-
公开(公告)号：US20190358754A1
公开(公告)日：2019-11-28
申请号：US16306858
申请日：2018-04-04
IPC分类号： B23K35/362 , C08K5/17 , C08K5/5317 , C08K5/5313
摘要： An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux.The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
-
公开(公告)号：US20230129147A1
公开(公告)日：2023-04-27
申请号：US17912384
申请日：2021-03-10
发明人： Yuuki Iijima , Hiroshi Okada , Shunsaku Yoshikawa , Takashi Saito , Kanta Dei , Takahiro Matsufuji
摘要： Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
-
公开(公告)号：US20230112020A1
公开(公告)日：2023-04-13
申请号：US17779803
申请日：2020-11-18
申请人： SENJU METAL INDUSTRY CO., LTD. , National Institute of Advanced Industrial Science and Technology
发明人： Haruya SAKUMA , Kenichi TOMITSUKA , Hisahiko YOSHIDA , Kenji KANAZAWA , Sei UEMURA , Takashi NAKAMURA , Masateru NISHIOKA
摘要： A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.
-
公开(公告)号：US20230087892A1
公开(公告)日：2023-03-23
申请号：US17911485
申请日：2021-03-16
发明人： Tomoko TAKAGI , Tomoki SASAKI
IPC分类号： B23K35/362 , B23K35/36 , B23K35/02
摘要： A solder paste is adopted, the solder paste containing: a solder alloy powder in which a content of solder alloy particles having a particle size of 8 μm or less is 99% by mass or more with respect to a total mass of the solder alloy powder; and a flux. This flux contains an acid-modified rosin, a solvent, an activator, and a thixotropic agent, in which the activator contains a halogenated aliphatic compound, and a dicarboxylic acid represented by General Formula (2). [in the formula, R represents an alkylene group having 1 to 7 carbon atoms, or a single bond, provided that a methylene group constituting the alkylene group may be substituted with an oxygen atom]
-
公开(公告)号：US11590614B2
公开(公告)日：2023-02-28
申请号：US17286431
申请日：2019-10-21
发明人： Ayaka Shirakawa , Hiroshi Sugii , Atsumi Takahashi , Daisuke Maruko , Hiroyoshi Kawasaki , Masato Shiratori
IPC分类号： B23K35/362 , B23K35/02 , B23K35/36
摘要： A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
-
公开(公告)号：US11577344B2
公开(公告)日：2023-02-14
申请号：US17387282
申请日：2021-07-28
发明人： Yuuki Iijima , Shunsaku Yoshikawa , Takashi Saito
IPC分类号： C22C13/02 , B23K35/26 , B23K35/02 , B23K103/08
摘要： A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.
-
公开(公告)号：US20230039027A1
公开(公告)日：2023-02-09
申请号：US17793866
申请日：2021-03-19
IPC分类号： B23K35/02 , B23K35/26 , B32B15/01 , H01L23/367 , H01L23/00
摘要： In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.
-
公开(公告)号：US11571770B2
公开(公告)日：2023-02-07
申请号：US17295354
申请日：2020-05-15
摘要： Provided are a solder alloy which has excellent temperature cycle characteristics and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, and a solder joint in which the solder alloy is used.
The solder alloy consists of, by mass %, 1.0% to 5.0% of Ag, 0.5% to 3.0% of Cu, 0.5% to 7.0% of Sb, 0.0040% to 0.025% of As, and a balance of Sn.-
公开(公告)号：US20220402057A1
公开(公告)日：2022-12-22
申请号：US17779801
申请日：2020-11-18
申请人： SENJU METAL INDUSTRY CO., LTD. , National Institute of Advanced Industrial Science and Technology
发明人： Haruya SAKUMA , Kenichi TOMITSUKA , Hisahiko YOSHIDA , Kenji KANAZAWA , Sei UEMURA , Takashi NAKAMURA , Masateru NISHIOKA
摘要： A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.
-
公开(公告)号：US20220212294A1
公开(公告)日：2022-07-07
申请号：US17610876
申请日：2020-09-30
发明人： Shigeki KONDOH , Masato TSUCHIYA , Hiroki SUDO , Hiroshi OKADA , Daisuke SOUMA
摘要： A core material has a core 12; a solder layer 16 made of a (Sn—Bi)-based solder alloy provided on an outer side of the core 12; and a Sn layer 20 provided on an outer side of the solder layer 16. The core contains metal or a resin. When a concentration ratio of Bi contained in the solder layer 16 is a concentration ratio (%)=a measured value of Bi (% by mass)/a target Bi content (% by mass), or a concentration ratio (%)=an average value of measured values of Bi (% by mass)/a target Bi content (% by mass), the concentration ratio is 91.4% to 106.7%. The thickness of the Sn layer 20 is 0.215% or more and 36% or less of the thickness of the solder layer 16.
-
-
-
-
-
-
-
-
-
搜索结果
427 条记录 (耗时 0.048 秒)