公开(公告)号：US20240038711A1

公开(公告)日：2024-02-01

申请号：US18359976

申请日：2023-07-27

申请人： DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation ,  MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

发明人： TERUAKI KUMAZAWA ,  MASASHI UECHA ,  YUJI NAGUMO ,  MASARU OKUDA ,  MASATAKE NAGAYA ,  MITSURU KITAICHI ,  AKIRA MORI ,  NAOYA KIYAMA ,  MASAKAZU TAKEDA

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  H01L24/27 ,  H01L2224/29083 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29144 ,  H01L2224/29019 ,  H01L2224/2784

摘要： A semiconductor device includes a semiconductor substrate and a metal layer disposed on a surface of the semiconductor substrate. The metal layer includes a first metal layer and a second metal layer. The second metal layer covers a surface of the first metal layer and has a higher solder wettability than the first metal layer. The second metal layer is exposed on a main surface of the metal layer. The first metal layer is exposed on a side surface of the metal layer. The metal layer has a protruding portion on the main surface. The protruding portion extends to make one round along an outer peripheral edge of the main surface.

公开(公告)号：US20240038590A1

公开(公告)日：2024-02-01

申请号：US18360322

申请日：2023-07-27

申请人： DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation ,  MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

发明人： MASASHI UECHA ,  YUJI NAGUMO ,  MASARU OKUDA ,  MASATAKE NAGAYA ,  MITSURU KITAICHI ,  AKIRA MORI ,  NAOYA KIYAMA ,  MASAKAZU TAKEDA

IPC分类号： H01L21/78 ,  H01L21/304

CPC分类号： H01L21/78 ,  H01L21/304

摘要： A semiconductor device includes a semiconductor substrate having a quadrangular shape when viewed from above and having a front surface, a rear surface opposite to the front surface, and four side surfaces connecting the front surface and the rear surface. Each of the side surfaces has a step section in which a plurality of protruding portions and a plurality of recessed portions alternately and repeatedly appear along a direction in which a peripheral edge of the front surface of the semiconductor substrate extends.

公开(公告)号：US20240030056A1

公开(公告)日：2024-01-25

申请号：US18324277

申请日：2023-05-26

申请人： DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation ,  MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

发明人： MASASHI UECHA ,  YUJI NAGUMO ,  MASARU OKUDA ,  MASATAKE NAGAYA ,  MITSURU KITAICHI ,  AKIRA MORI ,  NAOYA KIYAMA ,  MASAKAZU TAKEDA

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/78

CPC分类号： H01L21/6836 ,  H01L21/3043 ,  H01L21/78 ,  H01L2221/68327

摘要： A manufacturing method of a semiconductor device includes preparing a semiconductor substrate having a plurality of element regions and having a first surface and a second surface opposite to each other, forming a crack extending in a thickness direction of the semiconductor substrate along a boundary between the plurality of element regions by pressing a pressing member against the first surface of the semiconductor substrate along the boundary, forming a metal film over the plurality of element regions on the first surface of the semiconductor substrate after the forming of the crack, and dividing the semiconductor substrate and the metal film along the boundary by pressing a dividing member against the semiconductor substrate along the boundary from a direction facing the second surface of the semiconductor substrate after the forming of the metal film.

公开(公告)号：US09425577B2

公开(公告)日：2016-08-23

申请号：US14774135

申请日：2014-03-20

申请人： Mitsuboshi Diamond Industrial Co., LTD.

发明人： Christian Schaefer ,  Masanao Murakami

IPC分类号： H01S3/042 ,  H01S3/067 ,  H01S3/091 ,  H01S3/16 ,  H01S3/17 ,  H01S3/00 ,  H01S3/04

CPC分类号： H01S3/042 ,  H01S3/005 ,  H01S3/0071 ,  H01S3/0405 ,  H01S3/0407 ,  H01S3/06704 ,  H01S3/06708 ,  H01S3/06716 ,  H01S3/06745 ,  H01S3/06754 ,  H01S3/091 ,  H01S3/1608 ,  H01S3/173

摘要： An optical fiber includes a first optical fiber body, a second optical fiber body and a first end cap. The first optical fiber body includes a first core and a first cladding. The second optical fiber body includes a second core and a second cladding, and is joined at a first end surface thereof to a first end surface of the first optical fiber body. The first end cap has light permeability and is joined to a second end surface of the second optical fiber body. The first core is doped with a laser medium. A mass content of the laser medium in the second core is lower than that of the laser medium in the first core.

摘要翻译： 光纤包括第一光纤体，第二光纤体和第一端盖。 第一光纤体包括第一芯和第一包层。 第二光纤体包括第二芯和第二包层，并且在其第一端面处连接到第一光纤体的第一端面。 第一端盖具有透光性并且连接到第二光纤体的第二端面。 第一芯掺杂有激光介质。 第二芯中的激光介质的质量含量低于第一芯中的激光介质的质量含量。

公开(公告)号：US09149953B2

公开(公告)日：2015-10-06

申请号：US13490996

申请日：2012-06-07

申请人： Naoko Tomei

发明人： Naoko Tomei

IPC分类号： C03B33/10 ,  B28D5/00 ,  B28D1/22

CPC分类号： B28D1/225 ,  B24B3/36 ,  B26D1/0006 ,  B26D3/08 ,  B26D2001/002 ,  B26D2001/0053 ,  C03B33/107 ,  Y10T83/0341 ,  Y10T83/0385

摘要： A scribing wheel for scribing a brittle material-made substrate. Disc-shaped scribing-wheel base material in use is so designed that mid-portion of disc periphery has the largest diameter. Diamond film is formed on the periphery by a CVD method. The periphery is ground in the middle so that a plane including a circle defined by ridge line becomes perpendicular to the central axis of the scribing wheel.

摘要翻译： 用于划伤脆性材料制成的基材的划线轮。 使用的圆盘状划线轮基材的设计使得圆盘周边的中部具有最大的直径。 通过CVD法在周围形成金刚石膜。 周边在中间被研磨，使得包括由脊线限定的圆的平面垂直于划线轮的中心轴线。

公开(公告)号：US08881633B2

公开(公告)日：2014-11-11

申请号：US11572154

申请日：2005-07-15

申请人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

发明人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

IPC分类号： B31B1/25 ,  B28D1/22 ,  C03B33/033 ,  B28D1/24 ,  C03B33/10

CPC分类号： C03B33/107 ,  B28D1/225 ,  B28D1/24 ,  C03B33/033 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385

摘要： A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 μm.

摘要翻译： 当切割用于液晶显示面板等的脆性材料基板时，在脆性材料基板的表面上具有优异的咬合性的脆性材料基板的切割轮和用于制造高效率的切割轮的方法 。 由硬金属或烧结金刚石制成的切割轮以这样的方式形成：V形脊线部分沿着圆盘状轮的圆周部分形成为边缘，并且至少一个切口刻在 上述脊线部分和上述凹口以大于200μm的间距形成在上述脊线部分的整个周边。

公开(公告)号：US08707842B2

公开(公告)日：2014-04-29

申请号：US13032692

申请日：2011-02-23

申请人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

发明人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

IPC分类号： B31B1/25

CPC分类号： C03B33/107 ,  B28D1/225 ,  B28D1/24 ,  C03B33/033 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385

摘要： A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 μm.

公开(公告)号：US20140000433A1

公开(公告)日：2014-01-02

申请号：US14015051

申请日：2013-08-30

申请人： Masao YAMAMOTO ,  Atsushi TABATA

发明人： Masao YAMAMOTO ,  Atsushi TABATA

IPC分类号： B26D7/26 ,  B26D3/08

CPC分类号： B26D7/2621 ,  B26D3/08 ,  B26D5/007 ,  B26D7/2614 ,  Y10T83/0333 ,  Y10T83/0385

摘要： A tip 14 is rotatably attached to a tip holder 10. The tip holder 10 is made into a cylindrical shape and its end has an installation part 16. An opening is arranged at a holder joint. The tip holder 10 is attracted by a magnet for attachment so that detaching and attaching can be performed easily. Tip offset data is recorded as a 2-dimensional code 17 on the surface of the tip holder 10. When replacing the tip holder, the offset data is read out and inputted to a scribe device, thereby canceling the offset. This eliminates the operation required for correction when attaching/detaching the tip holder and enables easy tip replacement during a short time of device stop.

摘要翻译： 尖端14可旋转地附接到尖端保持器10.尖端保持器10制成圆柱形，其端部具有安装部分16.开口布置在保持器接头处。 刀片保持器10被用于附接的磁体吸引，使得可以容易地进行拆卸和附接。 尖端偏移数据作为二维码17记录在刀片保持器10的表面上。当更换刀片保持器时，偏移数据被读出并输入到划线装置，从而抵消偏移。 这样可以消除在安装/拆卸刀片座时进行校正所需的操作，并能在短时间内停止设备时轻松更换刀片。

公开(公告)号：US08276796B2

公开(公告)日：2012-10-02

申请号：US11915894

申请日：2006-05-26

申请人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

发明人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

IPC分类号： B26F1/20

CPC分类号： C03B33/033 ,  B28D1/222 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B65G2249/04 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T225/30 ,  Y10T225/325

摘要： A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.

摘要翻译： 提供了一种脆性材料基板切割方法和切割装置，其在连续切割脆性材料基板的断裂步骤中，在脆性材料基板的切割面彼此接触之后彼此接触，从而对脆性材料造成损坏或污染 可以防止由于接触引起的基板。

公开(公告)号：US20110107894A1

公开(公告)日：2011-05-12

申请号：US12995011

申请日：2009-04-27

申请人： Kazuya Maekawa ,  Ryota Sakaguchi ,  Tomoki Nakagaki

发明人： Kazuya Maekawa ,  Ryota Sakaguchi ,  Tomoki Nakagaki

IPC分类号： B26D3/02

CPC分类号： B28D1/225 ,  B24B9/10 ,  C03B33/023 ,  C03B33/033 ,  C03B33/09 ,  C03B33/091 ,  C03B33/105 ,  C03B33/107 ,  Y10T83/0259

摘要： [Issue] A chamfering method is provided that can be conducted even in small worksite space without using grinding members and without requiring a cleaning process after a chamfering process.[Resolution Means] A brittle material substrate chamfering method according to the present invention includes steps of drawing a scribing line, and heating and/or cooling a part in proximity to the scribing line. The scribing line is drawn on a part of a surface of a brittle material substrate that extends along the edge of the brittle material substrate and has a width not more than 50% of the thickness of the brittle material substrate starting from the edge of the brittle material substrate whereby forming a crack inclined from the surface of the substrate toward a side end surface of the substrate. A part in proximity to the scribing line is heated and/or cooled so that a corner part of the edge of said brittle material substrate is cut out whereby chamfering said brittle material substrate. In the step of drawing a scribing line on the part of a surface of a brittle material substrate, a cutter wheel is preferably used that has a plurality of inclined grooves along the circumferential edge line as cutting edge. The inclined grooves are inclined at a predetermined angle relative to the axial direction of the cutter wheel.

摘要翻译： [问题]提供了一种即使在小型工地空间中也可以进行倒角的方法，而不使用研磨构件，并且在倒角加工之后不需要清洁处理。 [分辨率方法]根据本发明的脆性材料基板倒角方法包括绘制划线，并且对靠近划线的部件进行加热和/或冷却的步骤。 划痕线被描绘在脆性材料基材的沿着脆性材料基材的边缘延伸的表面的一部分上，其宽度不大于脆性材料基材厚度的50％，从脆性材料的边缘开始 从而形成从基板的表面朝向基板的侧端面倾斜的裂纹。 加热和/或冷却与划刻线相邻的部分，从而切割所述脆性材料基材的边缘的角部，由此对所述脆性材料基板进行倒角。 在脆性材料基板的表面部分划线的步骤中，优选使用具有沿周缘边缘线的多个倾斜槽作为切削刃的切割轮。 倾斜槽相对于切割轮的轴向以预定的角度倾斜。