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1.发明申请ADHESIVE COMPOSTIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF 审中-公开具有宽服务温度窗口的粘合剂组合物及其使用公开(公告)号：US20140272214A1
公开(公告)日：2014-09-18
申请号：US13795403
申请日：2013-03-12
申请人： HENKEL CORPORATION , HENKEL LTD.
发明人： Richard Ellis , Geetanjaliben Shah , Andrea Eodice
IPC分类号： C09J153/00
CPC分类号： C09J123/0815 , C08L9/06 , C08L23/04 , C08L23/0815 , C08L23/0838 , C08L23/0846 , C08L51/06 , C08L53/025 , C08L2205/03 , C08L2205/035 , Y10T428/13 , Y10T428/1303 , Y10T428/1307 , Y10T428/1334 , Y10T428/2878 , Y10T428/2891
摘要： The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than −35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.
摘要翻译： 本发明提供热熔粘合剂，其包含（A）由（1）无定型α-烯烃，（2）Tg值等于或小于-35℃的乙烯共聚物组成的聚合物的混合物; 和（3）苯乙烯嵌段共聚物; 和（B）用官能团接枝的聚乙烯蜡。 这些热熔粘合剂具有高耐热性和良好的低温性能，使得它们特别适合于线封包装应用。
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2.发明申请ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY INSULATING COMPOSITION 有权用热吸收和/或热绝缘组合物组装的电子器件公开(公告)号：US20140268579A1
公开(公告)日：2014-09-18
申请号：US13844890
申请日：2013-03-16
申请人： HENKEL CORPORATION
发明人： My N. Nguyen , Jason Brandi
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , H01L23/373 , H01L23/3732 , H01L23/3736 , H01L23/3737 , H01L23/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.
摘要翻译： 本文提供了组装有吸热和/或隔热组合物的电子设备。
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公开(公告)号：US20140262022A1
公开(公告)日：2014-09-18
申请号：US13839785
申请日：2013-03-15
申请人： Henkel Corporation
发明人： Jianping Liu , Andrus Maandi
IPC分类号： C09J11/06
CPC分类号： C09J171/08 , C08F2222/1013 , C08G18/36 , C08G18/672 , C08G18/755 , C08G2170/80 , C09J4/00 , C09J5/00 , C09J11/06 , C09J175/16 , C09J2400/163 , C09J2433/00 , C09J2475/00 , Y10T156/10
摘要： The invention provides anaerobic curable compositions, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces.
摘要翻译： 本发明提供了厌氧可固化组合物及其生产和使用方法。 这些组合物特别在油性表面上提供优异的粘合性。
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公开(公告)号：US20140235127A1
公开(公告)日：2014-08-21
申请号：US13826809
申请日：2013-03-14
申请人： HENKEL CORPORATION
CPC分类号： C09J153/00 , B32B5/022 , B32B7/12 , B32B27/12 , B32B27/327 , B32B2307/51 , B32B2307/548 , B32B2307/704 , B32B2555/02 , Y10T442/602
摘要： The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications.
摘要翻译： 本发明涉及包含非茂金属催化聚合物的弹性附着粘合剂。 弹性附着粘合剂在延长的老化参数下具有稳定的蠕变性能，使得这些粘合剂特别适用于弹性应用。
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公开(公告)号：US20140232041A1
公开(公告)日：2014-08-21
申请号：US13770295
申请日：2013-02-19
发明人： Qiwen Han , Andreas Ferencz , Olaf Lammerschop , Yongxia Wang
IPC分类号： C08K5/521
摘要： An internal mold release agent (IMRA) which effectively releases a cured polyurethane (PU) material from a metal, in particular steel, mold. The IMRA is a surface active agent containing phosphorus or a combination (blend or reaction product) of the agent with other chemicals. In one embodiment the agent is a phosphate ester. In one embodiment the agent is polyoxyethylene alkyl phosphate ester. A polyurethane formulation comprising the IMRA has high formulation stability, clean release, low release strength, and high product transparency.
摘要翻译： 内部脱模剂（IMRA），其有效地从金属，特别是钢模具中释放固化的聚氨酯（PU）材料。 IMRA是含有磷或其他化学物质的组合（共混物或反应产物）的表面活性剂。 在一个实施方案中，试剂是磷酸酯。 在一个实施方案中，试剂是聚氧乙烯烷基磷酸酯。 包含IMRA的聚氨酯配方具有高配方稳定性，清洁释放，低释放强度和高产品透明度。
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公开(公告)号：US20140225283A1
公开(公告)日：2014-08-14
申请号：US13833634
申请日：2013-03-15
申请人： HENKEL CORPORATION
发明人： Gyanendra Dutt , Qizhuo Zhuo , Elizabeth Hoang , Stephen Ruatta
IPC分类号： H01L23/488
CPC分类号： H01L23/488 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2224/27416 , H01L2224/27418 , H01L2224/27848 , H01L2224/2919 , H01L2224/83191 , H01L2224/83856 , H01L2224/94 , H01L2924/00014 , H01L2224/27
摘要： A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
摘要翻译： 半导体组件包括半导体晶片，设置在晶片的背面上的粘合剂涂层和裸露的切割带，优选地是紫外线辐射透明的。 通过以下方法制备组件：（a）提供半导体晶片，（b）在半导体晶片上设置晶片背面涂层，（c）将晶片背面涂层部分固化至其粘附到背面的程度 并且保持粘性，并且（d）任选地在热和压力下将裸露切割带与部分固化和发粘的晶片背面涂层接触。
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公开(公告)号：US20130287980A1
公开(公告)日：2013-10-31
申请号：US13796588
申请日：2013-03-12
申请人： Henkel Corporation
CPC分类号： C09D133/08 , B32B37/1284 , C09D123/22 , C09J4/00 , C09J4/06 , C09J123/22 , C09K3/10 , C09K3/1006 , C09K2003/1068 , C09K2200/0617 , C09K2200/0625 , F16J15/14 , Y10T428/1352
摘要： Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.
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8.发明申请公开(公告)号：US20130197130A1
公开(公告)日：2013-08-01
申请号：US13799363
申请日：2013-03-13
申请人： HENKEL CORPORATION
发明人： Eric C. Wang , Kevin Harris Becker , Qizhuo Zhuo
IPC分类号： C09J163/04
CPC分类号： C09J163/04 , C08G59/08 , C08G59/34 , C08G59/68 , C09J4/06 , C09J121/00 , C09J163/10
摘要： An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
摘要翻译： 包含弹性体聚合物，环氧树脂，反应性稀释剂和填料的粘合剂组合物适用于电子工业内，特别是用于晶片背面涂料粘合剂。 弹性体聚合物是乙烯基弹性体和环氧弹性体的混合物; 反应性稀释剂是两种或更多种稀释剂的组合，其中之一必须具有碳碳不饱和度，在固化后提供组合物内的交联; 并且填料是非导电填料。
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公开(公告)号：US20130187102A1
公开(公告)日：2013-07-25
申请号：US13799002
申请日：2013-03-13
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08K3/08 , C08K5/14 , C08K7/06 , C09J11/02 , H01B1/22 , H01L2224/29339 , H01L2924/01322 , H01L2924/13055 , H01L2924/00
摘要： A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
摘要翻译： 导电组合物包含（i）具有4.6g / cc或更高的振实密度的微米或亚微米级的薄片，和（ii）溶解银表面上存在的任何脂肪酸润滑剂或表面活性剂的溶剂。 在一个实施方案中，（iii）存在少量的过氧化物。 组合物中不存在有机树脂。
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公开(公告)号：US08481659B2
公开(公告)日：2013-07-09
申请号：US13269138
申请日：2011-10-07
IPC分类号： C08F120/68 , C07D215/06
CPC分类号： C08K5/34 , C07D209/08 , C07D215/04 , C08K5/1515 , C08K2201/014
摘要： The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants.
摘要翻译： 本发明涉及可用于厌氧可固化组合物如粘合剂和密封剂的固化促进剂。
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