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    Accelerator systems for low-temperature curing
    1.
    发明授权
    Accelerator systems for low-temperature curing 有权
    加速器系统用于低温固化

    公开(公告)号：US07858713B2

    公开(公告)日：2010-12-28

    申请号：US10552908

    申请日：2004-04-13

    申请人： Ulrich Weidmann

    发明人： Ulrich Weidmann

    IPC分类号： C08G8/28 ,  C08G59/68 ,  C08F283/00 ,  C07D293/00 ,  C07D233/00

    CPC分类号： C08G59/686 ,  C08G59/68

    摘要： Composition comprising as component A) a 1-imidazoly[mothyl-substituted 2-naphthol compound of the general formula (I) where R1, R2 and R3 each independently of one another are H; C1-17alkyl; C3-12cycloalkyl, optionally substituted by c1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10aryl, optionally substituted by 1-3 C1-4-alkyl groups; C7-15,phonylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; or aromatic or aliphatic C3-12acyf; R4, R5, R6, R7, R8, and R9 each independently of one another are H; C1-12alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyf groups; C6-10aryl, optionally substituted by 1-3 C1-4alkyl groups; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; C1-12alkoxy; or OH; and as component B) a phenol which is liquid at room temperature, the weight ratio of component A) to component B) being from 10:90 to 80:20 as accelerator for curable epoxy resin compositions which are used as a compression moulding compound, sinter powder, encapsulating system, casting resin, or for producing prepregs and laminates having very good interlaminar shear strength values using impregnating methods or injection methods, for producing components, especially components of large surface area.

    摘要翻译： 组合物，其包含作为组分A）的通式（I）的1-咪唑基[桂基取代的2-萘酚化合物，其中R 1，R 2和R 3各自独立地为H; C1-17烷基; 任选被C 1-4烷基取代的C 3-12环烷基; 任选被C 1-4烷基取代的C 4-20环烷基 - 烷基; 任选被1-3个C 1-4 - 烷基取代的C 6-10芳基; C7-15，任选被1-3个C 1-4烷基取代的芳基烷基; C3-17烯基; C3-12炔基; 或芳族或脂族C3-12acyf; R 4，R 5，R 6，R 7，R 8和R 9各自独立地为H; C 1-12烷基; 任选被C 1-4烷基取代的C 3-12环烷基; 任选被C 1-4烷基取代的C 4-20环烷基 - 烷基; 任选被1-3个C 1-4烷基取代的C 6-10芳基; 任选被1-3个C 1-4烷基取代的C 7-15苯基烷基; C3-17烯基; C3-12炔基; C1-12烷氧基; 或OH; 和作为组分B）在室温下为液体的苯酚，组分A）与组分B）的重量比为10:90至80:20，作为用作压缩模塑料的可固化环氧树脂组合物的促进剂， 烧结粉末，包封系统，铸塑树脂，或用于制备具有非常好的层间剪切强度值的浸渍方法或注射方法的预浸料和层压材料，用于生产组分，特别是大表面积的组分。

    Adhesion promoters for plastisols
    3.
    发明申请
    Adhesion promoters for plastisols 审中-公开
    增塑溶胶的粘合促进剂

    公开(公告)号：US20070043153A1

    公开(公告)日：2007-02-22

    申请号：US10564068

    申请日：2004-07-08

    申请人： Alfred Kruse ,  Christa Broll ,  Jorg Volle

    发明人： Alfred Kruse ,  Christa Broll ,  Jorg Volle

    IPC分类号： C08K5/06

    CPC分类号： C08K5/06 ,  C08L27/06 ,  C08L77/08 ,  C08L2666/20

    摘要： The invention relates to adhesion promoters for plastisols based on polyaminoamides, characterized in that the adhesion promoter comprises not only a polyaminoamide but also at least 10% by weight, and at most 60% by weight, based on the total amount of adhesion promoter, of ethyldiglycol (ethyl Carbitol), and to a process for the production of coatings and adhesive bonds for materials, and also to plastisols in which these adhesion promoters are used concomitantly.

    摘要翻译： 本发明涉及基于聚氨基酰胺的增塑溶胶的粘合促进剂，其特征在于粘合促进剂不仅包含聚氨基酰胺，而且包括至少10重量％，最多60重量％，基于粘合促进剂的总量， 乙基二甘醇（乙基卡必醇），以及用于生产用于材料的涂料和粘合剂粘合剂的方法，以及其中同时使用这些粘合促进剂的增塑溶胶。

    Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds
    4.
    发明授权
    Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds 失效
    聚亚烷基二醇单缩水甘油醚和胺化合物的加合物

    公开(公告)号：US07001977B2

    公开(公告)日：2006-02-21

    申请号：US10472100

    申请日：2002-03-06

    申请人： Wolfgang Scherzer ,  Jörg Volle ,  Doris Fitzek

    发明人： Wolfgang Scherzer ,  Jörg Volle ,  Doris Fitzek

    IPC分类号： C08L63/00 ,  C08G65/26

    CPC分类号： C08G59/184

    摘要： The present invention relates to adducts obtainable by reaction of: A) an amine compound containing 2 or more than 2 amino groups: with B) a polyalkylene glycol monoglycidyl ether of general formula (I), in which R independently of one another (for n>1), is an —H or —CH, radical, and n=1 to 50, characterized in that the reaction ratio of components A) and B) is selected in such a way that the resultant adduct contains 2 or more than 2 amine hydrogen groups: to curable compositions based on these adducts with epoxy resins, and to the use of these curable compositions as casting resin, adhesive, matrix resin, tooling resin or as coating composition, in particular for self-flowing coatings.

    摘要翻译： 本发明涉及通过以下反应获得的加合物：A）含有2个或多于2个氨基的胺化合物：和B）通式（I）的聚亚烷基二醇单缩水甘油醚，其中R彼此独立地（对于n > 1）中，是-H或-CH，基团，且n = 1-50，其特征在于组分A）和B）的反应比例选择为使得所得加合物含有2个或多于2个 胺氢基团：基于与环氧树脂的这些加合物的可固化组合物，以及这些可固化组合物作为浇铸树脂，粘合剂，基质树脂，模具树脂或作为涂料组合物，特别是用于自流平涂料的用途。

    Optical microelectromechantical structure
    7.
    发明授权
    Optical microelectromechantical structure 失效
    光学微电子结构

    公开(公告)号：US07489837B2

    公开(公告)日：2009-02-10

    申请号：US10559310

    申请日：2003-06-06

    申请人： Jan Tue Ravnkilde ,  Henning Henningsen

    发明人： Jan Tue Ravnkilde ,  Henning Henningsen

    IPC分类号： G02B6/12

    CPC分类号： B81C3/008 ,  B81B2201/045 ,  B81C2203/0109 ,  G02B26/02

    摘要： The invention relates to an optical microelectromechanical structure (MEMS) comprising—an (at least one) optically transmissive layer (UTL)—an (at least one) intermediate layer structure (IL)—a (at least one) device layer (DL) said intermediate layer structure (IL) defining one or more optical paths (OP) between said substantially optically transmissive layer (UTL) and said device layer (DL), said intermediate structure layer (IL) defining the distance (d) between said optically transmissive layer (UTL) and said device layer (DL).

    摘要翻译： 本发明涉及一种光学微机电结构（MEMS），其包括 - （至少一个）光学透射层（UTL） - （至少一个）中间层结构（IL）-a（至少一个）器件层（DL） 所述中间层结构（IL）限定所述基本光学透射层（UTL）和所述器件层（DL）之间的一个或多个光路（OP），所述中间结构层（IL）限定所述光学透射 层（UTL）和所述设备层（DL）。

    Impregnating reinforcing material with photopolymerizable epoxy resin composition
    8.
    发明授权
    Impregnating reinforcing material with photopolymerizable epoxy resin composition 失效
    用光聚合环氧树脂组合物浸渍增强材料

    公开(公告)号：US07488785B2

    公开(公告)日：2009-02-10

    申请号：US11732921

    申请日：2007-04-05

    申请人： Frans Setiabudi

    发明人： Frans Setiabudi

    IPC分类号： B05D3/06 ,  B32B27/04 ,  C08L63/02 ,  C08L63/04

    CPC分类号： C08G59/50 ,  C08G59/18 ,  C08L63/00 ,  Y10T428/24994 ,  Y10T428/31511

    摘要： Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.

    摘要翻译： 包含（a）液体环氧树脂，（b）脂族或脂环族伯单胺和/或脂族或脂环族二元二胺的组合物，（c）环氧树脂（a）的潜在性固化剂，其在上述温度之前不反应 70℃（通过DSC以10℃/分钟的加热速率测定），（d）光聚合性化合物和（e）光引发剂，环氧基的当量数与可聚合的 基团为1:0.01至1:0.7，适合作为浸渍树脂。

    Epoxy resin composition
    9.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号：US07442434B2

    公开(公告)日：2008-10-28

    申请号：US10551938

    申请日：2004-04-05

    申请人： Frans Setiabudi ,  Ulrich Weidmann ,  Philippe Michaud

    发明人： Frans Setiabudi ,  Ulrich Weidmann ,  Philippe Michaud

    IPC分类号： B32B27/04 ,  B32B27/26 ,  B32B27/38 ,  C08L63/00

    CPC分类号： C08J5/24 ,  C08G59/4042 ,  C08G59/56 ,  C08J2363/00 ,  Y10T428/24994 ,  Y10T428/31511

    摘要： A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing tertiary amine. The epoxy resin matrix composition is used as an impregnating resin to form impregnated fiber composite materials.

    摘要翻译： 一种无溶剂的环氧树脂基质组合物，其包含：（a）液体环氧树脂或环氧树脂的液体混合物，（b）亚苄基胺化合物，（c）脂族或脂环族伯胺和/或二仲二胺; 和（d）催化固化的叔胺。 环氧树脂基质组合物用作浸渍树脂以形成浸渍纤维复合材料。