公开(公告)号：US20230118928A1

公开(公告)日：2023-04-20

申请号：US17635783

申请日：2021-07-05

申请人： Ibiden Co., Ltd.

发明人： Naoki TAKAHASHI ,  Hisashi ANDO

IPC分类号： H01M10/658 ,  H01M10/613

摘要： Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). An average fiber diameter of the first inorganic fibers (30) is larger than an average fiber diameter of the second inorganic fibers (31). The first inorganic fibers (30) have a linear shape or a needle shape, and the second inorganic fibers (31) have a dendritic shape or a crimped shape.

公开(公告)号：US20230113278A1

公开(公告)日：2023-04-13

申请号：US17936924

申请日：2022-09-30

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Yuji Ikawa

IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K3/26 ,  H05K1/03

摘要： A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.

公开(公告)号：US11622446B2

公开(公告)日：2023-04-04

申请号：US17359805

申请日：2021-06-28

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H05K1/11 ,  H05K1/09 ,  H01L23/00 ,  H01L23/498

摘要： A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

公开(公告)号：US11606861B2

公开(公告)日：2023-03-14

申请号：US17578671

申请日：2022-01-19

申请人： IBIDEN CO., LTD.

发明人： Kyohei Yoshikawa

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A printed wiring board includes a first resin insulating layer, a conductor layer on the first resin insulating layer, and a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is covering the conductor layer. The conductor layer includes a first circuit having a width of 15 μm or less and a rectangular cross-sectional shape, a second circuit having a trapezoidal cross-sectional shape, a third circuit, a fourth circuit, a fifth circuit, and a sixth circuit, a space between the first and third circuits has a width of 14 μm or less, a space between the first and fourth circuits has a width of 14 μm or less, a space between the second and fifth circuits has a width of 20 μm or more, and a space between the second and sixth circuits has a width of 20 μm or more.

公开(公告)号：US20230071257A1

公开(公告)日：2023-03-09

申请号：US17822927

申请日：2022-08-29

申请人： IBIDEN CO., LTD.

发明人： Susumu KAGOHASHI ,  Maaya TOMIDA

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.

公开(公告)号：US20230019554A1

公开(公告)日：2023-01-19

申请号：US17811707

申请日：2022-07-11

申请人： IBIDEN CO., LTD.

发明人： Yuji KADOWAKI ,  Tomomi KANO

IPC分类号： H05K3/02 ,  H05K3/00 ,  C25D5/02 ,  C25D5/22 ,  C25D5/54 ,  C25D7/00

摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

公开(公告)号：US20230011786A1

公开(公告)日：2023-01-12

申请号：US17811318

申请日：2022-07-08

申请人： IBIDEN CO., LTD.

发明人： Yoshinori TAKENAKA

IPC分类号： H05K1/02 ,  H05K1/18

摘要： A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the smallest line width of the wirings in the embedded wiring layer is in the range of 2 μm to 8 μm, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the smallest line width of the wirings in the embedded wiring layer.

公开(公告)号：US20230007768A1

公开(公告)日：2023-01-05

申请号：US17809352

申请日：2022-06-28

申请人： IBIDEN CO., LTD.

发明人： Masatoshi KUNIEDA

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18

摘要： A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

公开(公告)号：US20220346240A1

公开(公告)日：2022-10-27

申请号：US17723638

申请日：2022-04-19

申请人： IBIDEN CO., LTD.

发明人： Keisuke SHIMIZU ,  Kohei SUZUKI

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  C25D5/02 ,  C25D7/00 ,  C23C28/00 ,  C23C18/16

摘要： A method for manufacturing a wiring substrate includes forming a conductor layer including first and second pads, forming a resin insulating layer on the conductor layer, forming, in the insulating layer, a first opening exposing the first pad and a second opening exposing the second pad, forming a covering layer on the insulating layer such that the covering layer covers the first and second openings, forming a third opening in the covering layer such that the third opening communicates with the first opening and the first pad is exposed in the third opening, forming, on a surface of the first pad, a protective film formed of material different from material forming the conductor layer, removing the covering layer from the insulating layer, and forming a conductor post on the second pad such that the conductor post is formed of material that is same as the material forming the conductor layer.

公开(公告)号：US11437290B2

公开(公告)日：2022-09-06

申请号：US16869945

申请日：2020-05-08

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/28 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.