Shielding process for SIP packaging

    公开(公告)号:US12107053B2

    公开(公告)日:2024-10-01

    申请号:US17620288

    申请日:2019-12-06

    IPC分类号: H05K1/02 H01L23/552 H05K3/28

    摘要: Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.

    Sound-producing device and electronic terminal

    公开(公告)号:US12081957B2

    公开(公告)日:2024-09-03

    申请号:US17773211

    申请日:2020-11-05

    申请人: Goertek Inc.

    CPC分类号: H04R9/043 H04R9/06 H04R7/20

    摘要: Disclosed are a sound-producing device and an electronic terminal. The sound-producing device comprises: a voice coil, the voice coil including a bobbin and a voice coil body wound outside the bobbin; the voice coil body is configured to be able to be input an electrical signal; a conductive member, the conductive member including a first connecting part connected with the voice coil, a second connecting part fixed to the sound-producing device, and an elastic part connected between the first connecting part and the second connecting part; the elastic part is in a planar structure, and is at least located in the same plane as the first connecting part; the conductive member is configured to input an electrical signal to the voice coil.

    Quantum convolution operator
    3.
    发明授权

    公开(公告)号:US12079691B2

    公开(公告)日:2024-09-03

    申请号:US18278723

    申请日:2022-02-23

    IPC分类号: G06N10/20

    CPC分类号: G06N10/20

    摘要: The present disclosure provides a quantum convolution operator, comprising: a quantum state encoding module, a quantum entanglement module, a quantum convolution kernel module, a measuring module, and a computing module; the quantum state encoding module is configured to encode a current group of input data onto qubits; the quantum entanglement module is configured to associate quantum state information of different qubits; the quantum convolution kernel module is configured to extract feature information corresponding to the quantum state information; the measuring module is configured to measure a quantum state of a preset qubit and obtain a corresponding amplitude; the computing module is configured to compute a convolution result corresponding to the current group of input data according to the measured quantum state and its amplitude.

    Vibration diaphragm, vibration assembly, sound generator and sound generator module

    公开(公告)号:US12069460B2

    公开(公告)日:2024-08-20

    申请号:US17054931

    申请日:2018-12-21

    申请人: GOERTEK INC.

    发明人: Xinxiang Huo Dan Han

    IPC分类号: H04R9/04 H04R7/14 H04R9/06

    摘要: Provided is a vibration diaphragm, comprising a wireless transmission unit which is arranged on one side of the vibration diaphragm where a voice coil can be fixed, and is used for electrically connecting with the voice coil, wirelessly receiving an audio signal transmitted from an external terminal and processing the audio signal to obtain audio current, and inputting the audio current into the voice coil; and a wireless charging unit which is electrically connected with the wireless transmission unit, generating electric energy under an action of an external power supply module and inputting the electric energy into the wireless transmission unit. Also provided are a vibration assembly, a sound generator and a sound generator module. With integration of the receiving and processing of audio signal on the vibration diaphragm, long-distance routing of a voice coil lead of the voice coil is avoided, noise is reduced, and product quality is improved.

    Display device and electronic apparatus

    公开(公告)号:US12050320B2

    公开(公告)日:2024-07-30

    申请号:US17618086

    申请日:2020-02-21

    IPC分类号: G02B27/01 G02B27/28

    CPC分类号: G02B27/0172 G02B27/283

    摘要: A display device and an electronic apparatus are disclosed. The display device comprises: an image-display component, which generates an image light output, wherein at least one pixel light of the image light output has light polarization components of at least two polarization states or has a polarization light component of a polarization state and a non-polarization light component; and a polarization dependent image offset component, which receives the image light output coming from the image display component and deflects the polarization light components based on the polarization states to separate each of the at least one pixel light into at least two pixel lights, or deflects the polarization light component from the non-polarization light component to separate each of the at least one pixel light into at least two pixel lights.

    Heat exchanger assembly having at least one multi-pass heat exchanger and method for operating a heat exchanger assembly

    公开(公告)号:US11976883B2

    公开(公告)日:2024-05-07

    申请号:US17601793

    申请日:2020-03-23

    摘要: The invention relates to a heat exchanger assembly with at least one multi-pass heat exchanger, comprising a first distributor (1) with a first connection part (1a) for connecting to a fluid line (9), a second distributor (2) with a second connection part (2a) for connecting to a fluid line (9), and at least one first deflection distributor (4), as well as a plurality of tube lines (5) through which a fluid, in particular water, can flow, wherein the first distributor (1) and the second distributor (2) are arranged at one end (A) of the heat exchanger assembly, the deflection distributor (4) is arranged at the opposite end (B) and the tube lines (5) extend from the one end (A) to the opposite end (B), and wherein the first connection part (1a) is arranged at a lowest point (T) or at least near to the lowest point (T) of the first distributor (1) and the second connection piece (2a) is arranged at a lowest point (T) or at least near to the lowest point (T) of the second distributor (2). In order to allow for the heat exchanger assembly to be quickly filled with the fluid and quickly emptied, a third connection part (3) is arranged on the first distributor (1) and/or on the second distributor (2) at a highest point (H) or at least near to the highest point (H) of the respective distributor (1 or 2), and at least one ventilation opening (10) is provided at a highest point (T) or at least near to the highest point (T) of the deflection distributor (4) for pressure equalisation with the environment.

    Surface sound-emitting apparatus and electronic device

    公开(公告)号:US11937060B2

    公开(公告)日:2024-03-19

    申请号:US17297518

    申请日:2018-12-28

    申请人: Goertek Inc.

    摘要: Disclosed are a surface sound-emitting apparatus and an electronic device. The surface sound-emitting apparatus comprises an exciter, a vibrating part and a connection element, wherein the connection element is of a sheet-like structure, the vibrating part is disposed on the connection element, the exciter is disposed on the vibrating part, an edge of the connection element is configured to connect to the remaining portion of a surface of an electronic device, the connection element and the remaining portion of the surface together constitute the surface, the connection element is configured to provide an elastic recovery force, and the exciter is configured to provide a driving force.

    Electromagnetic shielding structure and manufacturing method thereof, and electronic device

    公开(公告)号:US11882681B2

    公开(公告)日:2024-01-23

    申请号:US17614844

    申请日:2019-12-06

    IPC分类号: H05K9/00

    CPC分类号: H05K9/003

    摘要: Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.

    Adaptive illumination system for an autonomous vehicle

    公开(公告)号:US11865967B2

    公开(公告)日:2024-01-09

    申请号:US18149901

    申请日:2023-01-04

    申请人: TuSimple, Inc.

    IPC分类号: B60Q1/14 G06V20/58

    摘要: A system comprises a headlight mounted on an autonomous vehicle. The headlight is configured to illuminate at least a portion of a road the autonomous vehicle is on. The system further comprises a control device associated with the autonomous vehicle. The processor obtains information about an environment around the autonomous vehicle. The processor determines that at least a portion of the road should be illuminated if the information indicates that an illumination level of the portion of the road is less than a threshold illumination level. The processor adjusts the headlight to illuminate at least the portion of the road in response to determining that at least the portion of the road should be illuminated.