公开(公告)号：US10741309B2

公开(公告)日：2020-08-11

申请号：US16682075

申请日：2019-11-13

Applicant: David Smathers ,  Paul Aimone

Inventor： David Smathers ,  Paul Aimone

IPC: H01B12/10 ,  H01L39/12 ,  H01B12/06 ,  H01L39/14 ,  H01L39/24

Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

公开(公告)号：US10727032B2

公开(公告)日：2020-07-28

申请号：US16238844

申请日：2019-01-03

Applicant: H.C. Starck Inc.

Inventor： Gary Alan Rozak ,  Mark E. Gaydos

IPC: C23C14/34 ,  H01J37/34 ,  B22F1/00 ,  B22F3/15 ,  B22F3/24 ,  C22C27/04

Abstract: A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 μm width (e.g., less than about 50 μm width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.

公开(公告)号：US10401994B2

公开(公告)日：2019-09-03

申请号：US15873969

申请日：2018-01-18

Applicant: H.C. Starck Inc.

Inventor： Helia Jalili ,  Francois Dary ,  Barbara Cox

IPC: G06F3/041 ,  G02F1/1362 ,  H01L23/532 ,  H01L21/768 ,  C25D11/02 ,  H01L27/15 ,  G02F1/1333

Abstract: In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate bilayer capping layers and/or barrier layers.

公开(公告)号：US10213859B2

公开(公告)日：2019-02-26

申请号：US15045825

申请日：2016-02-17

Applicant: Maria Bozena Winnicka ,  Scott Jeffrey Volchko ,  Stan Wojciechowski ,  Abhishek Bhattacharyya

Inventor： Maria Bozena Winnicka ,  Scott Jeffrey Volchko ,  Stan Wojciechowski ,  Abhishek Bhattacharyya

IPC: B23K37/00 ,  B23K1/00 ,  B23K1/008 ,  F27D5/00

Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.

公开(公告)号：US10186530B2

公开(公告)日：2019-01-22

申请号：US15249603

申请日：2016-08-29

Applicant: Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

Inventor： Patrick Hogan ,  John Moore ,  Alex Brewer ,  Jared Pettit

IPC: H01L21/3205 ,  C23F1/16 ,  H01L27/12 ,  C23F1/02 ,  H01L29/66 ,  H01L21/283 ,  H01L29/49 ,  H01L29/423 ,  H01L29/786 ,  H01L21/3213 ,  C23F1/18 ,  C23F1/26 ,  C23F1/30 ,  H01L29/417 ,  G02F1/1343 ,  G02F1/1368

Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

公开(公告)号：US10105671B2

公开(公告)日：2018-10-23

申请号：US14936916

申请日：2015-11-10

Applicant: Paul R. Aimone ,  Marc Abouaf ,  Patrick Hogan

Inventor： Paul R. Aimone ,  Marc Abouaf ,  Patrick Hogan

IPC: B01J19/00 ,  B01J19/02 ,  B22F3/105 ,  B01J19/24 ,  B22F5/10 ,  B33Y10/00 ,  B33Y80/00 ,  B22F3/00 ,  B22F3/12

Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.

公开(公告)号：US09929187B2

公开(公告)日：2018-03-27

申请号：US14296800

申请日：2014-06-05

Applicant: Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

Inventor： Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

IPC: H01B1/02 ,  H01L27/12 ,  B81C1/00 ,  C22F1/04 ,  C22F1/00 ,  C22F1/08 ,  C22F1/14 ,  C21D1/00 ,  C21D9/00 ,  H01L29/66 ,  G06F3/041 ,  H01L29/49 ,  H01L23/532 ,  H01L29/786 ,  G06F3/044

CPC classification number: H01L27/1244 ,  B81C1/00 ,  B81C1/00031 ,  B81C1/00404 ,  B81C1/00523 ,  B81C1/00547 ,  C21D1/00 ,  C21D9/00 ,  C21D2201/00 ,  C21D2211/00 ,  C21D2251/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/14 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/026 ,  H01L23/53238 ,  H01L29/4908 ,  H01L29/6675 ,  H01L29/78603 ,  H01L29/78666 ,  H01L2924/0002 ,  Y10T428/12611 ,  Y10T428/1266 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  H01L2924/00

Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

公开(公告)号：US09837253B2

公开(公告)日：2017-12-05

申请号：US14813732

申请日：2015-07-30

Applicant: H.C. STARCK INC.

Inventor： Gary Alan Rozak ,  Mark E. Gaydos ,  Patrick Alan Hogan ,  Shuwei Sun

IPC: B22F7/02 ,  H01J37/34 ,  C23C14/58 ,  C23C14/54 ,  C23C14/35 ,  C23C14/34 ,  G06F3/044 ,  C03C17/40 ,  C22C1/04 ,  C22C27/04 ,  C23G1/10 ,  C23G1/20 ,  C23C14/16 ,  C23C14/06 ,  C23C14/14

CPC classification number: H01J37/3429 ,  B22F2998/10 ,  C03C17/40 ,  C22C1/045 ,  C22C27/04 ,  C23C14/0688 ,  C23C14/14 ,  C23C14/16 ,  C23C14/34 ,  C23C14/3407 ,  C23C14/3414 ,  C23C14/3492 ,  C23C14/35 ,  C23C14/548 ,  C23C14/5873 ,  C23G1/106 ,  C23G1/205 ,  G06F3/044 ,  G06F2203/04103 ,  Y10T428/12014 ,  Y10T428/12021 ,  Y10T428/12597 ,  Y10T428/31678 ,  B22F1/0003 ,  B22F3/02 ,  B22F3/18

Abstract: The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

公开(公告)号：US09725793B2

公开(公告)日：2017-08-08

申请号：US12109765

申请日：2008-04-25

Applicant: Paul R. Aimone ,  Evan Hinshaw

Inventor： Paul R. Aimone ,  Evan Hinshaw

IPC: C22C27/02 ,  C22B34/24 ,  C22B9/20 ,  C22B9/22

CPC classification number: C22C27/02 ,  C22B9/20 ,  C22B9/22 ,  C22B34/24

Abstract: A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Jr, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy.

公开(公告)号：US09521706B2

公开(公告)日：2016-12-13

申请号：US14259800

申请日：2014-04-23

Applicant: Joseph Hirt ,  John Eiler

Inventor： Joseph Hirt ,  John Eiler

IPC: C03B5/027 ,  H05B3/60 ,  H05B7/06 ,  H05B7/08 ,  H05B3/03

CPC classification number: H05B3/03 ,  C03B5/027

Abstract: In various embodiments, an electrode has a shaft extending from an electrode head and a cooling passage extending from an open end disposed at an attachment end of the shaft to a closed end disposed within the electrode head. The electrode head has an approximately teardrop shape with a smoothly rounded outer contour.

Abstract translation: 在各种实施例中，电极具有从电极头延伸的轴和从设置在轴的附接端处的开放端延伸到设置在电极头内的封闭端的冷却通道。 电极头具有大致泪珠形状，具有平滑的圆形外轮廓。