-
公开(公告)号：US08042935B2
公开(公告)日：2011-10-25
申请号：US12647602
申请日：2009-12-28
CPC分类号： B41J3/36 , B41J2/16535
摘要： Micro-fluid jetting devices and methods for ejecting fluid mixtures on a substrate are disclosed. Embodiments of the invention show fluid-flow architecture whereby fluid channels direct a plurality of fluids from their respective reservoirs to be ejected through the nozzles of a nozzle plate.
摘要翻译： 公开了用于在衬底上喷射流体混合物的微流体喷射装置和方法。 本发明的实施例示出了流体流动结构，其中流体通道将多个流体从其各自的储存器引导通过喷嘴板的喷嘴喷射。
-
公开(公告)号：US06613687B2
公开(公告)日：2003-09-02
申请号：US09820045
申请日：2001-03-28
申请人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
发明人： Brian Christopher Hart , James Michael Mrvos , Carl Edmond Sullivan , Gary Raymond Williams , Qing Ming Wang
IPC分类号： H01L21302
CPC分类号： B41J2/1628 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14411 , H01L21/31122
摘要： The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device. The method may be practiced without the use of more dangerous or hazardous wet chemical etching techniques which may provide undesirable undercutting of the metal oxide layers or may leave contaminants on the patterned metal oxide layers.
-
3.发明授权Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto 有权用于微流体喷射头的柔性粘合剂材料和与其相关的方法公开(公告)号：US07766455B2
公开(公告)日：2010-08-03
申请号：US11556246
申请日：2006-11-03
申请人： David Christopher Graham , Brian Christopher Hart , Gary Anthony Holt, Jr. , John William Krawczyk , Sean Terrence Weaver , Mary Claire Smoot
发明人： David Christopher Graham , Brian Christopher Hart , Gary Anthony Holt, Jr. , John William Krawczyk , Sean Terrence Weaver , Mary Claire Smoot
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/14072 , B41J2/1601
摘要： Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
摘要翻译： 提供微流体喷射头结构，制造具有改进的可操作性的微流体喷射头结构的方法，以及用于提高微流体喷射头结构的耐久性的方法。 一种这样的微流体喷射头结构包括具有基板的微流体喷射头和使用基底粘合剂与基底支撑件附近粘附地附接的喷嘴板组件。 喷嘴板用喷嘴板粘合剂粘附在基板附近。 热，UV或其它固化机构的密封剂材料邻近喷射头和基底支撑附着。 每个基底粘合剂和密封剂材料在固化后具有小于约2000MPa的杨氏模量，25℃下的剪切模量小于约15MPa，玻璃化转变温度低于约90MPa C。
-
公开(公告)号：US20100118070A1
公开(公告)日：2010-05-13
申请号：US12647602
申请日：2009-12-28
CPC分类号： B41J3/36 , B41J2/16535
摘要： Micro-fluid jetting devices and methods for ejecting fluid mixtures on a substrate are disclosed. Embodiments of the invention show fluid-flow architecture whereby fluid channels direct a plurality of fluids from their respective reservoirs to be ejected through the nozzles of a nozzle plate.
摘要翻译： 公开了用于在衬底上喷射流体混合物的微流体喷射装置和方法。 本发明的实施例示出了流体流动结构，其中流体通道将多个流体从其各自的储存器引导通过喷嘴板的喷嘴喷射。
-
公开(公告)号：US07673988B2
公开(公告)日：2010-03-09
申请号：US11378951
申请日：2006-03-17
CPC分类号： B41J3/36 , B41J2/16535
摘要： A micro-fluid jetting device and a method of ejecting fluid mixtures onto a substrate. The micro-fluid jetting device includes a housing containing a logic circuit and fluid reservoirs for at least two different fluids. A micro-fluid ejection head is attached to a first end of the housing. The ejection head is in electrical communication with the logic circuit and the fluid reservoirs. At least two channel members are provided for directing fluid from the reservoirs to a plurality of fluid ejection nozzles in a nozzle plate member. The ejection nozzles for each of the at least two different fluids are arranged in the nozzle plate member so that adjacent ejection nozzles are in flow communication with different fluids. A power source in electrical connection with the micro-fluid ejection head is provided in the housing for activating the micro-fluid ejection head for jetting the fluids therefrom.
摘要翻译： 微流体喷射装置和将流体混合物喷射到基底上的方法。 微流体喷射装置包括容纳逻辑电路的壳体和用于至少两种不同流体的流体储存器。 微流体喷射头附接到壳体的第一端。 喷射头与逻辑电路和流体储存器电连通。 提供至少两个通道构件用于将流体从储存器引导到喷嘴板构件中的多个流体喷射嘴。 用于至少两种不同流体中的每一种的喷嘴布置在喷嘴板构件中，使得相邻的喷嘴与不同的流体流动连通。 与微流体喷射头电连接的电源设置在壳体中，用于启动用于从其中喷射流体的微流体喷射头。
-
公开(公告)号：US06512198B2
公开(公告)日：2003-01-28
申请号：US09855347
申请日：2001-05-15
IPC分类号： B23K2602
CPC分类号： B41J2/1634 , B23K26/16 , B23K26/364 , B41J2/162
摘要： A method for forming a nozzle plate for an ink jet printer by laser ablation wherein topographical features are formed by laser ablation and additional ablation pulses are applied to remove debris from the nozzle plate.
-
7.发明授权Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer 有权用于喷墨打印机中的喷墨墨盒组件的胶带自动粘合电路公开(公告)号：US06402299B1
公开(公告)日：2002-06-11
申请号：US09425094
申请日：1999-10-22
IPC分类号： B41J214
CPC分类号： B41J2/14072 , B41J2/14016 , B41J2/14024
摘要： An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.
摘要翻译： 用于喷墨打印机的喷墨墨盒组件具有至少一个内部墨水室的主体。 打印头由主体承载并且具有与墨水室流体连通的多个喷墨孔。 由本体承载的胶带自动接合电路包括柔性带和多个电迹线。 柔性带包括具有外围边缘的芯片窗口。 打印头设置在芯片窗口内与外围边缘一段距离处。 每个电迹线具有邻近主体的底侧，由柔性带承载的基底保持部分，在芯片窗口的周边边缘和打印头之间延伸的自由迹线部分和与打印头连接的打印头保持部分。 带式自动接合电路还包括可光成像的涂层，其覆盖所有基板保持部分和自由迹线部分上的每个电迹线的底侧，但不覆盖打印头保持部分。
-
公开(公告)号：US06852241B2
公开(公告)日：2005-02-08
申请号：US09929849
申请日：2001-08-14
CPC分类号： B41J2/1645 , B41J2/1601 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1635 , Y10T29/49401
摘要： The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.
摘要翻译： 本发明提供了一种用于硅晶片中的喷砂槽的改进方法。 该方法包括：提供具有第一表面和第二表面的硅晶片，所述第一表面包含限定各个半导体部件的电阻，导电和绝缘层，施加选自硅烷，光致抗蚀剂材料的第一基本上永久的非水溶性层，以及 将硅烷层和光致抗蚀剂层组合到晶片的第一表面上以在其上提供第一基本上永久的层，向第一层施加水溶性保护材料以提供第二层，在晶片中的喷砂槽对应于 单独的半导体组件，随后从晶片上去除水溶性保护层。 保护层在喷砂处理过程中为硅晶片上的电气部件提供增强的保护，从而可以制造更高的可用半导体芯片的产量。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.014 秒)