公开(公告)号：US06409543B1

公开(公告)日：2002-06-25

申请号：US09769868

申请日：2001-01-25

申请人： Allan L Astbury, Jr. ,  Thomas S. Cohen

发明人： Allan L Astbury, Jr. ,  Thomas S. Cohen

IPC分类号： H01R13648

CPC分类号： H01R13/6587

摘要： A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.

摘要翻译： 高速，高密度电连接器。 连接器由晶圆组装。 通过在屏蔽板上模制第一介电壳体来形成每个晶片。 信号触点插入第一介电壳体中，第二壳体在第一壳体上被包覆成型。 采用特征来将第一和第二壳体与屏蔽板一起锁定，以提供机械坚固的子组件。 形成的连接器具有良好的电气性能，包括精确的阻抗控制和低串扰。

公开(公告)号：US06592381B2

公开(公告)日：2003-07-15

申请号：US09769867

申请日：2001-01-25

申请人： Thomas S. Cohen ,  Allan L Astbury, Jr. ,  Steven J. Allen

发明人： Thomas S. Cohen ,  Allan L Astbury, Jr. ,  Steven J. Allen

IPC分类号： H01R1200

CPC分类号： H01R12/7088 ,  H01R12/716 ,  H01R13/24 ,  H01R13/514

摘要： An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.

公开(公告)号：US06602095B2

公开(公告)日：2003-08-05

申请号：US10131055

申请日：2002-04-24

申请人： Allan L Astbury, Jr. ,  Thomas S. Cohen

发明人： Allan L Astbury, Jr. ,  Thomas S. Cohen

IPC分类号： H01R13648

CPC分类号： H01R13/6587

摘要： A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.

摘要翻译： 高速，高密度电连接器。 连接器由晶圆组装。 通过在屏蔽板上模制第一介电壳体来形成每个晶片。 信号触点插入第一介电壳体中，第二壳体在第一壳体上被包覆成型。 采用特征来将第一和第二壳体与屏蔽板一起锁定，以提供机械坚固的子组件。 形成的连接器具有良好的电气性能，包括精确的阻抗控制和低串扰。