公开(公告)号：US09786625B2

公开(公告)日：2017-10-10

申请号：US14803138

申请日：2015-07-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Yongbo Yang ,  Antonio Jr. Bambalan Dimaano ,  Chun Hong Wo

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/768 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L24/27 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/207 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die.

公开(公告)号：US20160211196A1

公开(公告)日：2016-07-21

申请号：US15007607

申请日：2016-01-27

Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.

Inventor： Danny RETUTA ,  Hien Boon TAN ,  Anthony Yi Sheng SUN ,  Mary Annie CHEONG

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49506 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes form a structure of leads and a die pad on the electrically conductive layer. The plurality of holes are filled with a non-conductive material. Next; an electrically conductive foil is attached on the top surface of the electrically conductive layer and the non-conductive epoxy material. The, the electrically conductive foil is etched to create a network of leads, die pad, bus lines, dam bars and tie lines, wherein the bus lines connect the leads to the dam bar, the dam bar is connected to the tie line and the tie line is connected to the die pad.

Abstract translation: 制造引线框架的方法包括提供在顶表面具有多个孔的导电层。 多个孔在导电层上形成引线和管芯焊盘的结构。 多个孔填充有非导电材料。 下一个; 导电箔附着在导电层和非导电环氧材料的顶表面上。 导电箔被蚀刻以形成引线网络，管芯焊盘，总线，坝条和连接线，其中总线将引线连接到堤坝，坝条连接到连接线， 连接线连接到管芯焊盘。

公开(公告)号：US09142487B2

公开(公告)日：2015-09-22

申请号：US13737923

申请日：2013-01-09

Applicant: United Test and Assembly Center Ltd.

Inventor： Chin Hock Toh ,  Yi Sheng Anthony Sun ,  Xue Ren Zhang ,  Ravi Kanth Kolan

IPC: H01L23/48 ,  H01L23/52 ,  H01L25/065 ,  H01L21/683 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/50 ,  H01L21/56

CPC classification number: H01L21/568 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

Abstract: A structural member for use in semiconductor packaging is disclosed. The structural member includes a plurality of packaging regions to facilitate packaging dies in, for example, a wafer format. A packaging region has a die attach region surrounded by a peripheral region. A die is attached to the die attach region. In one aspect, the die attach region has opening through the surfaces of the structural member for accommodating a die. Through-vias disposed are in the peripheral regions. The structural member reduces warpage that can occur during curing of the mold compound used in encapsulating the dies. In another aspect, the die attach region does not have an opening. In such cases, the structural member serves as an interposer between the die and a substrate.

Abstract translation: 公开了一种用于半导体封装的结构件。 结构构件包括多个封装区域，以便于例如晶片格式的封装模具。 包装区域具有由周边区域包围的管芯附着区域。 裸片附接到芯片附接区域。 一方面，管芯附着区域通过用于容纳管芯的结构构件的表面开口。 通孔设置在周边区域。 结构构件减少在封装模具中使用的模具化合物的固化期间可能发生的翘曲。 在另一方面，管芯附着区域不具有开口。 在这种情况下，结构件用作管芯和衬底之间的插入件。

公开(公告)号：US20140225242A1

公开(公告)日：2014-08-14

申请号：US14257013

申请日：2014-04-21

Applicant: United Test and Assembly Center Ltd.

Inventor： Chin Hock TOH ,  Kriangsak Sae LE

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L21/563 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2224/81424 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of forming semiconductor assemblies is disclosed. The method includes providing an interposer with through interposer vias. The interposer includes a first surface and a second surface. The through interposer vias extend from the first surface to the second surface of the interposer. A first die is mounted on the first surface of the interposer. The first die comprises a first surface with first conductive contacts thereon. The interposer comprises material with coefficient of thermal expansion (CTE) similar to that of the first die. The first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer.

Abstract translation: 公开了一种形成半导体组件的方法。 该方法包括通过插入器通孔提供插入器。 插入件包括第一表面和第二表面。 通过插入件通孔从插入件的第一表面延伸到第二表面。 第一管芯安装在插入件的第一表面上。 第一裸片包括其上具有第一导电接触的第一表面。 插入件包括与第一模具类似的具有热膨胀系数（CTE）的材料。 第一管芯的第一导电接触件连接到插入件的第一表面上的通孔插入件通孔。

公开(公告)号：US08772921B2

公开(公告)日：2014-07-08

申请号：US13347683

申请日：2012-01-10

Applicant: Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

Inventor： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

IPC: H01L23/02

CPC classification number: H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

Abstract translation: 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。

公开(公告)号：US08647924B2

公开(公告)日：2014-02-11

申请号：US12758820

申请日：2010-04-13

Applicant: Chin Hock Toh ,  Keng Yuen Au ,  Reynaldo Vincent Hernandez Sta Agueda ,  Bee Liang Catherine Ng ,  Librado Amurao Gatbonton ,  Xue Ren Zhang ,  Yi-Sheng Anthony Sun

Inventor： Chin Hock Toh ,  Keng Yuen Au ,  Reynaldo Vincent Hernandez Sta Agueda ,  Bee Liang Catherine Ng ,  Librado Amurao Gatbonton ,  Xue Ren Zhang ,  Yi-Sheng Anthony Sun

IPC: H01L21/00

CPC classification number: H01L24/73 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/0612 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48799 ,  H01L2224/73104 ,  H01L2224/73215 ,  H01L2224/81005 ,  H01L2224/81011 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method of forming a device stack is presented. The method includes providing a temporary substrate having a temporary mounting surface. A first chip is temporarily mounted to the temporary mounting surface. A first bottom surface of the first chip is temporarily mounted to the temporary mounting surface and a first top surface of the first chip comprises first interconnects. A second chip is stacked on the first chip. The second chip includes second conductive contacts on the second bottom surface. The method also includes bonding the first and second chips together to form the device stack. The second conductive contacts are coupled to the first interconnects. The first bottom surface of the first chip is separated from the substrate to separate the chip stack from the substrate.

Abstract translation: 提出了一种形成器件堆叠的方法。 该方法包括提供具有临时安装表面的临时衬底。 第一芯片临时安装到临时安装表面。 第一芯片的第一底表面临时安装到临时安装表面，并且第一芯片的第一顶表面包括第一互连。 第二芯片堆叠在第一芯片上。 第二芯片包括在第二底表面上的第二导电触点。 该方法还包括将第一和第二芯片接合在一起以形成器件堆叠。 第二导电触点耦合到第一互连。 第一芯片的第一底表面与衬底分离，以将芯片堆叠与衬底分离。

公开(公告)号：US20120104628A1

公开(公告)日：2012-05-03

申请号：US13347683

申请日：2012-01-10

Applicant: Chin Hock TOH ,  Yao Huang HUANG ,  Ravi Kanth KOLAN ,  Wei Liang YUAN ,  Susanto TANARY ,  Yi Sheng Anthony SUN

Inventor： Chin Hock TOH ,  Yao Huang HUANG ,  Ravi Kanth KOLAN ,  Wei Liang YUAN ,  Susanto TANARY ,  Yi Sheng Anthony SUN

IPC: H01L23/538 ,  H01L21/768

CPC classification number: H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

Abstract translation: 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。

公开(公告)号：US20100109142A1

公开(公告)日：2010-05-06

申请号：US12604613

申请日：2009-10-23

Applicant: Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

Inventor： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/10

CPC classification number: H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

Abstract translation: 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。

公开(公告)号：US07642638B2

公开(公告)日：2010-01-05

申请号：US11959519

申请日：2007-12-19

Applicant: Hsian Pang Kuah ,  Jenny Phua

Inventor： Hsian Pang Kuah ,  Jenny Phua

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/10 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package, and method of making a semiconductor package, with a plurality of dies, wherein one die is attached to an inverted lead frame and another die is attached to a substrate. The leadframe is then attached to the substrate. More specifically, the semiconductor package includes a substrate, a lead frame and a plurality of leads. The lead frame is attached to the top surface of the substrate. The bottom surface of a first die is attached to the top surface of the substrate and the first die is electrically connected to the substrate. The top surface of a second die is attached to the bottom die pad surface of the lead frame and the second die is electrically connected to the leadframe. An encapsulant covers at least a portion of the lead frame and substrate.

Abstract translation: 一种半导体封装，以及制造半导体封装的方法，具有多个管芯，其中一个管芯附接到反相引线框架，另一个管芯附着到衬底。 然后将引线框架连接到基板。 更具体地，半导体封装包括衬底，引线框架和多个引线。 引线框架连接到基板的顶表面。 第一管芯的底表面附接到衬底的顶表面，并且第一管芯与衬底电连接。 第二管芯的顶表面附接到引线框架的底部焊盘表面，并且第二管芯电连接到引线框架。 密封剂覆盖引线框架和基板的至少一部分。

公开(公告)号：US20090165815A1

公开(公告)日：2009-07-02

申请号：US12326908

申请日：2008-12-03

Applicant: Debbie Tuerca ALCALA ,  Hendri Yanto KWEE ,  Michael TI-IN ,  Kian Teng ENG ,  Rodel MANALAC ,  Jimmy SIAT

Inventor： Debbie Tuerca ALCALA ,  Hendri Yanto KWEE ,  Michael TI-IN ,  Kian Teng ENG ,  Rodel MANALAC ,  Jimmy SIAT

IPC: H05H1/00 ,  B08B7/00

CPC classification number: H01L24/97 ,  B08B7/0035 ,  H01L21/67028 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/85013 ,  H01L2224/85913 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A plasma clean tool that includes a cleaning chamber for cleaning an article by plasma cleaning and a charge shield for surrounding an article to be cleaned is presented. The charge shield prevents charged components of plasma from passing therethrough to charge the article during plasma cleaning of the article.

Abstract translation: 提供了一种等离子体清洁工具，其包括用于通过等离子体清洁来清洁物品的清洁室和用于包围待清洁物品的电荷屏蔽物。 电荷屏蔽防止等离子体的带电组分通过其中，以在物品的等离子体清洁期间对物品充电。