switching channel and a driving channel disposed on the first gate insulating layer, a second gate insulating layer disposed on the first gate insulating layer and covering the switching channel and the driving channel, and a switching top gate and a driving top gate disposed on the second gate insulating layer. The driving channel has a low potential end electrically connected to the driving bottom gate. A thickness of the second gate insulating layer is greater than a thickness of the first gate insulating layer. The switching top gate is electrically connected to the switching bottom gate.
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公开(公告)号：US12046496B2
公开(公告)日：2024-07-23
申请号：US17481338
申请日：2021-09-22
发明人： Wei-Chieh Chen , Kuan-Yi Lee , Wen-Hsien Tseng
IPC分类号： H01L21/00 , H01L21/67 , H01L21/673 , H01L21/68 , H01L25/075 , H01L33/00
CPC分类号： H01L21/67326 , H01L21/67115 , H01L21/68 , H01L25/0753 , H01L33/005 , H01L2221/68313 , H01L2221/68372
摘要： A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.
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公开(公告)号：US12034106B2
公开(公告)日：2024-07-09
申请号：US17464729
申请日：2021-09-02
发明人： Cheng-Wei Jiang , Yi-Da He
CPC分类号： H01L33/62 , G09F9/301 , G09F9/33 , H01L27/156 , H01L33/12
摘要： The present disclosure provides a flexible display panel, which includes a substrate, a plurality of hollow regions, a plurality of display units, a plurality of wire structures, and a plurality of spacers. The substrate is defined as a plurality of island regions and a plurality of bridge regions. Each of the hollow regions is surrounded by four adjacent of the island regions and four adjacent of the bridge regions. The display units are respectively disposed on the island regions of the substrate. The wire structures are respectively disposed on the bridge regions and electrically connected to the display units. Each of the wire structures includes at least one wire layer including at least one wire disposed on the substrate. The spacers are disposed on and in contact with the substrate, and respectively surround the hollow regions, and separated from the wire structures to control etching sizing.
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公开(公告)号：US12034103B2
公开(公告)日：2024-07-09
申请号：US18328112
申请日：2023-06-02
发明人： I-Hsun Hsieh
IPC分类号： H01L33/60 , G02F1/13357 , H01L33/50 , H01L33/62
CPC分类号： H01L33/60 , G02F1/133603 , G02F1/133611 , H01L33/50 , H01L33/62 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
摘要： A light emitting diode structure includes a substrate, a chip on a top surface of the substrate, transparent cup walls on the top surface of the substrate and surround the chip, a wavelength conversion layer covering the chip between the transparent cup walls, and a reflective layer on the wavelength conversion layer. The reflective layer includes a curved bottom surface protruding toward the chip and directly contacting a top surface of the wavelength conversion layer. An edge of the reflective layer directly contacts the transparent cup walls and the wavelength conversion layer. The wavelength conversion layer fills a space defined by the substrate, the transparent cup walls and the reflective layer such that a bottom surface, a side surface, and the top surface of the wavelength conversion layer directly contacts the substrate, the transparent cup walls, and the reflective layer, respectively.
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公开(公告)号：US11980072B2
公开(公告)日：2024-05-07
申请号：US17513912
申请日：2021-10-29
发明人： Zih-Shuo Huang , Tsung-Ying Ke , Shang-Kai Shen
IPC分类号： H10K59/131 , H10K50/80 , H10K77/10
CPC分类号： H10K59/131 , H10K50/80 , H10K77/111
摘要： A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.
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公开(公告)号：US11963300B2
公开(公告)日：2024-04-16
申请号：US17371135
申请日：2021-07-09
发明人： Chun-Yueh Hou , Hao-An Chuang , Fan-Yu Chen , Hsi-Hung Chen , Yun Cheng , Wen-Chang Hsieh , Chih-Wen Lu
CPC分类号： H05K1/111 , H05K3/22 , H05K3/4644 , H05K2201/10227
摘要： A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
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