Die bonding system with wafer lift and level assembly

    公开(公告)号:US11791197B2

    公开(公告)日:2023-10-17

    申请号:US17782520

    申请日:2021-08-20

    申请人: MRSI Systems LLC

    IPC分类号: H01L21/687

    摘要: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

    Apparatus and method for displaying an operational area

    公开(公告)号:US11783547B2

    公开(公告)日:2023-10-10

    申请号:US16643765

    申请日:2018-09-12

    申请人: BAE Systems plc

    摘要: An apparatus and method for displaying an operational area to an operative of a host platform, said operational area being defined within an external real-world environment relative to said host platform, the apparatus comprising a viewing device (12) configured to provide to said operative, in use, a three-dimensional view of said external real-world environment, a display generating device for creating images at the viewing device, and a processor (32) comprising an input (34) for receiving real-time first data representative of a specified target and its location within said external real-world environment and configured to receive or obtain second data representative of at least one characteristic of said specified target, the processor (32) being further configured to: use said first and second data to calculate a geometric volume representative of a region of influence of said specified target relative to said real-world external environment and/or said host platform, generate three-dimensional image data representative of said geometric volume, and display a three dimensional model, depicting said geometric volume and created using said three-dimensional image data, on said display generating device for creating images at the viewing device, the apparatus being configured to project or blend said three-dimensional model within said view of said external real-world environment at the relative location therein of said specified target.

    DC bulk conductive ceramic with low RF and microwave loss

    公开(公告)号:US11773026B2

    公开(公告)日:2023-10-03

    申请号:US17019441

    申请日:2020-09-14

    IPC分类号: C04B35/46 H01J37/32 C04B35/64

    摘要: A DC conductive, low RF/microwave loss titanium oxide ceramic provides, at room temperature, a bulk DC resistivity of less than 1×1011 ohm-meters and an RF loss tangent of less than 2×10−4 at 7.5 GHz and less than 2×10−5 at 650 MHz. The resistivity is reduced by oxygen vacancies and associated Ti3+ and/or Ti4+ centers created by sintering in an atmosphere containing only between 0.01% and 0.1% oxygen. The reduced resistivity prevents DC charge buildup, while the low loss tangent provides good RF/microwave transparency and low losses. The ceramic is suitable for forming RF windows, electron gun cathode insulators, dielectrics, and other components. An exemplary Mg2TiO4—MgTiO3 embodiment includes mixing, grinding, pre-sintering in air, and pressing 99.95% pure MgO and TiO2 powders, re-sintering in air at 1400° C.-1500° C. to reduce porosity, and sintering at 1350° C.-1450° C. for 4 hours in an 0.05% oxygen and 99.05% nitrogen atmosphere.

    Friction stir welding process
    4.
    发明授权

    公开(公告)号:US11766738B2

    公开(公告)日:2023-09-26

    申请号:US17791973

    申请日:2021-01-13

    申请人: BAE Systems plc

    IPC分类号: B23K20/00 B23K20/12

    摘要: A method of friction-stir welding, FSW, a joint J, for example a T joint and/or a lap joint, between a first workpiece W1 and a second workpiece W2, is described. The method comprises: performing a first pass P1 of FSW of the joint J by moving therealong a first tool (10), comprising a first probe (100) rotating in a first rotational direction RD1, in a first movement direction MD1 defining a first line L1, on a first side S1 of the joint J, comprising: inserting the first probe (100) to a first depth D1, thereby providing a first welded region WR1; withdrawing at least partially the first probe (100), thereby providing a first partially welded and/or unwelded region PWUR1; and fully withdrawing the first probe (100), thereby resulting in a first exit hole EXH1; performing a second pass P2 of FSW of the joint J by moving therealong a second tool (20), comprising a second probe (200) rotating in a second rotational direction RD2, in a second movement direction MD2 defining a second line L2, on the first side S1 of the joint J, comprising: inserting the second probe (200) to a second depth D2, thereby providing a second welded region WR2; optionally withdrawing at least partially the second probe (200); and fully withdrawing the second probe 200, thereby resulting in a second exit hole EXH2; wherein the second welded region WR2 includes the first exit hole EXH1; and wherein the second exit hole EXH2 is included in the first welded region WR1.

    Airframe and method for assembling an airframe

    公开(公告)号:US11738850B2

    公开(公告)日:2023-08-29

    申请号:US17789861

    申请日:2021-01-08

    申请人: BAE Systems plc

    IPC分类号: B64C1/06 B64F5/10 B64C1/12

    CPC分类号: B64C1/061 B64C1/12 B64F5/10

    摘要: An airframe 1 or part thereof comprises a set of modular cells 10, including a first cell 10A comprising a set of profiles 100 including: a first structural profile 100A, having a first length L1 and enclosing a first volume V1 providing a first passageway P1; and a second profile 100B, having a second length L2 and enclosing a second volume V2, wherein the first passageway P1 is arranged to receive the second profile 100B therein.

    Workbench system
    6.
    发明授权

    公开(公告)号:US11717972B2

    公开(公告)日:2023-08-08

    申请号:US17387385

    申请日:2021-07-28

    申请人: BAE Systems plc

    IPC分类号: B25J9/16 B25J19/06 G05B19/418

    摘要: A workbench system comprising: a workbench; a multi-axis robot; a visible light projector; and a controller; wherein the workbench and the robot are located in a common workspace; the controller is configured to: determine a movement operation for the robot; and, using the determined movement operation, control the visible light projector to project a visible light indication onto at least one of a surface of the workbench and a surface of the workspace; the visible light indication indicates a limited area of the workbench and/or workspace, the limited area corresponding to a limited volume of space; and the movement operation is such that, if the robot performs the movement operation, the robot moves entirely within only the limited volume of space.

    Heat exchanger
    9.
    发明授权

    公开(公告)号:US11609049B2

    公开(公告)日:2023-03-21

    申请号:US16976309

    申请日:2019-03-08

    申请人: BAE Systems plc

    IPC分类号: F28F3/08 F28D9/00

    摘要: There is disclosed a heat exchanger comprising: a plurality of first fluid channels, a plurality of conduits for interconnecting the first fluid channels, a plurality of second fluid channels, a plurality of conduits for interconnecting the second fluid channels, wherein the heat exchanger is configured as a plurality of repeating units, each repeating unit comprising: a base plate comprising a first opening, and a first conduit extending from the plate, the shape of the opening corresponding to the shape of the conduit.