公开(公告)号：US11878937B2

公开(公告)日：2024-01-23

申请号：US16925944

申请日：2020-07-10

申请人： Heraeus Quarzglas GmbH & Co. KG ,  Heraeus Conamic UK Limited

发明人： Ian George Sayce ,  Michael Schindler ,  Fabian Schildt ,  Eduard Visnow

IPC分类号： C03C3/06 ,  C22B59/00 ,  C22B60/02 ,  C22B3/22 ,  B03B5/62 ,  C01B33/12 ,  C03C1/02

CPC分类号： C03C3/06 ,  B03B5/623 ,  C01B33/12 ,  C03C1/022 ,  C22B3/22 ,  C22B59/00 ,  C22B60/0252 ,  C22B60/0291 ,  C01P2004/03 ,  C01P2004/61 ,  C01P2006/80 ,  C03C2201/02

摘要： Described is a process for the refinement of a quartz powder, comprising the step of separating microparticles of refractory minerals, in particular minerals containing rare earth metal compounds, from the quartz powder by an elutriation step.

公开(公告)号：US11876028B2

公开(公告)日：2024-01-16

申请号：US17502082

申请日：2021-10-15

申请人： Infineon Technologies AG

发明人： Edward Fuergut ,  Chii Shang Hong ,  Teck Sim Lee ,  Bernd Schmoelzer ,  Ke Yan Tean ,  Lee Shuang Wang

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/49506 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49838 ,  H01L24/46 ,  H01L24/49 ,  H01L24/83 ,  H01L23/49503 ,  H01L23/49575 ,  H01L2924/181

摘要： A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

公开(公告)号：US11862582B2

公开(公告)日：2024-01-02

申请号：US17502084

申请日：2021-10-15

申请人： Infineon Technologies AG

发明人： Thorsten Meyer ,  Thomas Bemmerl ,  Martin Gruber ,  Martin Richard Niessner

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC分类号： H01L23/564 ,  H01L21/481 ,  H01L21/4828 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49541 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/73265 ,  H01L2224/92247

摘要： A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.

公开(公告)号：USD1006878S1

公开(公告)日：2023-12-05

申请号：US29784875

申请日：2021-05-21

申请人： Amsterdam Printing & Litho, Inc.

设计人： David M. Casciotti ,  Jing P. Mahler ,  Aaron Boese

摘要： FIG. 1 is an isometric view of a writing instrument showing our new design;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a back view of FIG. 1;
FIG. 4 is a right side view of FIG. 1, the left side view being a mirror image of the right side view;
FIG. 5 is a top view of FIG. 1; and,
FIG. 6 is a bottom view of FIG. 1.
The broken lines in the drawings of FIGS. 1-6 are included for the purpose of showing portions that form no part of the claimed design.
Stippling indicates contrast in appearance, including transparency, as compared to non-stippled surfaces which are non-transparent.

公开(公告)号：US11834362B2

公开(公告)日：2023-12-05

申请号：US17286062

申请日：2019-09-03

申请人： Heraeus Quarzglas GmbH & Co. KG ,  SHIN-ETSU Quartz Products Co., Ltd.

发明人： Tatsuya Mori ,  Akihiko Sugama

IPC分类号： C03B17/02 ,  C03B18/02 ,  C03C17/00 ,  C03C17/02 ,  C03C23/00

CPC分类号： C03B18/02 ,  C03C17/007 ,  C03C17/02 ,  C03C23/007 ,  C03C2218/117

摘要： One aspect is a method for producing a multilayered silica glass body. The method involves producing a multilayered silica glass body in which a transparent silica glass layer is provided on the surface of a siliceous substrate made of a siliceous material. The method includes preparing the siliceous substrate, preparing a silica slurry in which silica particles are dispersed in a liquid, applying the silica slurry to the surface of the siliceous substrate, leveling the silica slurry applied to the surface of the siliceous substrate by applying vibration to the siliceous substrate, drying the leveled silica slurry, and vitrifying the dried silica slurry by heating to form a transparent silica glass layer. As a result, a transparent silica glass layer of uniform thickness is obtained at excellent yield, and a method for producing a multilayered silica glass body easily in a short time is provided.

公开(公告)号：US11804301B2

公开(公告)日：2023-10-31

申请号：US16503064

申请日：2019-07-03

申请人： SRI International

发明人： Massimiliano de Zambotti ,  Fiona C. Baker ,  Mohamad Forouzanfar ,  Bhaskar Ramamurthy ,  Laurie Menoud

IPC分类号： G16H50/20 ,  G06N7/01 ,  G06N5/02 ,  G06N7/00

CPC分类号： G16H50/20 ,  G06N5/02 ,  G06N7/01

摘要： Embodiments in accordance with the present disclosure are directed to systems and methods for managing hot flashes and/or menopause symptoms. An example system includes sensor circuitry and logic circuitry. The sensor circuitry obtains a physical measurement associated with a user and communicates the physical measurement. The logic circuitry generates a predictive model that indicates a probability of the user having a hot flash at a date and time based on a plurality of input parameters, revises the probability based on the physical measurement using the predictive model, and communicates data indicative of an action in response to the revised probability being outside a threshold, such as providing cooling relief.

公开(公告)号：US11801755B2

公开(公告)日：2023-10-31

申请号：US17091712

申请日：2020-11-06

申请人： Taiga Motors Inc.

发明人： Samuel Bruneau ,  Gabriel Bernatchez ,  Paul Achard

IPC分类号： B60L7/26 ,  B60L15/20 ,  B60W10/08 ,  B60W30/08 ,  B60W10/00 ,  B60W30/18

CPC分类号： B60L7/26 ,  B60L15/2009 ,  B60L2240/421 ,  B60L2240/423 ,  B60T2270/60 ,  B60W10/00 ,  B60W30/18127

摘要： A brake control system for a vehicle includes a brake actuator operable over a range from an initial position that includes contiguous portions of displacement that are a first portion of displacement, a second portion of displacement and a third portion of displacement, a controller and an actuation sensor operatively coupled to the brake actuator. The actuation sensor sends a signal to the controller to activate a regenerative braking system using an electric motor of the vehicle if the actuation sensor detects the brake actuator is in the first portion of displacement. The regenerative braking system is activated and the friction braking system is activated when the brake actuator is in the second portion of displacement. The regenerative braking system is deactivated and the friction braking system is activated when the brake actuator is in the third portion of displacement.

公开(公告)号：USD1002466S1

公开(公告)日：2023-10-24

申请号：US29825535

申请日：2022-02-02

申请人： Ciro Corporation

设计人： Darron B. May

摘要： FIG. 1 is a perspective view of a license plate frame.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a first side view thereof, the second side opposite the first side being a mirror image thereof.
FIG. 5 is a top side view thereof; and,
FIG. 6 is a bottom side view thereof.
The mounting flange, front center surface, and rear surface of the license plate frame shown in broken lines form no part of the claimed design.

公开(公告)号：US11791255B2

公开(公告)日：2023-10-17

申请号：US17849788

申请日：2022-06-27

申请人： Infineon Technologies AG

发明人： Petteri Palm

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683

CPC分类号： H01L23/49844 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/04 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/1203 ,  H01L2924/1304

摘要： A die package and method is disclosed. In one example, the die package includes a die having a first die contact on a first side and a second die contact on a second side opposite the first side, and insulating material laterally adjacent to the die. A metal structure substantially directly contacts the surface of the second die contact, wherein the metal structure is made of the same material as the second die contact. A first pad contact on the first side of the die electrically contacts the first die contact, and a second pad contact on the first side of the die electrically contacts the second die contact via the metal structure. The insulating material electrically insulates the metal structure from the first die contact.

公开(公告)号：US11779892B2

公开(公告)日：2023-10-10

申请号：US14516395

申请日：2014-10-16

申请人： X-PERT Paint Mixing Systems, Inc.

发明人： Peter Santrach ,  Bruce Funk ,  Barry Hines ,  Christopher Herman

IPC分类号： B01F29/322 ,  B01F35/75 ,  B67D7/02 ,  B65D83/62 ,  B65D83/00 ,  B44D3/08 ,  B01F23/50 ,  B01F29/30 ,  B01F29/31 ,  B01F31/23 ,  B01F33/84 ,  B01F35/71 ,  B01F35/88 ,  B67D7/36 ,  H01F7/06 ,  F16K31/06 ,  B67D7/84 ,  H01F5/00 ,  B05B9/047 ,  B01F101/30

CPC分类号： B01F35/754 ,  B01F23/50 ,  B01F29/30 ,  B01F29/31 ,  B01F29/322 ,  B01F31/23 ,  B01F33/848 ,  B01F35/712 ,  B01F35/881 ,  B01F35/883 ,  B44D3/08 ,  B65D83/0055 ,  B65D83/62 ,  B67D7/0255 ,  B67D7/36 ,  B01F2101/30 ,  B05B9/047 ,  B67D7/84 ,  F16K31/0675 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F7/064

摘要： A novel canister storage system, mixing system, canister assembly, dispensing system, and tracking system. In one or more embodiments, the systems are used for storing, mixing and dispensing fluids. In one application, the fluid includes one or more paint toners.