DRIVER CIRCUIT FOR EVALUATION OF AN OPTICAL EMITTER

    公开(公告)号:US20230051475A1

    公开(公告)日:2023-02-16

    申请号:US17451742

    申请日:2021-10-21

    IPC分类号: H01S5/042 H01S5/026 H01S5/183

    摘要: A driver circuit may include an optical emitter, a capacitive element, and an inductive element. The driver circuit may include a first switch that, in a closed state, is to cause charging of the inductive element, and when transitioning from the closed state to an open state is to cause discharging of the inductive element to charge the capacitive element. The driver circuit may include a second switch that in a closed state is to cause discharging of the capacitive element to provide an electrical pulse to the optical emitter. The driver circuit may include a signal generator configured to generate a first signal for controlling the open state and the closed state of the first switch, and a pulse shortening element configured to shorten a pulse width of the first signal to generate a second signal for controlling the open state and the closed state of the second switch.

    RAMAN DEPRESSING FIBER
    2.
    发明申请

    公开(公告)号:US20230034097A1

    公开(公告)日:2023-02-02

    申请号:US17453441

    申请日:2021-11-03

    IPC分类号: G02F1/365

    摘要: In some implementations, a monolithic optical fiber may comprise a tapered core having a first diameter at an input end and a second diameter at an output end. The tapered core may comprise a first tapered region at the input end, a second tapered region at the output end, and a central region having a constant diameter that is larger than the first diameter and the second diameter. The first tapered region expands monotonically from the first diameter to the constant diameter of the central region along a length of the first tapered region, and the second tapered region contracts monotonically from the constant diameter of the central region to the second diameter along a length of the second tapered region. The monolithic optical fiber may be used as a delivery fiber to deliver a laser beam from a fiber laser engine to a process head.

    HIGH PRECISION OPTICAL LOCKER
    3.
    发明申请

    公开(公告)号:US20230025759A1

    公开(公告)日:2023-01-26

    申请号:US17526827

    申请日:2021-11-15

    IPC分类号: G02B5/28 G01J9/02 G02B17/00

    摘要: In some implementations, an optical assembly comprises an optical cavity; one or more detectors; and an optical component having an input face and an output face configured to receive an input beam to the input face and to produce one or more primary output beams, and a plurality of secondary output beams from the output face, the secondary output beams resulting from multiple internal reflections within the optical component. At least one of the input face is not perpendicular to the input beam or the output face is not perpendicular to the one or more primary output beams. Each primary output beam is transmitted through the optical cavity perpendicular to at least one surface of the optical cavity, and directed to a respective one of the one or more detectors. Each detector is arranged to exclude at least a portion of each secondary output beam.

    PACKAGING SUBSTRATE WITH LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE

    公开(公告)号:US20220385033A1

    公开(公告)日:2022-12-01

    申请号:US17445786

    申请日:2021-08-24

    摘要: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

    INTEGRATED OPTICAL LOCKER
    5.
    发明申请

    公开(公告)号:US20220365358A1

    公开(公告)日:2022-11-17

    申请号:US17449392

    申请日:2021-09-29

    摘要: An optical assembly includes an optical cavity; an output detector; a reference detector; and a plate beam splitter, wherein the plate beam splitter has a first face and a second face, and is configured to form, from an input beam: a first output beam, that passes through the optical cavity and impinges the output detector, a first reference beam that impinges on the reference detector, a second output beam parallel to the first output beam, and a second reference beam parallel to the first reference beam; one of the first output beam or the first reference beam is a reflection of the input beam in the first face of the plate beam splitter; the output detector is configured to exclude at least a portion of the second output beam; and the reference detector is configured to exclude at least a portion of the second reference beam.

    Thermally-controlled photonic structure

    公开(公告)号:US11502480B2

    公开(公告)日:2022-11-15

    申请号:US17032787

    申请日:2020-09-25

    摘要: In some implementations, a thermally-controlled photonic structure may include a suspended region that is suspended over a substrate; a plurality of bridge elements connected to the suspended region and configured to suspend the suspended region over the substrate, where a plurality of openings are defined between the plurality of bridge elements; and at least one heater element having a modulated width disposed on the suspended region. The at least one heater element having the modulated width may include at least one section of a greater width and at least one section of a lesser width. The at least one section of the greater width may be in alignment with an opening of the plurality of openings and the at least one section of the lesser width may be in alignment with a bridge element of the plurality of bridge elements.

    METHOD AND MATERIAL FOR ATTACHING A CHIP TO A SUBMOUNT

    公开(公告)号:US20220359450A1

    公开(公告)日:2022-11-10

    申请号:US17814004

    申请日:2022-07-21

    IPC分类号: H01L23/00 B29C35/08

    摘要: A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.

    MULTI-WAVELENGTH LASER DIODE
    8.
    发明申请

    公开(公告)号:US20220344910A1

    公开(公告)日:2022-10-27

    申请号:US17305484

    申请日:2021-07-08

    IPC分类号: H01S5/50 H01S5/40 H01S5/12

    摘要: In some implementations, an optical device (e.g., a monolithic master oscillator power amplifier (MOPA) diode) may include a first facet, one or more gratings, an amplifier structure terminated with a second facet, and an oscillator array that includes multiple singlemode oscillators coupled to the first facet and to the one or more gratings. In some implementations, the multiple singlemode oscillators may be configured to generate multiple seed beams and to transmit the multiple seed beams into the amplifier structure through the one or more gratings.

    MATRIX ADDRESSABLE VERTICAL CAVITY SURFACE EMITTING LASER ARRAY

    公开(公告)号:US20220344909A1

    公开(公告)日:2022-10-27

    申请号:US17538592

    申请日:2021-11-30

    IPC分类号: H01S5/42 H01S5/042 H01S5/183

    摘要: In some implementations, a vertical cavity surface emitting laser (VCSEL) array may include a substrate. In some implementations, the VCSEL array may include a set of cathodes disposed on the substrate in a first direction, wherein a cathode, of the set of cathodes, is defined by a serpentine shape. In some implementations, the VCSEL array may include a set of anodes disposed on the substrate in a second direction, wherein an anode, of the set of anodes, is defined by the serpentine shape.

    DUAL THERMAL CONTROL ELEMENT CONFIGURATION FOR OPTO-MECHANICAL ASSEMBLY

    公开(公告)号:US20220326458A1

    公开(公告)日:2022-10-13

    申请号:US17357274

    申请日:2021-06-24

    IPC分类号: G02B6/42 G02B7/02

    摘要: An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.