公开(公告)号：US20130105993A1

公开(公告)日：2013-05-02

申请号：US13284314

申请日：2011-10-28

Applicant: Raj BAHADUR ,  David SHADDOCK ,  Binoy SHAH

Inventor： Raj BAHADUR ,  David SHADDOCK ,  Binoy SHAH

IPC: H01L23/48 ,  H01L21/28

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/03829 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/115 ,  H01L2224/11901 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/14163 ,  H01L2224/14166 ,  H01L2224/14179 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2224/81902 ,  H01L2225/06506 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/114 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: There is set forth herein a semiconductor assembly including an integrated circuit and a set of springs extending from the integrated circuit that can be adapted for connection to an external article. The external article can be e.g. an integrated circuit or a printed circuit board. On connection of the semiconductor assembly to an external article there can be defined a semiconductor assembly comprising the integrated circuit the set of springs and the external article. The set of springs can be metal nanospring array can formed by GLAD (Glancing angle deposition) process. In one embodiment, the nanospring array can be GLAD formed on a substrate and then applied to the integrated circuit. In one embodiment, the nanospring array can be GLAD formed on the integrated circuit.

Abstract translation: 这里提出了包括集成电路和从集成电路延伸的一组弹簧的半导体组件，其可以适于连接到外部制品。 外部物品可以是例如。 集成电路或印刷电路板。 在将半导体组件连接到外部制品上时，可以限定一个半导体组件，该半导体组件包括该组弹簧和外部制品的集成电路。 该组弹簧可以是通过GLAD（Glancing Angle Deposition）工艺形成的金属纳米螺旋阵列。 在一个实施例中，纳米螺旋阵列可以是形成在衬底上的GLAD，然后施加到集成电路。 在一个实施例中，纳米螺旋阵列可以是形成在集成电路上的GLAD。