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公开(公告)号:US20110257406A1
公开(公告)日:2011-10-20
申请号:US13090613
申请日:2011-04-20
IPC分类号: C07F15/06 , C07C251/38 , C07F9/50 , C07F7/22 , C07C247/04
CPC分类号: C07F15/045 , B01J31/1805 , B01J2531/845 , B01J2531/847 , C07C247/04 , C07C259/04 , C07D249/04 , C07D249/16 , C07F15/065 , C25B11/04 , C25B11/0442
摘要: The present invention is directed towards proposing ligands of formula: and is also directed towards a substrate at the surface of which is immobilized at least one unit of formula:
摘要翻译: 本发明涉及提出式的配位体,并且也指向底物,其表面固定有至少一个式:
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公开(公告)号:US08735594B2
公开(公告)日:2014-05-27
申请号:US13090613
申请日:2011-04-20
IPC分类号: C07F15/04 , C07F15/06 , C07D249/04 , C07D249/16 , C07C247/04 , C07C259/04
CPC分类号: C07F15/045 , B01J31/1805 , B01J2531/845 , B01J2531/847 , C07C247/04 , C07C259/04 , C07D249/04 , C07D249/16 , C07F15/065 , C25B11/04 , C25B11/0442
摘要: The present invention is directed towards proposing ligands of formula: and is also directed towards a substrate at the surface of which is immobilized at least one unit of formula:
摘要翻译: 本发明涉及提出式的配位体,并且也指向底物,其表面固定有至少一个式:
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