公开(公告)号：US08679316B2

公开(公告)日：2014-03-25

申请号：US12921817

申请日：2009-04-27

申请人： Heiko Brunner ,  Bernd Roelfs ,  Dirk Rohde ,  Thomas Pliet

发明人： Heiko Brunner ,  Bernd Roelfs ,  Dirk Rohde ,  Thomas Pliet

IPC分类号： C25D5/02 ,  C25D3/38

CPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/421 ,  H05K3/423

摘要： An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

摘要翻译： 用于铜的电解沉积的含水酸浴包含至少一种铜离子源，至少一种酸离子源，至少一种增白剂化合物和至少一种整理剂化合物，并且特别是在盲人中产生非常均匀的铜沉积物 微通道（BMV）和沟槽。 整平剂化合物选自合成产生的非官能化肽，合成产生的官能化肽和合成产生的官能化氨基酸。

公开(公告)号：US20090236230A1

公开(公告)日：2009-09-24

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔

公开(公告)号：US20140102910A1

公开(公告)日：2014-04-17

申请号：US14124268

申请日：2012-05-07

申请人： Dirk Rohde ,  Bernd Roelfs ,  Jun Higuchi

发明人： Dirk Rohde ,  Bernd Roelfs ,  Jun Higuchi

IPC分类号： C25D3/38

CPC分类号： C25D3/38 ,  C25D5/34 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76898 ,  H05K3/187 ,  H05K3/423 ,  H05K2203/0733

摘要： A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

摘要翻译： 公开了一种在电镀浴中镀铜的方法，其中使衬底与包含具有硫醇基的杂环核心和通过间隔物连接到所述杂环核心上的氨基的矫味添加剂接触。 所述方法特别适用于在印刷电路板，IC基板和半导体基板的制造中填充凹陷结构。

公开(公告)号：US09506158B2

公开(公告)日：2016-11-29

申请号：US14124268

申请日：2012-05-07

申请人： Dirk Rohde ,  Bernd Roelfs ,  Jun Higuchi

发明人： Dirk Rohde ,  Bernd Roelfs ,  Jun Higuchi

IPC分类号： C25D3/38 ,  C25D7/12 ,  C25D5/34 ,  H01L21/288 ,  H05K3/42 ,  H01L21/768 ,  H05K3/18

CPC分类号： C25D3/38 ,  C25D5/34 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76898 ,  H05K3/187 ,  H05K3/423 ,  H05K2203/0733

摘要： A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

摘要翻译： 公开了一种电镀浴中的镀铜方法，其中使衬底与含有硫醇基的杂环核心和通过间隔物连接到杂环核心上的氨基的矫味添加剂接触。 该方法特别适用于在印刷电路板，IC基板和半导体基板的制造中填充凹陷结构。

公开(公告)号：US09445510B2

公开(公告)日：2016-09-13

申请号：US11661704

申请日：2005-08-30

申请人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

发明人： Bert Reents ,  Thomas Pliet ,  Bernd Roelfs ,  Toshiya Fujiwara ,  Rene Wenzel ,  Markus Youkhanis ,  Soungsoo Kim

IPC分类号： C25D5/18 ,  C25D3/38 ,  C25D21/12 ,  H05K3/42 ,  C25D7/12

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  H05K1/115 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

摘要翻译： 本发明涉及用金属填充通孔的电镀工艺。 该工艺特别适用于用铜填充印刷电路板的通孔。 该方法包括以下步骤：（i）通过电镀在通孔的中心形成窄部分; 和（ii）通过电镀用金属填充步骤（i）中获得的通孔。

公开(公告)号：US08784634B2

公开(公告)日：2014-07-22

申请号：US12295513

申请日：2007-03-30

申请人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  René Wenzel ,  Soungsoo Kim

发明人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  René Wenzel ,  Soungsoo Kim

IPC分类号： C25D21/18 ,  C25D5/18 ,  C25D3/38 ,  C25D3/58 ,  H05K3/42

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

摘要翻译： 公开了一种用金属填充工件的空腔，通孔，盲孔或微盲孔的电镀方法。 根据所述方法，将包含空腔，通孔，盲孔或微盲孔的工件与金属沉积电解质接触，并且在工件和至少一个阳极之间施加电压，使得电流 被送入工件。 本发明的方法的特征在于电解质包含氧化还原体系。

公开(公告)号：US20110011746A1

公开(公告)日：2011-01-20

申请号：US12921817

申请日：2009-04-27

申请人： Heiko Brunner ,  Bernd Roelfs ,  Dirk Rohde ,  Thomas Pliet

发明人： Heiko Brunner ,  Bernd Roelfs ,  Dirk Rohde ,  Thomas Pliet

IPC分类号： C25D5/02 ,  C25D3/38 ,  C25D7/12

CPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/421 ,  H05K3/423

摘要： To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids.

摘要翻译： 为了产生特别是在盲微孔（BMV）和沟槽中的非常均匀的铜沉积物，提供了用于电解沉积铜的水性酸浴，所述浴含有至少一种铜离子源，至少一种酸性离子源， 至少一种增白剂化合物和至少一种矫味剂化合物，其中至少一种矫味剂化合物选自合成产生的非官能化肽和合成产生的官能化肽和合成产生的官能化氨基酸。

公开(公告)号：US20090301889A1

公开(公告)日：2009-12-10

申请号：US12295513

申请日：2007-03-30

申请人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

发明人： Bert Reents ,  Bernd Roelfs ,  Tafadzwa Magaya ,  Markus Youkhanis ,  Rene Wenzel ,  Soungsoo Kim

IPC分类号： C25D5/00 ,  C25D5/10

CPC分类号： H05K3/423 ,  C25D3/38 ,  C25D5/18 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

摘要： Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

摘要翻译： 公开了一种用金属填充工件的空腔，通孔，盲孔或微盲孔的电镀方法。 根据所述方法，将包含空腔，通孔，盲孔或微盲孔的工件与金属沉积电解质接触，并且在工件和至少一个阳极之间施加电压，使得电流 被送入工件。 本发明的方法的特征在于电解质包含氧化还原体系。