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公开(公告)号:US20070062028A1
公开(公告)日:2007-03-22
申请号:US11469170
申请日:2006-08-31
申请人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
发明人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
CPC分类号: G11B5/39 , G11B5/40 , Y10T29/49021 , Y10T29/49036 , Y10T29/49041 , Y10T29/49048
摘要: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.
摘要翻译: 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面(TBS)的边缘的边缘。 然后,例如通过研磨,形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。
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公开(公告)号:US20050124141A1
公开(公告)日:2005-06-09
申请号:US11036148
申请日:2005-01-14
申请人: Annayya Deshpande , Calvin Lo , Kevin Luong , Artemio Torres
发明人: Annayya Deshpande , Calvin Lo , Kevin Luong , Artemio Torres
CPC分类号: B28D5/022
摘要: A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
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公开(公告)号:US20070094866A1
公开(公告)日:2007-05-03
申请号:US11559311
申请日:2006-11-13
申请人: Robert Biskeborn , Annayya Deshpande , Calvin Lo , Kevin Luong , Abel Taina , Artemio-Juan Torres
发明人: Robert Biskeborn , Annayya Deshpande , Calvin Lo , Kevin Luong , Abel Taina , Artemio-Juan Torres
IPC分类号: G11B5/127
CPC分类号: G11B5/3173 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B5/584 , G11B5/588 , Y10T29/49021 , Y10T29/49032 , Y10T29/49044 , Y10T29/53165
摘要: A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. Various embodiments of the present invention provide an apparatus and method for attaching a thin film head to a beam. Other embodiments of the present invention include a system, method and apparatus for dicing a thin film head on a wafer.
摘要翻译: 提供了多种装置和方法来改善薄磁头的制造和操作特性。 本发明的各种实施例提供了一种用于将薄膜头附接到梁的装置和方法。 本发明的其它实施例包括用于在薄片上切割薄膜头的系统,方法和装置。
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公开(公告)号:US20050122631A1
公开(公告)日:2005-06-09
申请号:US10727788
申请日:2003-12-03
申请人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
发明人: Robert Biskeborn , Luis Borja , Calvin Lo , Kevin Luong , Sassan Shahidi
CPC分类号: G11B5/39 , G11B5/40 , Y10T29/49021 , Y10T29/49036 , Y10T29/49041 , Y10T29/49048
摘要: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.
摘要翻译: 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面(TBS)的边缘的边缘。 然后,例如通过研磨,形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。
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公开(公告)号:US20070047141A1
公开(公告)日:2007-03-01
申请号:US11213365
申请日:2005-08-26
申请人: Robert Biskeborn , Jason Liang , Calvin Lo
发明人: Robert Biskeborn , Jason Liang , Calvin Lo
IPC分类号: G11B5/11
CPC分类号: G11B5/00826 , G11B5/10 , G11B5/1871 , G11B5/255 , G11B5/3106 , G11B5/40 , G11B5/60
摘要: A magnetic head includes a substrate having a first tape bearing surface and a second (outrigger) tape bearing surface, preferably with a slot therebetween. A plurality of elements (readers and/or writers) are coupled to the substrate and positioned towards the first tape bearing surface. The first and second tape bearing surfaces lie along planes, the planes being offset from one another spatially and/or angularly. The second tape bearing surface, like typical flat profile heads, induces a small spacing between a tape passing thereover and its tape bearing surface. The second tape bearing surface is positioned below the plane of the first tape bearing surface, thereby creating the proper wrap angle of the tape relative to the first tape bearing surface.
摘要翻译: 磁头包括具有第一带支承表面和第二(外伸支架)带支承表面的基底,优选地在其之间具有狭槽。 多个元件(读取器和/或写入器)耦合到基板并且朝向第一带承载表面定位。 第一和第二带承载表面位于平面之间,平面在空间和/或角度上彼此偏移。 第二个带状承载表面,像典型的平头型头,在通过其的胶带与其带轴承表面之间产生一个很小的间距。 第二带承载表面位于第一带承载表面的平面的下方,从而产生带相对于第一带承载表面的适当的包裹角度。
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公开(公告)号:US20070047146A1
公开(公告)日:2007-03-01
申请号:US11213548
申请日:2005-08-26
申请人: Robert Biskeborn , Calvin Lo
发明人: Robert Biskeborn , Calvin Lo
IPC分类号: G11B5/48
CPC分类号: G11B5/00826 , G11B5/4893
摘要: A magnetic head includes a first array of elements associated with a first data format and a second array of elements associated with a second data format, the elements being selected from a group consisting of readers, writers, and combinations thereof. The first and second arrays of elements are adjacent each other in a direction transverse to a direction of travel of a magnetic medium over the head.
摘要翻译: 磁头包括与第一数据格式相关联的元件的第一阵列和与第二数据格式相关联的元件的第二阵列,所述元件选自由读取器,写入器及其组合组成的组。 元件的第一和第二阵列在横向于头上的磁性介质的行进方向的方向上彼此相邻。
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