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公开(公告)号：US20220077345A1
公开(公告)日：2022-03-10
申请号：US17526333
申请日：2021-11-15
发明人： SHIUE-LUNG CHEN , CHENG-KUO FENG
IPC分类号： H01L33/00 , H01L25/075
摘要： A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove.
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公开(公告)号：US11205738B2
公开(公告)日：2021-12-21
申请号：US16916011
申请日：2020-06-29
发明人： Shiue-Lung Chen , Cheng-Kuo Feng
IPC分类号： H01L33/00 , H01L25/075
摘要： A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove. A method for fluid-assisted assembly is also disclosed.
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公开(公告)号：US20200326594A1
公开(公告)日：2020-10-15
申请号：US16680784
申请日：2019-11-12
发明人： CHAO-HSIUNG CHANG , LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN , HSIN-CHIANG LIN , HOU-TE LIN
IPC分类号： G02F1/1335
摘要： A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.
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公开(公告)号：USD887589S1
公开(公告)日：2020-06-16
申请号：US29653168
申请日：2018-06-13
设计人： Chao-Hsiung Chang , Lung-Hsin Chen
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公开(公告)号：USD887588S1
公开(公告)日：2020-06-16
申请号：US29653167
申请日：2018-06-13
设计人： Chao-Hsiung Chang , Lung-Hsin Chen
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公开(公告)号：US20200176642A1
公开(公告)日：2020-06-04
申请号：US16287671
申请日：2019-02-27
发明人： TZU-CHIEN HUNG , SHIUE-LUNG CHEN , CHIA-HUI SHEN
摘要： A light emitting diode includes a substrate, an epitaxial structure, a light absorbing material, an n-type electrode, and a p-type electrode. The epitaxial structure includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer formed sequentially on the substrate. The epitaxial structure includes a first recess and a second recess. The first recess extends toward the n-type semiconductor layer. The light absorbing material is received within the second recess. The n-type electrode is received within the first recess and forms an ohmic contact with the n-type semiconductor layer. The p-type electrode forms an ohmic contact with the p-type semiconductor layer. The p-type electrode, the light absorbing material, and the n-type electrode are sequentially spaced apart.
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公开(公告)号：US20190319173A1
公开(公告)日：2019-10-17
申请号：US15972240
申请日：2018-05-07
发明人： Hou-Te LIN , Yi-Sen LIN , Chin-Fu CHENG , Wen-Liang TSENG , Pin-Chuan CHEN
摘要： A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.
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公开(公告)号：US20190198708A1
公开(公告)日：2019-06-27
申请号：US15940911
申请日：2018-03-29
发明人： CHING-HSUEH CHIU , PO-MIN TU , YA-WEN LIN
CPC分类号： H01L33/06 , B82Y20/00 , B82Y40/00 , H01L33/0066 , H01L33/145 , H01L33/325
摘要： An epitaxial wafer as a light emitting diode (LED) comprises a sapphire substrate, a buffer layer, an N-type semiconductor layer, a light emitting active layer, and a P type semiconductor layer. The buffer layer, the N-type semiconductor layer, the light emitting active layer, and the P type semiconductor layer are formed on C-plane of the sapphire substrate in that order. The light-emitting active layer comprises at least one quantum well structure, with a quantum well region, a gradient region, a high-content aluminum region, and a blocking region. The blocking region covers and is connected to the high-content aluminum region, the P-type semiconductor layer of aluminum-doped or indium-doped gallium nitride covers the gradient region. Content of aluminum or indium changes linearly from side close to the N-type semiconductor layer to side furthest from the N-type semiconductor layer.
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公开(公告)号：US20190128951A1
公开(公告)日：2019-05-02
申请号：US15824601
申请日：2017-11-28
发明人： PO-MIN TU , TZU-CHIEN HUNG , CHIA-HUI SHEN , CHIEN-SHIANG HUANG , CHIEN-CHUNG PENG , YA-WEN LIN , CHING-HSUEH CHIU
IPC分类号： G01R31/26 , H01L33/20 , H01L33/00 , H01L33/36 , H01L33/62 , H01L33/48 , H01L25/075 , H01L23/00
CPC分类号： G01R31/2635 , H01L24/92 , H01L24/94 , H01L25/0753 , H01L33/0008 , H01L33/005 , H01L33/20 , H01L33/36 , H01L33/483 , H01L33/62 , H01L2933/0016 , H01L2933/0025
摘要： A detection method for an LED chip comprising the following steps: providing a container with a solvent therein, and putting the LED chips in the container to mix the LED chips with the solvent; providing a base with a circuit therein, the base forms a plurality of receiving holes, a bottom of each receiving holes have an N electrode and a P electrode coupled with the circuit; transferring the solvent and the LED chip mixed in the solvent on the base; detecting the LED chip received in the receiving holes; providing a carrier film and classifying the LED chips on the carrier film.
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公开(公告)号：US10205048B1
公开(公告)日：2019-02-12
申请号：US15822227
申请日：2017-11-27
摘要： A method for manufacturing a light emitting diode (LED) chip comprises steps of stacking together a first substrate, a buffer layer, an ultraviolet light (UV) shielding layer, and at least one LED chip in that sequence. An orthogonal projection of each LED chip on the UV shielding layer is located in the scope of the UV shielding layer, and a periphery of the UV shielding layer protrudes from a periphery of the orthogonal projection; mounting a side of each LED chip facing away from the first substrate on the second substrate with an adhesive layer; irradiating UV light from a side of the first substrate facing away from the LED chip, to separate the first substrate from the UV shielding layer; removing the UV light shielding layer, the second substrate, and the adhesive layer from each LED chip.
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