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公开(公告)号：US20240165699A1
公开(公告)日：2024-05-23
申请号：US18283015
申请日：2022-03-03
CPC分类号： B22F1/102 , B22F1/056 , B22F9/24 , B23K35/025 , B23K35/302 , B22F2201/10 , B22F2301/10 , B22F2304/054 , B22F2998/10 , B22F2999/00
摘要： There are provided copper particles, in which a surface of a core particle consisting of metallic copper is coated with an organic protective film formed from an organic molecule derived from copper carboxylate, a total concentration of metal impurities having an oxidation reduction potential lower than that of copper is less than 10 ppm by mass, and an average particle diameter of the copper particles in a state where the copper particles are primary particles is more than 50 nm and 200 nm or less. When the copper particles are analyzed using a time-of-flight secondary ion mass spectrometry (TOF-SIMS), an amount of detected CuC2O2H− ions is in a range of 0.02 times or more with respect to an amount of detected Cu+ ions, and an amount of detected C2H3O2− ions is in a range of 0.02 times or more with respect to the amount of the detected Cu+ ions.
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公开(公告)号：US20190058101A1
公开(公告)日：2019-02-21
申请号：US15760658
申请日：2016-09-14
发明人： Sotaro Oi , Syuuji Nishimoto , Masahito Komasaki , Wataru Iwazaki
摘要： A thermoelectric conversion module which is obtained by connecting a plurality of thermoelectric conversion elements via a pair of wiring substrates facing each other in such a state that the thermoelectric conversion elements are combined with each other between the wiring substrates: each of the wiring substrates is obtained by forming an electrode layer on one surface of a ceramic substrate, the electrode layer being connected to the thermoelectric conversion elements and being formed of aluminum or an aluminum alloy: at least the electrode layer that is arranged on the high-temperature side is provided with a silver base layer, in which a glass layer and a silver layer are laminated in the surface; and the silver layer of the silver base layer is bonded to the thermoelectric conversion elements.
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公开(公告)号：US20180236568A1
公开(公告)日：2018-08-23
申请号：US15754652
申请日：2016-08-29
IPC分类号： B23B51/06
摘要： A drill has a thinning rake face formed in the front end. An intersection ridgeline between the thinning rake face and the tip flank face is the thinning edge. On the opposite side of the rotation direction, the first and second thinning wall surfaces (6b, 6c) and are formed. Viewed from the front, an intersection angle between the thinning edge (4a) and the first thinning ridgeline is larger than 95°. The second thinning ridgeline (L2) is bent to the opposite side of the rotation direction. The thinning edge and the first thinning ridgeline are connected via a concave curve line. The first and second thinning wall surfaces are connected via a concave surface, and a curvature radius of the concave curve line is smaller than a curvature radius of the concave surface.
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公开(公告)号：US20160249452A1
公开(公告)日：2016-08-25
申请号：US14913845
申请日：2014-08-18
IPC分类号： H05K1/09 , B23K35/02 , B23K35/30 , H05K1/03 , C22C14/00 , C04B37/02 , H01L23/15 , C22C9/02 , B23K35/32
CPC分类号： H05K1/09 , B23K35/0222 , B23K35/0233 , B23K35/0244 , B23K35/025 , B23K35/30 , B23K35/302 , B23K35/3026 , B23K35/325 , C04B37/02 , C04B37/026 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/407 , C04B2237/58 , C22C9/00 , C22C9/02 , C22C14/00 , H01L21/4882 , H01L23/15 , H01L23/3735 , H01L23/473 , H01L2224/32225 , H01L2924/0002 , H05K1/0306 , H01L2924/00
摘要： The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, in which Sn forms a solid solution with Cu, is formed at a bonded interface between the ceramic member and the Cu member, and intermetallic compounds containing P and Ti are dispersed in the Cu—Sn layer.
摘要翻译： 本发明的接合体包括陶瓷陶瓷构件; 以及由Cu或Cu合金制成并通过Cu-P-Sn基钎料和Ti材料与陶瓷构件结合的Cu构件，其中Sn形成固溶体的Cu-Sn层 在陶瓷构件和Cu构件之间的键合界面处形成Cu，并且含有P和Ti的金属间化合物分散在Cu-Sn层中。
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公开(公告)号：US20190044042A1
公开(公告)日：2019-02-07
申请号：US15759658
申请日：2016-09-26
摘要： A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wiring substrate.
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6.发明申请POWER-MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE 有权功率模块基板，散热附件功率模块基板和散热功率模块公开(公告)号：US20170047268A1
公开(公告)日：2017-02-16
申请号：US15305689
申请日：2015-04-24
IPC分类号： H01L23/373 , H01L23/40 , H01L23/367 , H01L23/00
CPC分类号： H01L23/3735 , B23K20/02 , B23K2103/10 , B23K2103/12 , B23K2103/18 , C04B37/026 , C04B2237/121 , C04B2237/128 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/407 , C04B2237/704 , C04B2237/706 , C04B2237/86 , H01L21/4882 , H01L23/367 , H01L23/473 , H01L24/29 , H01L24/32 , H01L31/04 , H01L2224/29111 , H01L2224/32225 , H01L2924/3512 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049
摘要： A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copper layer made from a same material as the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, in which a thickness t1 of the first copper layer is 1.7 mm to 5 mm, a sum of the thickness t1 of the first copper layer and a thickness t2 of the second copper layer is 7 mm or smaller, and a ratio t2/t1 is larger than 0 and 1.2 or smaller except for a range of 0.6 to 0.8.
摘要翻译： 一种功率模块用基板，其具有在陶瓷基板的一个表面上接合有第一铝层的电路层和通过固相扩散接合而接合在第一铝层上的第一铜层，以及具有第二铝层 由与第一铝层相同的材料制成并且接合在陶瓷基板的另一个表面上的第二铜层和由与第一铜层相同的材料制成并通过固相扩散接合结合在第二铝层上的第二铜层， 其中第一铜层的厚度t1为1.7mm至5mm，第一铜层的厚度t1和第二铜层的厚度t2之和为7mm或更小，并且比率t2 / t1为 大于0和1.2以下，除了0.6〜0.8的范围。
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公开(公告)号：US20170256777A1
公开(公告)日：2017-09-07
申请号：US15510326
申请日：2015-09-04
发明人： Jun Akikusa , Sho Shimizu , Shigenari Yanagi , Takeshi Isobe , Masahiro Wada
IPC分类号： H01M4/02 , H01M10/0525 , H01M4/131
CPC分类号： H01M4/02 , H01M4/13 , H01M4/131 , H01M4/136 , H01M4/36 , H01M4/505 , H01M4/525 , H01M4/58 , H01M4/80 , H01M10/0525 , H01M2004/021
摘要： A cathode for lithium ion secondary battery of the present invention includes a cathode including a current collector and active material supported on the current collector. The current collector is made of porous metal. The cathode has holes in its surface, and active material density is 50 to 80% of true density of the active material. Because the cathode is thick and supported with the active material densely and the holes are formed in its surface, transfer of an electron and insertion/release of lithium ion take place in the cathode surface and deep in the cathode in the lithium ion secondary battery. Therefore, the lithium ion released from the active material can migrate in the electrolyte solution in the holes, so that the active material present deep in the cathode is effectively utilized, and thus, the lithium ion secondary battery has high capacity and can promptly charge/discharge.
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公开(公告)号：US12127342B2
公开(公告)日：2024-10-22
申请号：US17913877
申请日：2021-03-30
发明人： Fumiaki Ishikawa , Shintaro Hara , Hiroyuki Mori , Kosei Fukuoka
CPC分类号： H05K1/056 , H05K1/181 , H05K2201/0209
摘要： A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100° C. or higher and 150° C. or lower, the insulating layer contains a resin, and a relationship between a thickness t (μm) of the insulating layer and an elastic modulus E (GPa) of the insulating layer at 100° C. satisfies a following formula (1).
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9.发明公开公开(公告)号：US20240336791A1
公开(公告)日：2024-10-10
申请号：US18293828
申请日：2022-08-01
发明人： Ryuji Uesugi , Tomohiko Yamaguchi , Riku Ebisawa
IPC分类号： C09D11/037 , B41M5/00 , B41M7/00 , C09D11/033
CPC分类号： C09D11/037 , B41M5/0047 , B41M7/009 , C09D11/033
摘要： Agglomeration of metal particles is to be suppressed. A metal ink contains metal particles, a solvent, and a polyhydric alcohol containing two or more OH groups and soluble in water and ethanol.
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公开(公告)号：US20240316652A1
公开(公告)日：2024-09-26
申请号：US18278043
申请日：2022-02-25
发明人： Jun Kitajima , Shota Watanabe , Kenji Sugawara , Ryo Miura
IPC分类号： B23B27/16
CPC分类号： B23B27/1614 , B23B2205/04
摘要： A cutting insert has a surface to be pressed and a surface to be restrained. A supporter has a supporter main body, an elastically deformable gripping arm, a pocket, and a slit. The supporter main body has a restraining surface that comes into contact with the surface to be restrained. The gripping arm has a pressing surface that comes into contact with the surface to be pressed. The slit has a pocket opening that is open to the pocket. The pocket opening is disposed between the restraining surface and the pressing surface.
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