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公开(公告)号:US11634631B2
公开(公告)日:2023-04-25
申请号:US16722768
申请日:2019-12-20
申请人: Nanosys, Inc.
发明人: John Curley , Chunming Wang , Jay Yamanaga , Xiaofeng Zhang , Christian Ippen
IPC分类号: C09K11/88 , H01L33/50 , H01L27/32 , C09K11/08 , B82Y20/00 , B82Y40/00 , G02F1/13357 , G02F1/1335
摘要: The invention relates to highly luminescent nanostructures with improved blue light absorbance, particularly core/shell nanostructures comprising a ZnSe core and InP and/or ZnS shell layers. The invention also relates to methods of producing such nanostructures.
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公开(公告)号:US11634629B2
公开(公告)日:2023-04-25
申请号:US16925786
申请日:2020-07-10
申请人: Nanosys, Inc.
发明人: Daekyoung Kim , Wenzhou Guo , Alexander Tu , Yeewah Annie Chow , Diego Barrera , Christian Ippen , Benjamin Newmeyer , Ruiqing Ma
摘要: The invention is in the field of nanostructure synthesis. Provided are highly luminescent core/shell nanostructures with zinc fluoride and zinc acetate bound to their surface. Also provided are methods of preparing the nanostructures, films comprising the nanostructures, and devices comprising the nanostructures.
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公开(公告)号:US20230066558A1
公开(公告)日:2023-03-02
申请号:US17818097
申请日:2022-08-08
申请人: NANOSYS, INC.
发明人: Brian KIM
摘要: A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, such that each of the light emitting diodes includes a stack of a first doped semiconductor layer, a second doped semiconductor layer and an active region located between the first and the second doped semiconductor layers, and a conductive encapsulation layer in contact with sidewalls of the first doped semiconductor layers of the array of light emitting diodes.
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公开(公告)号:US20220384404A1
公开(公告)日:2022-12-01
申请号:US17818822
申请日:2022-08-10
申请人: NANOSYS, INC.
IPC分类号: H01L25/16 , H01L33/40 , H01L33/62 , H01L33/56 , H01L33/12 , H01L33/06 , H01L33/32 , H01L33/24 , H01L33/08 , H01L33/00
摘要: A light emitting device includes a backplane, an array of light emitting diodes attached to a frontside of the backplane, a positive tone, imageable dielectric material layer, such as a positive photoresist layer, located on the frontside of the backplane and laterally surrounding the array of light emitting diodes, such that sidewalls of the light emitting diodes contacting the positive tone, imageable dielectric material layer have a respective reentrant vertical cross-sectional profile, and at least one common conductive layer located over the positive tone, imageable dielectric material layer and contacting the light emitting diodes.
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公开(公告)号:US20220278258A1
公开(公告)日:2022-09-01
申请号:US17549543
申请日:2021-12-13
申请人: Nanosys, Inc.
发明人: Ernest C. Lee
IPC分类号: H01L33/60 , H01L23/538 , F21V9/20 , H01L25/075 , C09K11/88 , C09K11/02 , H05B33/14
摘要: Illumination devices based on quantum dot technology and methods of making such devices are described. An illumination device includes a substrate having a plurality of microLEDs, a beam splitter, and a film having a plurality of quantum dots. The beam splitter includes a plurality of layers and is disposed between the substrate and the film having the plurality of quantum dots.
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公开(公告)号:US11380863B2
公开(公告)日:2022-07-05
申请号:US16822931
申请日:2020-03-18
申请人: Nanosys, Inc.
IPC分类号: H01L51/00 , H01L51/50 , H01L51/52 , H01L33/04 , H01L33/06 , H01L33/44 , H01L27/32 , H01L51/56
摘要: Embodiments of a flexible electroluminescent (EL) device are described. An EL device includes a device stack and a flexible substrate configured to support the device stack. The device stack can include a anode and a cathode, a quantum dot (QD) film positioned between the anode and the cathode and configured to produce light having a first peak wavelength. The device stack further includes a patterned insulating layer disposed on the anode and configured to form electrically active regions in the device stack and to control emission of the light from the EL device through the electrically active regions. The EL device further includes an encapsulation layer disposed on the cathode.
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7.
公开(公告)号:US11320577B2
公开(公告)日:2022-05-03
申请号:US15788346
申请日:2017-10-19
申请人: Nanosys, Inc.
发明人: Ernest Lee , Jason Hartlove
IPC分类号: F21V8/00 , B82Y30/00 , B82Y40/00 , C09K11/02 , G02F1/13357 , H05B33/14 , G02F1/1335 , H01L33/50
摘要: Embodiments of a display device are described. The display device includes a backlight unit having a light source, a quantum dot film, and a radiation absorbing element. The quantum dot film is optically coupled to the light source and is configured to process light received from the light source. The radiation absorbing element is optically coupled to the quantum dot film and is configured to tune a spectral emission width of the processed light received from the quantum dot film to achieve over 90% color gamut coverage of a standard RGB color space.
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公开(公告)号:US11312905B2
公开(公告)日:2022-04-26
申请号:US16925799
申请日:2020-07-10
申请人: Nanosys, Inc.
摘要: This disclosure pertains to the field of nanotechnology. The disclosure provides methods of preparing nanostructures with fluoride passivation. The disclosure also provides methods of preparing nanostructures with fluoride and amine passivation. The nanostructures have high quantum yield, narrow emission peak width, tunable emission wavelength, and colloidal stability. Also provided are nanostructures prepared using the methods. And, nanostructure films and molded articles comprising the nanostructures are also provided.
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公开(公告)号:US20220122949A1
公开(公告)日:2022-04-21
申请号:US17563472
申请日:2021-12-28
申请人: NANOSYS, INC.
发明人: Brian KIM
IPC分类号: H01L25/075 , H01L27/12 , H01L33/48 , H01L33/54 , H01L33/62 , H01L33/58 , H01L27/32 , H01L51/52
摘要: A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.
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10.
公开(公告)号:US11267980B2
公开(公告)日:2022-03-08
申请号:US16758626
申请日:2018-10-24
申请人: Nanosys, Inc.
IPC分类号: C09K11/02 , C09D11/102 , C09D11/50 , C09D11/033 , C09D11/037 , C09K11/08 , C09K11/70 , C09K11/88 , B82Y20/00 , B82Y40/00
摘要: The present invention provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise a population of nanostructures comprising polyfunctional poly(alkylene oxide) ligands. The present invention also provides nanostructure films comprising the nanostructure compositions and methods of making nanostructure films using the nanostructure compositions.
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