公开(公告)号：US12212100B2

公开(公告)日：2025-01-28

申请号：US17732437

申请日：2022-04-28

Applicant: Amphenol Corporation

Inventor： Arkady Y. Zerebilov ,  Michael Rowlands ,  Theron Ensminger ,  Jeremy Shober

IPC: H01R13/6471 ,  H01R4/02 ,  H01R13/506 ,  H01R13/6581 ,  H01R13/6597 ,  H01R25/00

Abstract: A connector for use with high speed signals. The connector may include lead frame assemblies in a connector housing. A lead frame assembly may include signal conductive elements and ground conductive elements disposed in a repeating pattern, and one or more corrugated sheets attached to the ground conductive elements. The corrugated sheets may extend more than half of the length of the signal conductive elements. Valleys of the corrugated sheets may be welded to the ground conductive elements with line welds. The line welds may extend over a large percentage of the length of the conductive elements. Such a configuration enables accurately and repeatedly establishing signal to ground spacing and therefore promotes high signal integrity, even for miniaturized connectors. Such a connector may be used to meet signal integrity requirements in connectors designed for 112 GBps and beyond.

公开(公告)号：US20250024602A1

公开(公告)日：2025-01-16

申请号：US18765924

申请日：2024-07-08

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, Jr. ,  Mark W. Gailus ,  David Levine ,  Vysakh Sivarajan

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

Abstract: A printed circuit board includes: a plurality of layers including attachment layers and routing layers; and via patterns formed in one or more of the plurality of layers, each of the via patterns including: first and second signal vias configured to accept contact tails of signal conductors of a connector; ground vias configured to accept contact tails of ground conductors of the connector; ground shadow vias located adjacent to each of the first and second signal vias; and non-plated holes located between each of the ground shadow vias and the signal vias. Different layers of the plurality of layers may have different antipad configurations.

公开(公告)号：US12184025B2

公开(公告)日：2024-12-31

申请号：US18349888

申请日：2023-07-10

Applicant: Amphenol Corporation

Inventor： Owen R. Barthelmes ,  Michael A. Hoyack

IPC: H01R9/05 ,  H01R13/6582 ,  H01R13/6583 ,  H01R24/50 ,  H01R24/54 ,  H01R13/6599 ,  H01R103/00

Abstract: A connector assembly that includes a receptacle with inner and outer shells which have a front end for mating with a mating connector and a back end configured to connect to a printed circuit board. Receptacle primary and secondary ground connections are located on one of the shells. A plug with an outer shell that supports a pin contact to mate with the socket contact. The outer shell of the plug has a front end for mating with the front end of the receptacle and a back end that is configured to connect to a coaxial cable. Plug primary and secondary ground connections are located on the outer shell. When the receptacle and plug are mated, the primary ground connections form a primary grounding path through the assembly and the secondary ground connections form a secondary grounding path through the assembly, thereby electrically connecting the plug with the board.

公开(公告)号：US12184012B2

公开(公告)日：2024-12-31

申请号：US18335472

申请日：2023-06-15

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, Jr. ,  John Robert Dunham ,  Mark W. Gailus ,  Donald A. Girard, Jr. ,  David Manter ,  Tom Pitten ,  Vysakh Sivarajan ,  Michael Joseph Snyder

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/73 ,  H01R13/02 ,  H01R13/518 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R13/6599 ,  H01R43/24

Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.

公开(公告)号：US12171063B2

公开(公告)日：2024-12-17

申请号：US18357218

申请日：2023-07-24

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, Jr. ,  Mark W. Gailus ,  Tom Pitten ,  Donald A. Girard, Jr. ,  Huilin Ren

IPC: H05K1/11 ,  H01R13/66 ,  H05K1/14

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

公开(公告)号：US11950356B2

公开(公告)日：2024-04-02

申请号：US18079956

申请日：2022-12-13

Applicant: Amphenol Corporation

Inventor： Mark W. Gailus ,  Marc B. Cartier, Jr. ,  Vysakh Sivarajan ,  David Levine

IPC: H05K1/02 ,  H01R43/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K1/0222 ,  H01R43/205 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/07 ,  H05K2201/09063 ,  H05K2201/09318 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

公开(公告)号：US11901654B2

公开(公告)日：2024-02-13

申请号：US17016651

申请日：2020-09-10

Applicant: Amphenol Corporation

Inventor： Michael A. Hoyack ,  Joachim I. Grek ,  Owen R. Barthelmes

IPC: H01R12/52 ,  H05K3/36 ,  H01R43/20 ,  H01R12/58 ,  H05K1/14 ,  H01R12/73 ,  H01R13/453 ,  H01R12/70 ,  H01R12/91 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01R12/523 ,  H01R12/58 ,  H01R12/7082 ,  H01R12/73 ,  H01R12/91 ,  H01R13/4538 ,  H01R43/205 ,  H05K1/144 ,  H05K3/368 ,  H01R12/585 ,  H01R12/7052 ,  H05K1/0243 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10189 ,  H05K2203/167 ,  Y10T29/4913

Abstract: A method of interconnecting first and second printed circuit boards using a float connector with a contact assembly that includes installing a first guide member onto the first printed circuit board with the float connector in an open non-compressed position, after installing the first guide member onto the first printed circuit board, installing a second guide member onto the second printed circuit board with the float connector in the open non-compressed position, and compressing the first and second printed circuit boards toward one another to move the float connector from the open non-compressed position to a compressed position until contact ends of the contact assembly of the float connector are exposed outside of the first and second guide members, respectively, thereby electrically connecting the contact ends to the first and second printed circuit boards, respectively, for electrical connection between the first and second printed circuit boards through the float connector.

公开(公告)号：US20240030660A1

公开(公告)日：2024-01-25

申请号：US18335472

申请日：2023-06-15

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  Donald A. Girard, JR. ,  David Manter ,  Tom Pitten ,  Vysakh Sivarajan ,  Michael Joseph Snyder

IPC: H01R13/6598 ,  H01R12/72 ,  H01R12/73 ,  H01R13/518 ,  H01R13/6587 ,  H01R13/6585 ,  H01R13/6599 ,  H01R13/02 ,  H01R43/24

CPC classification number: H01R13/6598 ,  H01R12/724 ,  H01R12/737 ,  H01R13/518 ,  H01R13/6587 ,  H01R13/6585 ,  H01R13/6599 ,  H01R13/025 ,  H01R43/24 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.

公开(公告)号：US20240023232A1

公开(公告)日：2024-01-18

申请号：US18475344

申请日：2023-09-27

Applicant: Amphenol Corporation

Inventor： Marc Robert Charbonneau ,  Jose Ricardo Paniagua

IPC: H05K1/02 ,  H01R12/70 ,  H01R12/71 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0245 ,  H01R12/7082 ,  H01R12/716 ,  H05K1/115 ,  H05K1/0251 ,  H05K3/429 ,  H05K1/0219 ,  H05K2201/09727 ,  H05K1/0225 ,  H05K2201/096 ,  H05K2201/09845

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

公开(公告)号：US11824311B2

公开(公告)日：2023-11-21

申请号：US17353649

申请日：2021-06-21

Applicant: Amphenol Corporation

Inventor： Mark W. Gailus ,  Allan Astbury ,  David Manter ,  Marc B. Cartier, Jr. ,  Vysakh Sivarajan ,  John Robert Dunham

IPC: H01R13/6471 ,  H01R12/72 ,  H01R13/514 ,  H01R24/30 ,  H01R13/6477 ,  H01R4/02 ,  H01R12/70 ,  H01R12/71 ,  H05K1/02 ,  H05K3/32 ,  H01R13/6587 ,  H01R12/52 ,  H01R13/6474

CPC classification number: H01R13/6471 ,  H01R4/023 ,  H01R12/7082 ,  H01R12/716 ,  H01R12/721 ,  H01R12/728 ,  H01R13/514 ,  H01R13/6477 ,  H01R24/30 ,  H05K1/0245 ,  H05K3/32 ,  H01R12/52 ,  H01R13/6474 ,  H01R13/6587 ,  H05K2201/1059 ,  H05K2201/10189

Abstract: A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.