摘要:
A method and an apparatus that uses a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without applying pure DI water to the wafer. In a second aspect, the method may clean a wafer by applying pure DI water to the wafer only for a short duration of time such that the DI water application ceases prior to or as soon as a surfactant solution is rinsed from the wafer thereafter the wafer is dried. In a further aspect a hydrophobic wafer is maintained wetted with surfactant as it is transferred between cleaning apparatuses and is rinsed via diluted surfactant or via a brief DI water spray and is thereafter dried.
摘要:
An improved method and apparatus for adjusting chemistry concentrations and temperatures within a substrate processing tank is provided. A first aspect may include checking the fluid level within the tank, and, if the level is higher than a predetermined upper level, bleeding an amount of fluid from the tank; if the level is lower than a predetermined lower level, flowing an amount of fluid to the tank, and if the level is between the predetermined upper and lower levels, bleeding an amount of fluid from the tank and flowing an amount of fluid to the tank. A second aspect may include flowing water into the tank at a flow rate at least equivalent to the flow rate of water required to achieve a chemistry spike of a predetermined concentration and volume prior to beginning the flow of chemicals. A third aspect may include a method and apparatus for heating or cooling chemistry to a predetermined temperature as the chemistry is recirculated.
摘要:
An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
摘要:
The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.
摘要:
A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.
摘要:
A sonic cleaning tank is provided that transmits energy from a side-wall-mounted transducer, parallel to a wafer, and reflects the sonic energy out of the plane of the wafer via an angled side wall positioned on the side of the wafer opposite the transducer. The angled side wall preferably forms a vertical V. Internal partitions may be optionally employed to partition reflected energy from the wafer. By configuring the relative angles and positions of tank walls and internal partitions, the path of reflected energy is advantageously controlled. Multiple reflections ensure that any reflected energy which impacts the wafer is sufficiently attenuated so as not to interfere with wafer cleaning.
摘要:
An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include de-ionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
摘要:
A method of removing liquid on a substrate, the method comprising the steps of placing the substrate in a fluid reservoir having a surface level, maintaining a partial pressure of vapor over the fluid surface level, lowering the fluid surface level of the reservoir while adding fluid, whereby the liquid flows off the substrate, and holding the substrate at different holding points, while lowering the fluid surface level so that the lowering surface level does not pass across a holding point that is being used to hold the substrate.
摘要:
An improved particle monitoring sensor is described which uses a variety of techniques to prolong the effective life of the optical surfaces within the particle monitoring'sensor. Substantially inert purging gas is directed over the particle monitoring sensor windows, which are normally exposed to a harsh operating environment. The surfaces of these windows are heated by heating elements in direct thermal contact with the windows. In addition, a restrictive slit is placed over the detector window to reduce the exposed area and to increase the velocity of gas flowing over the window surface. While this slit reduces the detector's field of view, the signal loss is reduced by using a linearly polarized light source and aligning the elongated slit's major axis with the direction of polarization.
摘要:
A particle monitor for a processing chamber exhaust line is disclosed which incorporates exhaust line heating, purge gas flow over surfaces such as optical windows in the exhaust gas line, and a thermally and electrically insulating particle monitor mounting arrangement. The features collectively protect the particle monitor from electrical disturbance and from the heated inlet and maintain the optical surfaces clean and free of depositions from the exhaust gas flow for an extended period. The arrangement also suppresses etching of the optical surfaces.