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公开(公告)号:US07855685B2
公开(公告)日:2010-12-21
申请号:US11904986
申请日:2007-09-28
申请人: Matthew R. Walsh , Deepukumar M. Nair , David W. Zimmerman , Benjamen E. Haffke , Scott D. Brandenburg , Charles I. Delheimer , Michael E. Miller , Bruce Wayne Butler
发明人: Matthew R. Walsh , Deepukumar M. Nair , David W. Zimmerman , Benjamen E. Haffke , Scott D. Brandenburg , Charles I. Delheimer , Michael E. Miller , Bruce Wayne Butler
IPC分类号: H01Q1/38
CPC分类号: H01L23/66 , H01L2223/6627 , H01L2223/6633 , H01L2223/6677 , H01L2924/1617 , H01L2924/19032 , H01L2924/19039 , H01P5/107
摘要: A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.
摘要翻译: 微波通信封装构造在具有限定基板空腔的第一侧的导电基板上,天线装置安装在相对的第二侧上。 基板的第一侧的电介质基板覆盖基板空腔; 并且密封装置使绝缘基板和基板完全围绕底板腔体密封,从而密封空腔。 安装在基板腔内的基板表面上的电路包括一个或多个微带线,其将部件传送到一个或多个包括穿过基板的开口的波导; 并且波导在其相对端耦合到天线装置。
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公开(公告)号:US20090085808A1
公开(公告)日:2009-04-02
申请号:US11904986
申请日:2007-09-28
申请人: Matthew R. Walsh , Deepukumar M. Nair , David W. Zimmerman , Benjamen E. Haffke , Scott D. Brandenburg , Charles I. Delheimer , Michael E. Miller , Bruce Wayne Butler
发明人: Matthew R. Walsh , Deepukumar M. Nair , David W. Zimmerman , Benjamen E. Haffke , Scott D. Brandenburg , Charles I. Delheimer , Michael E. Miller , Bruce Wayne Butler
IPC分类号: H01Q1/38
CPC分类号: H01L23/66 , H01L2223/6627 , H01L2223/6633 , H01L2223/6677 , H01L2924/1617 , H01L2924/19032 , H01L2924/19039 , H01P5/107
摘要: A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.
摘要翻译: 微波通信封装构造在具有限定基板空腔的第一侧的导电基板上,天线装置安装在相对的第二侧上。 基板的第一侧的电介质基板覆盖基板空腔; 并且密封装置使绝缘基板和基板完全围绕底板腔体密封,从而密封空腔。 安装在基板腔内的基板表面上的电路包括一个或多个微带线,其将部件传送到一个或多个包括穿过基板的开口的波导; 并且波导在其相对端耦合到天线装置。
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