PEELING DEVICE FOR RESIN LAYER COATING RECTANGULAR WIRE AND METHOD OF PEELING OFF RESIN LAYER COATING RECTANGULAR WIRE

    公开(公告)号:US20220102950A1

    公开(公告)日:2022-03-31

    申请号:US17536162

    申请日:2021-11-29

    发明人: Keisuke ATSUMI

    IPC分类号: H02G1/12 H01F41/04

    摘要: A peeling device for a resin layer coating a rectangular wire in which an outer side of a metal conductor having a rectangular shape in cross section is coated with the resin layer, including a processing blade configured to peel off the resin layer, a jig configured to hold the rectangular wire, and a position detection means configured to detect a position of a cutting edge of the processing blade with respect to a surface of the metal conductor, in which the cutting edge of the processing blade is caused to penetrate into a predetermined thickness position of the resin layer, and the processing blade and the rectangular wire are relatively moved in a longitudinal direction of the rectangular wire without contact of the cutting edge with the metal conductor to perform treatment of peeling off the resin layer.

    Insulated wire
    3.
    发明授权

    公开(公告)号:US11450450B2

    公开(公告)日:2022-09-20

    申请号:US17034237

    申请日:2020-09-28

    摘要: An insulated wire comprising a conductor and a bubble-containing insulating layer, directly or indirectly coating the outer periphery of the conductor and containing a thermosetting resin, wherein the bubbles in the bubble-containing insulating layer include flattened bubbles whose oblateness in the cross-section perpendicular to the longitudinal direction of the insulated wire (lateral length of the bubble cross-sectional shape/vertical length of the bubble cross-sectional shape) is 1.5 or more and 5.0 or less.

    Insulated wire, coil, and electrical or electronic equipment

    公开(公告)号:US11437163B2

    公开(公告)日:2022-09-06

    申请号:US17037013

    申请日:2020-09-29

    IPC分类号: H01B3/30 C08G73/10 C09D179/08

    摘要: An insulated wire, containing a conductor and an insulating film provided in contact with the conductor, in which the insulating film provided in contact with the conductor contains a polyimide resin, and the polyimide resin contains a constituting unit (A) derived from 2,2-bis[4-(4-amininophenoxy)phenyl]propane and a constituting unit (B) derived from 9,9-bis(4-aminophenyl)fluorene as a diamine-derived constituting unit; the polyimide resin has an imide group concentration of 25.0% or less; and the ratio of the content of the constituting unit (B) occupied in the diamine-derived constituting unit in the polyimide resin is 1 to 40 mol %.

    Insulated wire, coil, and electric/electronic equipments

    公开(公告)号:US11217364B2

    公开(公告)日:2022-01-04

    申请号:US16935426

    申请日:2020-07-22

    摘要: An insulated wire containing a thermoplastic resin layer (A) as a covering layer directly or indirectly on a rectangular conductor, in which the insulated wire has at least one protruding part which is continuous in a longitudinal direction of said insulated wire, on a surface of a portion of the thermoplastic resin layer (A), which portion corresponds to at least one side of a cross-section of the insulated wire, said protruding part and a flat part of the surface having the protruding part forms a curved portion with a radius of curvature of 0.01 to 0.75 mm in the cross-section of the insulated wire, and a lateral face of the protruding part has a slope of less than 90° to the flat part of the surface having the protruding part in the cross-section of the insulated wire, a coil produced by processing the insulated wire by winding, and an electric/electronic equipment comprising the coil.

    Insulated wire
    9.
    发明授权

    公开(公告)号:US11437167B2

    公开(公告)日:2022-09-06

    申请号:US16909861

    申请日:2020-06-23

    摘要: An insulated wire includes: a copper alloy conductor; and at least one resin layer directly or indirectly coated on an outer peripheral face of the copper alloy conductor, in which the copper alloy conductor has a composition where a total content of metal components selected from Al, Be, Cd, Mg, Pb, Ni, P, Sn, and Cr is from 0.1 to 2.0 ppm and content of copper is 99.96 mass % or higher, and has a specific texture where an average orientation density in an area where φ2=0 degrees, φ1=0 degrees, and Φ=from 0 degrees to 90 degrees is from 3.0 to less than 35.0, and a maximum orientation density in an area where φ2=35 degrees, φ1=from 45 degrees to 55 degrees, and Φ=from 65 degrees to 80 degrees is from 1.0 to less than 30.0.