公开(公告)号：US20100087067A1

公开(公告)日：2010-04-08

申请号：US12523560

申请日：2007-10-25

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun

IPC: H01L21/3205

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B-staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time.

Abstract translation: 提供了一种用于封装半导体的方法，以允许模具附着膏的均匀涂布，缩短B阶段时间，并提高模头拾取特性和模具附着特性。 该方法包括制备粘度为1500至100,000cps的模头附着膏; 旋转晶片并将晶片附着膏施加到晶片的上表面，形成预定厚度; 并且将施加在晶片上的糊料进行B分级。 该方法可以通过代替WBL（晶片背面层叠）膜，均匀地将晶片附着膏施加到晶片来降低成本，通过调节出料糊的粘度和剂量，自由地控制施加的芯片附着膏的厚度，并且速度 旋转涂布机，并且还通过减少B阶段时间缩短处理时间。

公开(公告)号：US07105625B2

公开(公告)日：2006-09-12

申请号：US10652667

申请日：2003-08-29

Applicant: Byoung Un Kang ,  Hyuk Soo Moon ,  Jong Kul Lee ,  Kyoung Tae Wi ,  Tae Sung Kim

Inventor： Byoung Un Kang ,  Hyuk Soo Moon ,  Jong Kul Lee ,  Kyoung Tae Wi ,  Tae Sung Kim

IPC: C07F7/08 ,  C07F7/10 ,  C08G59/14

CPC classification number: C08G59/306 ,  C08G59/3254 ,  C08G59/504 ,  C08L61/00 ,  C08L79/08 ,  C08L83/00 ,  C09J5/02 ,  C09J2400/123 ,  C09J2400/143 ,  C09J2400/163 ,  C09J2461/00 ,  C09J2479/00 ,  C09J2483/00 ,  H05K3/389

Abstract: The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

Abstract translation: 本发明涉及具有如表达式X 3 SiR 1 1的粘合强度相对较高的硅烷加成物及其制备方法。 其中X是选自环氧化合物，氨基化合物和双酚的一种氢化形式，R 1选自缩水甘油氧基丙基，2-（3,4-环氧环己基）乙基，3- 丙烯酰氧基丙基，3-甲基丙烯酰氧基丙基，氨基丙基，3- [2-（2-氨基乙基氨基）乙基氨基]丙基，N-甲基氨基丙基，N-苯基氨基丙基，N，N-二甲基-3-氨基丙基， 丙基，氰基丙基和异氰酸基 - 丙基。

公开(公告)号：US20050266249A1

公开(公告)日：2005-12-01

申请号：US10959016

申请日：2004-10-05

Applicant: Dongcheon Shin ,  Jeong-Il Byun ,  Jun-Hee Lee ,  Byoung-Un Kang ,  Kyung Lee

Inventor： Dongcheon Shin ,  Jeong-Il Byun ,  Jun-Hee Lee ,  Byoung-Un Kang ,  Kyung Lee

IPC: B32B15/08 ,  C08G63/685 ,  C08G65/40 ,  C08G73/06 ,  C08G73/10 ,  C08G75/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B37/12 ,  B32B2038/0076 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2377/00 ,  B32B2379/08 ,  C08G63/6856 ,  C08G73/0655 ,  C08G73/1085 ,  H05K1/0393 ,  H05K3/0023 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0759 ,  Y10T428/31522

Abstract: The present invention relates to a flexible metal clad laminate film and a manufacturing method for the same. The flexible metal clad laminate film of the present invention comprises a metal thin film; and a flexible insulating film formed by photo-crosslinking reaction of photoactive polymers having photoactive side chains, which may be crosslinked by photo-irradiation. The flexible metal clad laminate film of the present invention has good physical properties such as size stability, and is almost not deflected or twisted, since it includes the flexible insulating film composed of crosslinked resin formed by photo-crosslinking reaction of photoactive polymer.

Abstract translation: 本发明涉及挠性金属覆层叠膜及其制造方法。 本发明的柔性金属包覆层压膜包括金属薄膜; 以及通过具有光活性侧链的光活性聚合物的光交联反应形成的柔性绝缘膜，其可以通过光照射而交联。 本发明的柔性金属包覆层压膜由于具有由光活性聚合物的光交联反应形成的交联树脂构成的柔性绝缘膜，所以具有良好的物理性能，例如尺寸稳定性，并且几乎不发生偏转或扭曲。

公开(公告)号：US07768141B2

公开(公告)日：2010-08-03

申请号：US12279519

申请日：2007-02-14

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun ,  Byoung-Kwang Lee ,  Chan-Young Choi

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun ,  Byoung-Kwang Lee ,  Chan-Young Choi

IPC: H01L23/29

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract translation: 切割模附着膜包括附着在半导体晶片的一个表面上的管芯附着层; 连接到切割模具的切割膜层，用于将半导体晶片切割成模具单元; 以及层叠在芯片安装层和切割膜层之间的中间层。 中间层的模量为100〜3000MPa，大于模具安装层和切割膜层的模量。

公开(公告)号：US20090091044A1

公开(公告)日：2009-04-09

申请号：US12279519

申请日：2007-02-14

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun ,  Byoung-Kwang Lee ,  Chan-Young Choi

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Soon-Young Hyun ,  Byoung-Kwang Lee ,  Chan-Young Choi

IPC: H01L23/29 ,  H01L21/02

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract translation: 切割模附着膜包括附着在半导体晶片的一个表面上的管芯附着层; 连接到切割模具的切割膜层，用于将半导体晶片切割成模具单元; 以及层叠在芯片安装层和切割膜层之间的中间层。 中间层的模量为100〜3000MPa，大于模具安装层和切割膜层的模量。

公开(公告)号：US20090088527A1

公开(公告)日：2009-04-02

申请号：US12238634

申请日：2008-09-26

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

IPC: C08L63/00

CPC classification number: C08L21/00 ,  C08L15/00 ,  C08L63/00 ,  C08L2666/04 ,  C09J163/00 ,  H01L2924/0002 ,  C08L2666/14 ,  H01L2924/00

Abstract: The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.

Abstract translation: 本发明涉及一种半导体封装用贴剂组合物。 用于半导体封装的附着膏组合物包括混合树脂或作为基础树脂的弹性树脂和环氧树脂的共混物。 此时，碱性树脂优选包含50〜95重量％的弹性树脂和5〜50重量％的环氧树脂。 本发明能够实现使用模具粘合剂的常规半导体封装方法来消除在通过丝网印刷施加模具粘合剂之后执行的预干燥处理和在封装工艺之后进行的热硬化处理，保持模具粘合剂的性质确保 半导体产品的可靠性，实现了一个简单的过程。

公开(公告)号：US20070134847A1

公开(公告)日：2007-06-14

申请号：US11633132

申请日：2006-12-01

Applicant: Byoung-Un Kang ,  Jae-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jae-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Kyung-Tae Wi

IPC: H01L21/00

CPC classification number: C08F283/10 ,  C09J4/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00

Abstract: Disclosed are a die-attaching paste composition and a method for hardening the same. The present invention provides the die-attaching paste composition applied at a thickness of 200 μm or less on a printed circuit board (PCB), including liquid or solid epoxy, acrylate, a flexing agent, an organic filler and a UV-initiator. The method for hardening a die-attaching paste of the present invention includes carrying out a B-staging process by irradiating a UV-ray to the die-attaching paste composition. According to the present invention, a processing time may be more shortened and storage of the die-attaching paste may be more significantly improved when a B-staging process using UV rays is applied than when a conventional thermal crosslinking method is used, and therefore a manufacturing cost in the conventional assembly industries may be decreased. Also, the B-staging process may be uniformly carried out and physical properties of the die-attaching paste may be adjusted to desired characteristics since the UV exposure to the die-attaching paste is easily controlled.

Abstract translation: 公开了一种管芯贴附糊剂组合物及其硬化方法。 本发明提供了在包括液体或固体环氧树脂，丙烯酸酯，挠曲剂，有机填料和UV引发剂的印刷电路板（PCB）上以200μm或更小的厚度涂覆的管芯粘合膏组合物。 本发明的模具贴附膏的硬化方法包括通过对管芯贴附膏组合物照射紫外线进行B阶段化处理。 根据本发明，当使用使用紫外线的B阶段处理时，与使用常规的热交联方法相比，可以更加缩短处理时间，并且可以更显着地改善管芯贴附膏的存储，因此 常规装配行业的制造成本可能会降低。 此外，可以均匀地进行B阶段化处理，并且可以容易地控制对模具附着膏的UV曝光，从而可以将管芯贴附膏的物理性质调节到期望的特性。

公开(公告)号：US20070101877A1

公开(公告)日：2007-05-10

申请号：US11593186

申请日：2006-11-03

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Goo-Yun Chung ,  Seong-Hwan Jang ,  Tae-Kyu Im

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Kyung-Tae Wi ,  Jae-Hoon Kim ,  Tae-Hyun Sung ,  Goo-Yun Chung ,  Seong-Hwan Jang ,  Tae-Kyu Im

IPC: B05C17/06

CPC classification number: H05K3/1225 ,  B41M1/12 ,  B41N1/247 ,  B41P2215/50

Abstract: A dual printing mask is used for coating a die adhering paste of a predetermined pattern on a substrate uniformly during a semiconductor packaging process. This dual printing mask includes a metal mask layer having a predetermined pattern of openings so as to receive a paste for adhering a semiconductor die onto a substrate, and a mesh layer integrally attached on the metal mask layer.

Abstract translation: 双面印刷掩模用于在半导体封装工艺期间均匀地涂布预定图案的芯片粘附浆料。 该双面印刷掩模包括具有预定图案的开口的金属掩模层，以便接收用于将半导体管芯粘附到基板上的糊料，以及一体地附着在金属掩模层上的网格层。

公开(公告)号：US07553701B2

公开(公告)日：2009-06-30

申请号：US12195991

申请日：2008-08-21

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Soon-Young Hyun ,  Ji-Eun Kim ,  Jun-Woo Lee ,  Ju-Hyuk Kim

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Soon-Young Hyun ,  Ji-Eun Kim ,  Jun-Woo Lee ,  Ju-Hyuk Kim

IPC: H01L21/00

CPC classification number: H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/48247 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract translation: 本发明涉及一种半导体封装方法。 该方法包括（S1）通过丝网印刷将模具粘合剂施加到构件的上表面; （S2）对具有模具粘合剂的部件进行B阶固化; （S3）在B阶固化模具粘合剂上附着模具; （S4）将模具引线接合到构件上; 和（S5）封装所得物的外部，在步骤S2的B阶段固化处理之后，模具粘合剂的固化程度显示出80〜100％的热容量降低，并且步骤S3如此进行 模具粘合剂在模具附着后在常温下保持10kgf / cm 2以上的粘合强度。

公开(公告)号：US20090053857A1

公开(公告)日：2009-02-26

申请号：US12195991

申请日：2008-08-21

Applicant: Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Soon-Young Hyun ,  Ji-Eun Kim ,  Jun-Woo Lee ,  Ju-Hyuk Kim

Inventor： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Soon-Young Hyun ,  Ji-Eun Kim ,  Jun-Woo Lee ,  Ju-Hyuk Kim

IPC: H01L21/50

CPC classification number: H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/48247 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract translation: 本发明涉及一种半导体封装方法。 该方法包括（S1）通过丝网印刷将模具粘合剂施加到构件的上表面; （S2）对具有模具粘合剂的部件进行B阶固化; （S3）在B阶固化模具粘合剂上附着模具; （S4）将模具引线接合到构件上; 和（S5）封装所得物的外部，在步骤S2的B阶段固化处理之后，模具粘合剂的固化程度显示出80〜100％的热容量降低，并且步骤S3如此进行 模具粘合剂在模具附着后在常温下保持10kgf / cm 2以上的粘合强度。