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公开(公告)号：US12130760B2
公开(公告)日：2024-10-29
申请号：US18374705
申请日：2023-09-29
发明人： Byungtak Lee , Hee-Seong Lee , Myungkyoon Yim
IPC分类号： G06F13/36 , G06F13/362 , G06F13/40
CPC分类号： G06F13/362 , G06F13/4027
摘要： A system-on-chip including: a first slave having a first safety level; a second slave having a second safety level; a first master having a third safety level, the first master outputs a first access request for the first slave and a second access request for the second slave; a safety function protection controller that outputs first attribute information corresponding to the first safety level, second attribute information corresponding to the second safety level, and third attribute information corresponding to the third safety level; and an interconnect bus that receives the first, second and third attribute information, transfers the first access request to the first slave when it is determined that the third safety level is higher than or equal to the first safety level, and blocks the second access request when it is determined that the third safety level is lower than the second safety level.
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公开(公告)号：US12127427B2
公开(公告)日：2024-10-22
申请号：US18179226
申请日：2023-03-06
发明人： Hung Kun Ahn , Youngsang Park , Sungguk An
IPC分类号： H10K50/86 , H10K50/842 , H10K50/844 , H10K77/10
CPC分类号： H10K50/8445 , H10K50/8426 , H10K50/865 , H10K77/111
摘要： Provided is a display device. The display device includes a flexible display panel configured to display an image, and a window disposed on a display surface of the flexible display panel. The window includes a first protection layer, a thin film glass layer disposed on the first protection layer, and a second protective layer disposed on the thin film glass layer.
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3.发明授权公开(公告)号：US12127357B2
公开(公告)日：2024-10-22
申请号：US17394212
申请日：2021-08-04
发明人： Hosung Nam , Hoseung Kang , Minseop Kim , Sang Wol Lee
CPC分类号： H05K5/0217 , G06F1/1641 , G06F1/1652 , H04M1/0268
摘要： An electronic device includes a display module and a support plate disposed below the display module and in which an opening pattern is formed that corresponds to a foldable area. The support plate includes a top surface adjacent to the display module and a bottom surface that faces the top surface, and the opening pattern includes an opening that passes through the support plate from the top surface to the bottom surface and a plurality of support parts around the opening. In addition, in a cross-section, the support parts include at least one first support part that includes a first curved edge at one side of the top surface and a second curved edge at one side of the bottom surface that faces the first curved edge in a diagonal direction.
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公开(公告)号：US12126789B2
公开(公告)日：2024-10-22
申请号：US18069177
申请日：2022-12-20
发明人： Jeong Woo Park , Beom Shik Kim , Young Chan Kim , Su Bin Jung , Young Sang Ha
IPC分类号： H04N13/307 , G02B30/29
CPC分类号： H04N13/307 , G02B30/29
摘要： A display device includes a display panel, and a lens array disposed on a surface of the display panel. The lens array includes a plurality of lenses and a light transmission characteristic control layer disposed on a valley of each of the lenses. The light transmission characteristic control layer includes a light absorbing material. A stacked thickness of the light transmission characteristic control layer is smaller than a height of each of the lenses.
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公开(公告)号：US12125534B2
公开(公告)日：2024-10-22
申请号：US17935122
申请日：2022-09-25
发明人： Younggul Song , Junyeong Seok , Eun Chu Oh , Byungchul Jang
CPC分类号： G11C16/0483 , G11C5/063 , G11C16/08 , H10B69/00
摘要： A storage device includes a non-volatile memory device. The non-volatile memory device includes a first substrate including a first peripheral circuit region including a row decoder selecting one word line from among a plurality of word lines of a three-dimensional (3D) memory cell array and a second substrate including a second peripheral circuit region, including a page buffer unit selecting at least one bit line from among a plurality of bit lines of the 3D memory cell array, and a cell region including the 3D memory cell array formed in the second peripheral circuit region. The 3D memory cell array is disposed between the first peripheral circuit region and the second peripheral circuit region by vertically stacking and bonding the second substrate on and to the first substrate.
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公开(公告)号：US12119891B2
公开(公告)日：2024-10-15
申请号：US18312277
申请日：2023-05-04
发明人： Hyunjae Kang
摘要： A contactless integrated circuit (IC) card reader configured to communicate with a contactless IC card includes an antenna circuit, a variable amplifier that amplifies a carrier signal at an amplification gain and outputs the amplified carrier signal to the antenna circuit as a transmit signal, a variable attenuator that attenuates a receive signal received through the antenna circuit at an attenuation ratio, and a controller that controls the amplification gain and the attenuation ratio based on the attenuated receive signal.
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7.发明授权公开(公告)号：US12119351B2
公开(公告)日：2024-10-15
申请号：US17508704
申请日：2021-10-22
发明人： Dong-Il Bae , Kang-Ill Seo
IPC分类号： H01L27/092 , H01L21/3105 , H01L21/8234 , H01L27/088 , H01L29/06 , H01L29/08 , H01L29/161 , H01L29/423 , H01L29/66 , H01L29/775 , H01L29/78 , H01L29/786
CPC分类号： H01L27/0924 , H01L21/31053 , H01L21/823431 , H01L27/0886 , H01L29/0673 , H01L29/0847 , H01L29/161 , H01L29/42364 , H01L29/42392 , H01L29/66439 , H01L29/6681 , H01L29/775 , H01L29/785 , H01L29/7851 , H01L29/78696
摘要： A method of manufacturing a semiconductor device includes forming a fin structure on a substrate. A sacrificial layer pattern is formed on the fin structure. An active layer pattern is formed on the sacrificial layer pattern. A dummy gate pattern is formed on the active layer pattern. A spacer is formed on the dummy gate pattern. A source/drain structure is formed on the active layer pattern using an epitaxial growth process. An interlayer dielectric layer is formed on the dummy gate pattern and the active layer pattern. The interlayer dielectric layer is planarized to expose the dummy gate pattern. The dummy gate pattern is removed to expose the active layer pattern and the sacrificial layer pattern. The exposed sacrificial layer pattern is removed to form a through-hole between the exposed active layer pattern and the fin structure, the second portion of the sacrificial layer pattern is not removed.
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公开(公告)号：US12114541B2
公开(公告)日：2024-10-08
申请号：US17817329
申请日：2022-08-03
发明人： Yu-Gwang Jeong , Taewook Kang , Wooyong Sung
IPC分类号： H10K59/124 , H10K50/11 , H10K50/844 , H10K59/12 , H10K59/40 , H10K71/00 , H10K77/10
CPC分类号： H10K59/124 , H10K50/11 , H10K50/8445 , H10K59/40 , H10K71/00 , H10K77/10 , H10K59/1201
摘要： A method of manufacturing a display panel includes providing an insulating substrate that includes a hole area, a display area that surrounds the hole area, and a peripheral area adjacent to the display area, forming a semiconductor pattern in the display area, forming an insulating layer, forming contact holes in the insulating layer that expose portions of the semiconductor pattern, and forming a module hole by etching a portion of the insulating layer and a portion of the insulating substrate that overlap the hole area.
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公开(公告)号：US12114086B2
公开(公告)日：2024-10-08
申请号：US17454395
申请日：2021-11-10
发明人： Jung Bin Yun , Kyungho Lee
IPC分类号： H04N5/232 , H04N25/44 , H04N25/704 , H04N25/766 , H04N25/778
CPC分类号： H04N25/704 , H04N25/44 , H04N25/766 , H04N25/778
摘要： An electronic device includes an image sensor that generates image data, and an image processor that processes the image data. The image sensor includes a pixel array including pixels repeatedly disposed along a row direction and a column direction. Each of pixels belonging to a first row of rows of the pixel array includes sub-pixels each connected to one of a first transmission metal line, a second transmission metal line, and a third transmission metal line. In response to signals respectively applied to the first to third transmission metal lines, at least a part of charges integrated at the sub-pixels of the pixels belonging to the first row from among the pixels is diffused to corresponding floating diffusion areas.
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公开(公告)号：US12113084B2
公开(公告)日：2024-10-08
申请号：US17477232
申请日：2021-09-16
发明人： Taesub Jung , Kyungho Lee , Masato Fujita , Doosik Seol , Kyungduck Lee
IPC分类号： H01L27/146 , H01L27/148
CPC分类号： H01L27/1463 , H01L27/14612 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14831
摘要： An image sensor is provided. The image sensor includes a first pixel region and a second pixel region located within a semiconductor substrate, a first isolation layer surrounding the first pixel region and the second pixel region, a second isolation layer located between the first pixel region and the second pixel region, and a microlens arranged on the first pixel region and the second pixel region. Each of the first pixel region and the second pixel region include a photoelectric conversion device. The second isolation layer includes at least one first open region that exposes a portion of an area located between the first pixel region and the second pixel region.
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