公开(公告)号：US20080264678A1

公开(公告)日：2008-10-30

申请号：US11662024

申请日：2005-09-06

申请人： Tomoo lijima ,  Hiroshi Odaira ,  Tomokazu Shimada ,  Akifumi Iijima

发明人： Tomoo lijima ,  Hiroshi Odaira ,  Tomokazu Shimada ,  Akifumi Iijima

IPC分类号： H05K1/00 ,  H05K3/02

CPC分类号： H05K3/462 ,  H05K1/036 ,  H05K3/06 ,  H05K3/4038 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/066 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49156

摘要： The connection resistance between a metal bump (8) and a metal layer (10) for forming a wiring film deposited later is further decreased, the connection stability is enhanced, the wiring path passing through the metal bump (8) is further shortened, the planarity is enhanced, and the metal bump (8) does not come out easily. A wiring film interconnecting member wherein a plurality of pillar-like metal bumps (8) composed of copper and having a cross-sectional area of the top surface smaller than that of the bottom surface and interconnecting the wiring films of a multilayer wiring board are buried in an interlayer insulation film (10) in such a way that at least one end projects. The upper surface of the interlayer insulation film (10) is so curved as to be high at a part in contact with the metal bump (8) and lower gradually as being farther therefrom.

摘要翻译： 金属凸块（8）和用于形成稍后沉积的布线膜的金属层（10）之间的连接电阻进一步降低，连接稳定性提高，穿过金属凸块（8）的布线路径进一步缩短， 平坦度提高，并且金属凸块（8）不容易脱出。 一种布线膜互连构件，其中埋设有由铜构成的多个柱状金属凸块（8），其顶表面的横截面积小于底面的横截面面积并且互连多层布线板的布线膜 在层间绝缘膜（10）中，至少一个端部突出。 层间绝缘膜（10）的上表面弯曲成与金属凸块（8）接触的部分高，并且随着其越远逐渐下降。