Metrics independent and recipe independent fault classes
    2.
    发明授权
    Metrics independent and recipe independent fault classes 有权
    度量独立和食谱独立的故障类

    公开(公告)号:US08010321B2

    公开(公告)日:2011-08-30

    申请号:US11800460

    申请日:2007-05-04

    摘要: A method and apparatus for diagnosing faults. Process data is analyzed using a first metric to identify a fault. The process data was obtained from a manufacturing machine running a first recipe. A fault signature that matches the fault is identified. The identified fault signature was generated using a second metric and/or a second recipe. At least one fault class that is associated with the fault signature is identified.

    摘要翻译: 一种用于诊断故障的方法和装置。 使用第一个度量来分析过程数据以识别故障。 过程数据是从运行第一配方的制造机器获得的。 识别与故障匹配的故障签名。 使用第二度量和/或第二配方生成所识别的故障签名。 识别与故障签名相关联的至少一个故障类。

    Graphical user interface for presenting multivariate fault contributions
    3.
    发明授权
    Graphical user interface for presenting multivariate fault contributions 失效
    用于呈现多变量故障贡献的图形用户界面

    公开(公告)号:US07765020B2

    公开(公告)日:2010-07-27

    申请号:US11800462

    申请日:2007-05-04

    IPC分类号: G06F19/00 G06F11/00

    摘要: Methods and apparatuses for presenting multivariate fault contributions in a user interface are described. A user interface is provided to illustrate a fault for a sample manufactured by a process containing multiple variables, each having at least two components. The user interface presents one group of components of the multiple variables in a first axis and a second group of components of the multiple variables in a second axis and graphically illustrates contributions to the fault associated with the multiple variables by associating a contribution of each component in the one group of components of the multiple variables to each corresponding component in the second group of components of the multiple variables.

    摘要翻译: 描述用于在用户界面中呈现多变量故障贡献的方法和装置。 提供用户界面来说明由包含多个变量的过程制造的样本的故障,每个变量具有至少两个组件。 用户界面在第二轴中的多个变量的第一轴和第二组分量中呈现多个变量的一组组件,并以图形方式示出了通过将每个组件的贡献关联到与多个变量相关联的故障的贡献 多组变量的一组组件对于每个对应组件的第二组组件中的多个变量。

    System, method, and medium for monitoring performance of an advanced process control system
    4.
    发明授权
    System, method, and medium for monitoring performance of an advanced process control system 失效
    用于监控先进过程控制系统性能的系统,方法和介质

    公开(公告)号:US07356377B2

    公开(公告)日:2008-04-08

    申请号:US10765921

    申请日:2004-01-29

    IPC分类号: G06F19/00

    CPC分类号: G05B23/0294

    摘要: A method for monitoring performance of an advanced process control system for at least one process output includes calculating a variance of a prediction error for a processing performance and/or a probability for violating specification limits of the processing performance of the at least one process output. If the variance of the prediction error is calculated, the method also includes calculating a model health index. If the probability for violating specification limits is calculated, the method further includes calculating a process health index.

    摘要翻译: 一种用于监视至少一个过程输出的高级过程控制系统的性能的方法包括计算用于处理性能的预测误差的方差和/或违反所述至少一个过程输出的处理性能的规范限制的概率。 如果计算出预测误差的方差,则该方法还包括计算模型健康指数。 如果计算违反规格限制的概率,则该方法还包括计算过程健康指数。

    Integration of fault detection with run-to-run control
    5.
    发明授权
    Integration of fault detection with run-to-run control 有权
    故障检测与运行控制的集成

    公开(公告)号:US07337019B2

    公开(公告)日:2008-02-26

    申请号:US10135405

    申请日:2002-05-01

    IPC分类号: G06F19/00 H05B1/02 G05B11/01

    摘要: Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition. In these cases, the fault detection models may be modified to incorporate, as parameters, setpoints of a recipe modified by a run-to-run controller.

    摘要翻译: 半导体晶片与使用运行控制器和故障检测系统的制造执行系统一起进行处理。 通过用于控制工具的跑步运行控制器从制造执行系统接收配方。 该配方包括用于获得一个或多个目标晶片特性的设定点。 通过使用故障检测系统和一个或多个传感器测量包括故障状况和晶片特性的处理属性来监视晶片的处理。 除了在故障检测系统检测到故障情况的情况下,配方的设定点可以根据处理属性在运行控制器上修改以维持目标晶片特性。 因此,在存在工具或晶片故障条件的情况下获取的数据不用于反馈目的。 此外,可以使用故障检测模型来定义指示故障状况的条件范围。 在这些情况下,可以修改故障检测模型,以便将由运行到运行的控制器修改的配方的设定点作为参数进行参考。

    Integrating tool, module, and fab level control

    公开(公告)号:US07047099B2

    公开(公告)日:2006-05-16

    申请号:US10173108

    申请日:2002-06-18

    IPC分类号: G06F19/00

    摘要: Semiconductor wafers are processed in a fab in a manner that integrates control at multiple functional unit levels. Examples of functional units include fabs, modules, tools, and the like. Initially, a number of functional unit property targets are received at a functional unit. The functional unit property targets are utilized to generate a number of tool targets for any number of tool level functional units. From there, the tool targets are forwarded to the corresponding tool level functional units. At these tool level functional units, a number of tool recipes, each of which define a number of process setpoints, may be generated by processing the tool targets. The process setpoints define a number of parameters which must be satisfied in order to attain the corresponding tool targets. In addition, in at least some embodiments, the tool targets and tool recipes are determined utilizing feedback information including functional unit states and measurements of controlled parameters.

    Method and apparatus for determining factors for design consideration in yield analysis
    10.
    发明申请
    Method and apparatus for determining factors for design consideration in yield analysis 有权
    用于确定产量分析中设计考虑因素的方法和装置

    公开(公告)号:US20080295063A1

    公开(公告)日:2008-11-27

    申请号:US12154586

    申请日:2008-05-22

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5081 G06F2217/10

    摘要: Embodiments of the present invention provide methods and apparatuses for determining factors for design consideration in yield analysis of semiconductor fabrication. In one embodiment, a computer-implemented method for determining factors for design consideration in yield analysis of semiconductor fabrication includes obtaining a geometric characteristic of a defect on a chip and obtaining design data of the chip, where the design data is associated with the defect. The method further includes determining a criticality factor of the defect based on the geometric characteristic and the design data, and outputting the criticality factor.

    摘要翻译: 本发明的实施例提供了用于确定半导体制造的成品率分析中的设计考虑因素的方法和装置。 在一个实施例中,用于确定半导体制造的成品率分析中的设计考虑因素的计算机实现方法包括获得芯片上的缺陷的几何特性并获得设计数据与缺陷相关联的芯片的设计数据。 该方法还包括基于几何特征和设计数据确定缺陷的关键因素,并输出关键因素。