Abstract:
A circuit has a first circuit module including a first resistor and first and second transistors coupled in parallel with the first resistor. The first resistor and the first and second transistors are coupled together at a first node. An equivalent resistance across the first circuit module increases as a voltage of the first node is increased from a first voltage to a second voltage, and the equivalent resistance across the first circuit module decreases as the voltage of the first node is increased from the second voltage to a third voltage.
Abstract:
A driver includes a first driver stage having at least one input node and at least one first output node. The first driver stage includes a T-coil structure that is disposed adjacent to the at least one first output node. The T-coil structure includes a first set of inductors each being operable to provide a first inductance. A second set of inductors are electrically coupled with the first set of inductors in a parallel fashion. The second set of inductors each are operable to provide a second inductance. A second driver stage is electrically coupled with the first driver stage.
Abstract:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. The at least one transistor includes a first gate dielectric structure disposed over a substrate. A work-function metallic layer is disposed over the first gate dielectric structure. A conductive layer is disposed over the work-function metallic layer. A source/drain (S/D) region is disposed adjacent to each sidewall of the first gate dielectric structure. At least one resistor structure is formed over the substrate. The at least one resistor structure includes a first doped semiconductor layer disposed over the substrate. The at least one resistor structure does not include any work-function metallic layer between the first doped semiconductor layer and the substrate.
Abstract:
A circuit includes a capacitive-load voltage controlled oscillator having an input configured to receive a first input signal and an output configured to output an oscillating output signal. A calibration circuit is coupled to the voltage controlled oscillator and is configured to output one or more control signals to the capacitive-load voltage controlled oscillator for adjusting a frequency of the oscillating output signal. The calibration circuit is configured to output the one or more control signals in response to a comparison of an input voltage to at least one reference voltage.
Abstract:
Some aspects of the present disclosure provide for a method of automatically balancing mask misalignment for multiple patterning layers to minimize the consequences of mask misalignment. In some embodiments, the method defines a routing grid for one or more double patterning layers within an IC layout. The routing grid has a plurality of vertical grid lines extending along a first direction and a plurality of horizontal grid lines extending along a second, orthogonal direction. Alternating lines of the routing grid in a given direction (e.g., the horizontal and vertical direction) are assigned different colors. Shapes on the double patterning layers are then routed along the routing grid in a manner that alternates between different colored grid lines. By routing in such a manner, variations in capacitive coupling caused by mask misalignment are reduced.
Abstract:
The present disclosure relates to a resonant clock system having a driver component, a clock load capacitor, and a reconfigurable inductor array. The driver component generates a driven input signal. The clock load capacitor is configured to receive the driven input signal. The inductor array is configured to have an effective inductance according to a selected frequency. The inductor array also generates a resonant signal at the selected frequency using the effective inductance.
Abstract:
A current generator includes an op-amp having a negative terminal arranged to be coupled to an input voltage, a resistance selection circuit having at least one tunable resistor connected with each other, and at least one power transistor. A gate of the at least one power transistor is coupled to an output of the op-amp, and a drain of the at least one power transistor is coupled to the at least one tunable resistor or a load. The resistance selection circuit is configured to select a node of the at least one tunable resistor based on the input voltage for coupling from a positive terminal of the op-amp. The at least one tunable resistor is configured to adjust a resistance setting to control a current level of the current generator based on a power supply voltage or a current of a reference resistor.
Abstract:
Mechanisms for providing linear relationship between temperatures and digital codes are disclosed. In one method, at a particular temperature, a circuit in the sensor provides a temperature dependent reference voltage, and a compared voltage, to a comparator. The temperature dependent reference voltage depends on temperature in complement to absolute temperature or alternatively depends on temperature in proportion to absolute temperature. The compared voltage is generated corresponding to digital analog converter (DAC) codes as inputs. Another circuit varies the DAC codes until the temperature dependent reference voltage and the compared voltage are equal so that the dependent reference voltage corresponds to a DAC code. The various temperatures experienced by the temperature sensing circuit and the DAC codes are substantially linearly related.
Abstract:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer.
Abstract:
A Decision Feedback Equalizer (DFE) with programmable taps includes a summer configured to receive a DFE input signal. Delay elements are coupled to the summer. The delay elements are connected in series. Each delay element provides a respective delayed signal of an input signal to the delay element. A weight generator is configured to provide tap weights. The DFE is configured to multiply each tap weight to the respective delayed signal from the respective delay element to provide tap outputs. Each tap output is selectively enabled to be added to the summer or disabled based on a first comparison of a first threshold value and each impulse response or each tap weight corresponding to the respective tap output, where the impulse response is the DFE input signal in response to a pulse signal transmitted through a channel.