公开(公告)号：US20070277586A1

公开(公告)日：2007-12-06

申请号：US11806428

申请日：2007-05-31

申请人： Isao Kamiya

发明人： Isao Kamiya

IPC分类号： G01P21/00

CPC分类号： G01P21/00 ,  G01P15/18

摘要： A three-axial acceleration sensor inspection device is provided for inspecting a three-axial acceleration sensor that detects acceleration components in three axes crossing perpendicularly with each other and outputs acceleration component signals. The three-axial acceleration sensor inspection device includes a test plate for mounting the three-axial acceleration sensor thereon; a supporting plate for supporting and rotating the test plate; a main rotational shaft for rotating the supporting plate. The supporting plate is arranged radially around the main rotational shaft along a radius direction of the main rotational shaft, and is disposed at each of at least four locations with an equal angular interval along a circumferential direction of the main rotational shaft.

摘要翻译： 提供三轴加速度传感器检查装置，用于检测三轴加速度传感器，该三轴加速度传感器检测相互垂直交叉的三个轴中的加速度分量，并输出加速度分量信号。 三轴加速度传感器检查装置包括用于在其上安装三轴加速度传感器的测试板; 用于支撑和旋转测试板的支撑板; 用于旋转支撑板的主旋转轴。 支撑板沿着主旋转轴的半径方向径向地布置在主旋转轴的周围，并且沿着主旋转轴的圆周方向以等角度间隔设置在至少四个位置中的每一个处。

公开(公告)号：US20170116811A1

公开(公告)日：2017-04-27

申请号：US15106913

申请日：2014-11-06

申请人： Oki Electric Industry Co., Ltd.

发明人： Takamoto YOKOTE

IPC分类号： G07D11/00 ,  B65H5/36

CPC分类号： G07D11/0081 ,  B65H5/36 ,  B65H5/38 ,  B65H2402/10 ,  B65H2402/62 ,  B65H2404/611 ,  B65H2404/6112 ,  B65H2701/1912

摘要： To provide a banknote processing apparatus for reducing occurrence of part damage involved by movement of a unit.Provided is a banknote processing apparatus including: a first unit (10); a second unit (30); and a pair of transfer guides (20) configured to form a transfer conveyance path on which a banknote is conveyed between the first unit (10) and the second unit (30). The transfer conveyance path is formed between the pair of transfer guides (20). The transfer guide (20) has a first edge (26) at an opposite side to the transfer conveyance path and at the first unit (10) side, the first edge (26) coming closer to the transfer conveyance path as the first edge (26) nears an end at the first unit (10) side.

公开(公告)号：US20070286598A1

公开(公告)日：2007-12-13

申请号：US11730994

申请日：2007-04-05

申请人： Katsuhiro Yoshino

发明人： Katsuhiro Yoshino

IPC分类号： B41B17/00

CPC分类号： H01L21/67242 ,  H01L21/67265 ,  H01L21/67288 ,  H01L21/6735 ,  Y10S414/135 ,  Y10S414/141

摘要： An inspection device is used for inspecting a thin plate container having a stage guide with insulation property for supporting a thin plate one by one. The inspection device includes a conductive plate having an upper surface and a lower surface and supported on the stage guide; a shaft disposed above the upper surface or below the lower surface; and a contact member abutting against the conductive plate. The conductive plate, the shaft, and the contact member respectively have conductivity.

摘要翻译： 检查装置用于检查具有用于一个一个地支撑薄板的具有绝缘性能的平台引导件的薄板容器。 检查装置包括具有上表面和下表面并被支撑在平台引导件上的导电板; 设置在所述上​​表面上方或所述下表面下方的轴; 以及抵靠导电板的接触构件。 导电板，轴和接触构件分别具有导电性。

公开(公告)号：US20070261490A1

公开(公告)日：2007-11-15

申请号：US11706281

申请日：2007-02-15

申请人： Takayuki Kai

发明人： Takayuki Kai

IPC分类号： G01P15/09 ,  H01L21/00

CPC分类号： G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842

摘要： An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving acceleration. The base portion is disposed around the weight apart from the weight. The beam has one end portion connected to the weight and the other end portion connected to the base portion. The beam also has a thick layer portion and a thin layer portion having a thickness smaller than that of the thick layer portion. The piezo resistance element is disposed over the thick layer portion and the thin layer portion.

摘要翻译： 加速度传感器包括一个重量; 基部，梁; 和压电电阻元件。 重量被设置为在接收加速度时移位。 底座部分配置在重量之外。 梁具有连接到重物的一个端部和连接到基部的另一端部。 光束还具有厚层部分和薄层部分，其厚度小于厚层部分的厚度。 压电电阻元件设置在厚层部分和薄层部分之上。

公开(公告)号：US20080211041A1

公开(公告)日：2008-09-04

申请号：US11783809

申请日：2007-04-12

申请人： Akihiko Nomura

发明人： Akihiko Nomura

IPC分类号： H01L29/84

CPC分类号： G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842

摘要： A micro electrical mechanical system device includes a frame portion having an upper surface with a rectangular shape; a functional element; a beam portion extending from one of sides of the frame portion toward an opposite one and having a first side surface, a second side surface opposite to the first side surface, and upper and lower surfaces between the first and second side surfaces; and a movable portion supported on the beam portion inside the frame portion to be movable. The beam portion includes a constricted portion formed in the first side surface and the second side surface along the functional element, and having a main surface and two side surfaces facing each other. The movable portion includes a center portion having four corner portions and protruding portions extending from the corner portions and away from the frame portion and the beam portion.

摘要翻译： 微电气机械系统装置包括具有矩形形状的上表面的框架部分; 功能元素 梁部分从框架部分的一侧朝向相对的一侧延伸并且具有第一侧表面，与第一侧表面相对的第二侧表面以及第一和第二侧表面之间的上表面和下表面; 以及支撑在框架部分内的梁部分上以可移动的可移动部分。 梁部分包括沿着功能元件形成在第一侧表面和第二侧表面中的收缩部分，并且具有主表面和两个彼此面对的侧表面。 可动部包括具有四个拐角部分和从角部延伸并远离框架部分和梁部分的突出部分的中心部分。

公开(公告)号：US20240310757A1

公开(公告)日：2024-09-19

申请号：US18415312

申请日：2024-01-17

申请人： Oki Electric Industry Co., Ltd.

发明人： Yasumasa SAGAWA

IPC分类号： G03G15/08

CPC分类号： G03G15/0896

摘要： An image formation apparatus according to an embodiment may include: development devices; and transmission gear members each including an output gear portion engaged with a drive gear portion of the corresponding development device. Among adjacent first and second development devices, a smallest angle θ1 of angles of gear teeth on a first output gear portion corresponding to the first development device in a rotation direction is different from a smallest angle θ2 of angles of gear teeth on a second output gear portion corresponding to a second development device in the rotation direction.

公开(公告)号：US20240210846A1

公开(公告)日：2024-06-27

申请号：US18528208

申请日：2023-12-04

申请人： Oki Electric Industry Co., Ltd.

发明人： Karin HASEGAWA

IPC分类号： G03G9/08 ,  G03G15/00 ,  G03G15/08

CPC分类号： G03G9/0819 ,  G03G15/0856 ,  G03G15/0877 ,  G03G15/5087 ,  G03G2215/0106

摘要： An image formation apparatus according to an embodiment may include: a first image formation unit including a storage part storing a glitter developer and configured to form a glitter developer image with the glitter developer; and a controller configured to control an operation of the first image formation unit based on print data received. The controller is configured to: when a remaining amount of the glitter developer in the storage part is a first remaining amount, to form the glitter developer image such that the glitter developer image is divided per unit area by a first division number; and when the remaining amount of the glitter developer in the storage part is a second remaining amount less than the first remaining amount, to form the glitter developer image such that the glitter developer image is divided per unit area by a second division number smaller than the first division number.

公开(公告)号：US20230420427A1

公开(公告)日：2023-12-28

申请号：US18320618

申请日：2023-05-19

申请人： Oki Electric Industry Co., Ltd.

发明人： Akihiro IINO ,  Toru KOSAKA ,  Hironori FURUTA ,  Genichirou MATSUO ,  Shinya JUMONJI ,  Hiroto KAWADA ,  Yuuki SHINOHARA

IPC分类号： H01L25/13 ,  H01L33/52 ,  H01L33/00 ,  H01L33/62

CPC分类号： H01L25/13 ,  H01L33/52 ,  H01L33/0093 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0016

摘要： A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.

公开(公告)号：US20230375957A1

公开(公告)日：2023-11-23

申请号：US18313667

申请日：2023-05-08

申请人： Oki Electric Industry Co., Ltd.

发明人： Fumitaka OZEKI ,  Hisashi SOGA

IPC分类号： G03G15/08

CPC分类号： G03G15/0844 ,  G03G15/0887

摘要： An image formation apparatus according to an embodiment may include: an image formation section to form an image with a developer; an entire area printing rate calculator configured to calculate an entire area printing rate, which is, a printing rate of an entirety of an image formation area; a divided area printing rate calculator configured to calculate each divided area printing rate, which is, a printing rate of each of plural divided areas, divided in a main scanning direction, of the image formation area; and a deteriorated developer discarding operation execution section configured, when the entire area printing rate is equal to or lower than an entire area printing rate threshold, to perform a deteriorated developer discarding operation to discard the developer in any one of the divided areas in which the divided area printing rate is equal to or lower than a divided area printing rate threshold thereof.

公开(公告)号：US20230320224A1

公开(公告)日：2023-10-05

申请号：US18179014

申请日：2023-03-06

申请人： Oki Electric Industry Co., Ltd.

发明人： Hironori FURUTA ,  Toru KOSAKA ,  Takahito SUZUKI ,  Kenichi TANIGAWA ,  Takuma ISHIKAWA ,  Yutaka KITAJIMA

IPC分类号： H10N30/50 ,  H10N30/00 ,  H10N30/87 ,  H10N30/853 ,  H10N30/85 ,  H10N30/057

CPC分类号： H10N30/50 ,  H10N30/057 ,  H10N30/1051 ,  H10N30/852 ,  H10N30/853 ,  H10N30/872

摘要： A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.